Patents by Inventor Seung-Hoon Oh
Seung-Hoon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230129923Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.Type: ApplicationFiled: October 24, 2022Publication date: April 27, 2023Applicant: SEMES CO., LTD.Inventors: Jin Woo JUNG, Jin Mo JAE, Sang Min LEE, Young Hun LEE, Yong Hyun CHOI, Yong Joon IM, Seung Hoon OH
-
Patent number: 11597653Abstract: Disclosed are a hybrid structure using a graphene-carbon nanotube and a perovskite solar cell using the same. The hybrid structure includes a graphene-carbon nanotube formed by laminating a second graphene coated with a polymer on an upper surface of a first graphene coated with a carbon nanotube. The perovskite solar cell includes: a substrate; a first electrode formed on the substrate and including a fluorine doped thin oxide (FTO); an electron transfer layer formed on the first electrode and including a compact-titanium oxide (c-TiO2); a mesoporous-titanium oxide (m-TiO2) formed on the electron transfer layer; a perovskite layer formed on the m-TiO2 and including a perovskite compound; and a graphene-carbon nanotube hybrid structure formed on the perovskite layer.Type: GrantFiled: July 29, 2020Date of Patent: March 7, 2023Assignee: Pusan National University Industry-University Cooperation FoundationInventors: Hyung Woo Lee, Soon Kyu Hong, Chae Young Woo, Yeong Su Jo, Sung Min Kim, Luhe Li, Seung hoon Oh, Yeonggwon Kim
-
Patent number: 11594421Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.Type: GrantFiled: September 24, 2020Date of Patent: February 28, 2023Assignee: SEMES CO., LTD.Inventors: Youngil Lee, Jungbong Choi, Seungho Lee, Gui Su Park, Gil Hun Song, Seung Hoon Oh, Jonghan Kim
-
Publication number: 20230035940Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.Type: ApplicationFiled: July 27, 2022Publication date: February 2, 2023Applicant: SEMES CO., LTD.Inventors: Jong Doo LEE, Seung Hoon OH, Jin Mo JAE, Ki Bong KIM, Young Hun LEE
-
Publication number: 20220390172Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a drying fluid to the inner space; and a fluid exhaust unit configured to exhaust the drying fluid from the inner space, and wherein the fluid exhaust unit includes an exhaust line connected to the chamber; a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space at a set pressure; and a heating member installed at the pressure adjusting member or a back end of the pressure adjusting member.Type: ApplicationFiled: May 27, 2022Publication date: December 8, 2022Applicant: SEMES CO., LTD.Inventors: Jin Mo JAE, Seung Hoon OH
-
Patent number: 11511321Abstract: A substrate processing method includes forming a high surface tension liquid film by supplying high surface tension liquid on a substrate surface, replacing the high surface tension liquid film with low surface tension liquid by supplying the low surface tension liquid to a center area of a substrate so that the low surface tension liquid impinges on the high surface tension liquid film formed on the center area of the substrate, and supplying high surface tension liquid for a predetermined period of time during the supplying the low surface tension liquid.Type: GrantFiled: October 23, 2019Date of Patent: November 29, 2022Assignee: SEMES CO., LTD.Inventors: Young Jin Kim, Jin Tack Yu, Bu Young Jung, Byung Sun Bang, Seung Hoon Oh, Young Jun Choi, Jong Hyeon Woo
-
Publication number: 20220305536Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.Type: ApplicationFiled: February 8, 2022Publication date: September 29, 2022Applicant: SEMES CO., LTD.Inventors: Sang Min LEE, Seung Hoon OH, Yong Joon IM, Hyo Won YANG
-
Publication number: 20220205718Abstract: An apparatus for treating the substrate includes a process chamber having a first body and a second body which are combined with each other to have a treating space in which a substrate is treated, and a friction prevention member placed on a contact surface between the first body and the second body. The friction prevention member may have a groove formed at a surface corresponding to the contact surface. An adhesive for adhering the friction prevention member to the first body or adhering the friction prevention member to the second body may be provided in the groove. The groove may form an open-end pattern in which a first end of the open-end pattern is adjacent to a second end of the open-end pattern.Type: ApplicationFiled: December 29, 2021Publication date: June 30, 2022Applicant: SEMES CO., LTD.Inventors: SANG MIN LEE, SEUNG HOON OH, JONG DOO LEE, MI SO PARK
-
Publication number: 20220186379Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.Type: ApplicationFiled: October 18, 2021Publication date: June 16, 2022Applicant: SEMES CO., LTD.Inventors: Jin Mo JAE, Seung Hoon OH, Young Seop CHOI, Mi So PARK, Jong Hyeon WOO
-
Patent number: 11361962Abstract: An embodiment of the present invention provides a substrate processing method. The substrate processing method, which performs a liquid processing process by injecting a processing liquid on a substrate on a spin chuck disposed inside a plurality of recovery cups that are disposed in multiple layers, includes: in a transitional period of time in which height change of any one of the recovery cups occurs, adjusting rotational speed of the spin chuck, which is configured to support the substrate, in conjunction with the height change of the recovery cup.Type: GrantFiled: November 4, 2019Date of Patent: June 14, 2022Assignee: SEMES CO., LTD.Inventors: Seung Hoon Oh, Jin Tack Yu, Bu Young Jung, Byung Sun Bang, Young Jin Kim, Young Jun Choi, Jong Hyeon Woo
-
Publication number: 20220178446Abstract: A sealing member for use in sealing a chamber for treating a substrate, the sealing member inserted in a groove formed in the chamber, includes a bottom part, a top part opposite the bottom part, an inner part connecting a first side of the bottom part to the top part, an outer part opposite the inner part and connecting a second side of the bottom part to the top part, and a recessed portion between the top part and the outer part.Type: ApplicationFiled: December 8, 2021Publication date: June 9, 2022Applicant: SEMES CO., LTD.Inventors: SEUNG HOON OH, SANG MIN LEE, JONG DOO LEE, JIN MO JAE, YOUNG HUN LEE
-
Publication number: 20220088644Abstract: A unit for removing an adhesive layer formed in a processing chamber includes an ultrasonic generator, and a wiper soaked in a cleaning liquid. The wiper is provided to surround the ultrasonic generator.Type: ApplicationFiled: September 23, 2021Publication date: March 24, 2022Applicant: SEMES CO., LTD.Inventors: SEUNG HOON OH, JIN MO JAE, HWAN BIN KIM
-
Publication number: 20210050235Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.Type: ApplicationFiled: August 6, 2020Publication date: February 18, 2021Applicant: SEMES CO., LTD.Inventors: Kangseop YUN, Seung Hoon OH, Ye Jin CHOI, Youngil LEE, Byungsun BANG, Jungbong CHOI, Gui Su PARK
-
Publication number: 20210008606Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.Type: ApplicationFiled: July 9, 2020Publication date: January 14, 2021Applicant: SEMES CO., LTD.Inventors: Inhwang PARK, Gui Su PARK, Young Hun LEE, Youngseop CHOI, Seung Hoon OH, Jonghyeon WOO, Jin Mo JAE
-
Publication number: 20210013047Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.Type: ApplicationFiled: September 24, 2020Publication date: January 14, 2021Inventors: Youngil LEE, Jungbong CHOI, Seungho LEE, Gui Su PARK, Gil Hun SONG, Seung Hoon OH, Jonghan KIM
-
Publication number: 20200402836Abstract: An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.Type: ApplicationFiled: June 19, 2020Publication date: December 24, 2020Applicant: SEMES CO., LTD.Inventors: Inhwang PARK, Gui Su PARK, Young Hun LEE, Youngseop CHOI, Seung Hoon OH, Jonghyeon WOO, Jin Mo JAE
-
Publication number: 20200395228Abstract: A substrate treatment apparatus of The present disclosure includes: a tube connecting a storage tank in which a chemical liquid is stored and an outlet through which the chemical liquid is discharged; a venturi nozzle installed in the tube and including a chemical liquid discharge part configured to discharge to an object; and a first negative pressure control valve installed between the venturi nozzle and the outlet in the tube, wherein, when the first negative pressure control valve is opened, negative pressure is generated in the venturi nozzle to limit discharge of the chemical liquid from the chemical liquid discharge part.Type: ApplicationFiled: June 15, 2020Publication date: December 17, 2020Applicant: SEMES CO., LTD.Inventors: Seung Hoon OH, Young Jin KIM, Byung Sun BANG, Bu Young JUNG, Young Hun LEE, Gui Su PARK
-
Publication number: 20200144054Abstract: An embodiment of the present invention provides a substrate processing method. The substrate processing method, which performs a liquid processing process by injecting a processing liquid on a substrate on a spin chuck disposed inside a plurality of recovery cups that are disposed in multiple layers, includes: in a transitional period of time in which height change of any one of the recovery cups occurs, adjusting rotational speed of the spin chuck, which is configured to support the substrate, in conjunction with the height change of the recovery cup.Type: ApplicationFiled: November 4, 2019Publication date: May 7, 2020Inventors: Seung Hoon OH, Jin Tack YU, Bu Young JUNG, Byung Sun BANG, Young Jin KIM, Young Jun CHOI, Jong Hyeon WOO
-
Publication number: 20200130025Abstract: A substrate processing method includes forming a high surface tension liquid film by supplying high surface tension liquid on a substrate surface, replacing the high surface tension liquid film with low surface tension liquid by supplying the low surface tension liquid to a center area of a substrate so that the low surface tension liquid impinges on the high surface tension liquid film formed on the center area of the substrate, and supplying high surface tension liquid for a predetermined period of time during the supplying the low surface tension liquid.Type: ApplicationFiled: October 23, 2019Publication date: April 30, 2020Inventors: Young Jin KIM, Jin Tack YU, Bu Young JUNG, Byung Sun BANG, Seung Hoon OH, Young Jun CHOI, Jong Hyeon WOO
-
Patent number: 10406510Abstract: This invention relates to a hydrogen spillover-based catalyst and use thereof, wherein a hydrogen activation metal cluster is dispersed in the form of being encapsulated in a crystalline or amorphous aluminosilicate matrix which is partially or fully structurally collapsed zeolite, thereby exhibiting high hydroprocessing or dehydrogenation activity and suppressed C—C hydrogenolysis activity.Type: GrantFiled: October 26, 2018Date of Patent: September 10, 2019Assignees: SK INNOVATION CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Min Kee Choi, Ju Hwan Im, Do Woan Kim, Do Kyoung Kim, Tae Jin Kim, Seung Hoon Oh, Tae Hong Seok