Patents by Inventor Seung-Hun Han

Seung-Hun Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230079166
    Abstract: In a gas-barrier aluminum deposition film according to one embodiment of the present invention, a seed coating layer containing functional groups of at least one type selected from among a hydroxyl group (—OH), an amine group (—NH), and a carboxylic acid group (—COOH) is formed on a thermoplastic plastic base film to form a seed molecular layer that enables uniform deposition of aluminum, such as AlOx or AlNx, through chemical reaction, on a surface of the coating layer, with aluminum atoms vaporized at the initial stage of aluminum deposition, thereby inducing uniform deposition of an aluminum layer to be subsequently deposited. Therefore, it is possible to provide a deposited film having superior oxygen and water vapor barrier properties compared to existing aluminum deposition films.
    Type: Application
    Filed: November 5, 2020
    Publication date: March 16, 2023
    Inventors: Seung Hun HAN, Kil Joong KIM, In Seek CHUNG
  • Patent number: 11602926
    Abstract: A biaxially oriented polyester reflection film according to an embodiment of the present invention includes: a core layer having a plurality of voids, and containing homo-polyester, copolymer polyester, a resin incompatible with polyester, and inorganic particles; and a skin layer formed at least one surface of the core layer, and containing homo-polyester, copolymer polyester, and inorganic particles, wherein the biaxially oriented polyester reflection film is formed to have a plurality of light focusing structures, each of which has a concave center portion, and which are arranged in a grid pattern.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: March 14, 2023
    Assignee: TORAY ADVANCED MATERIALS KOREA INC.
    Inventors: Seung Hun Han, Kil Joong Kim, Gi Jeong Moon
  • Patent number: 11594374
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: February 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
  • Publication number: 20230016571
    Abstract: Disclosed herein are an apparatus and method for preventing a security threat to a virtual machine. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program is configured such that a hypervisor for virtualization in a host kernel executes a virtualization instruction corresponding to the service requested by a virtual machine of a host application and such that a hypervisor for monitoring interrupts the virtualization instruction in response to a security threat event occurring in the monitoring area of the hypervisor for virtualization and controls the process and thread of the host kernel. The hypervisor for monitoring is located in an area separate from the area in which the hypervisor for virtualization is located in the host kernel.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 19, 2023
    Inventors: Seung-Hun HAN, Seong-Joong KIM, Gak-Soo LIM, Byung-Joon KIM
  • Publication number: 20220394015
    Abstract: Disclosed herein are a method for establishing a remote work environment for ensuring the security of a user terminal for remote work and an apparatus using the method. The method, performed by the apparatus, includes acquiring media image creation information from a user; creating a certificate for VPN access based on the media image creation information and creating a media image using the media image creation information and the certificate for VPN access; and providing the media image to the user such that the user is able to create a medium for remote work. The user terminal for remote work is booted through the medium for remote work, thereby configuring a runtime environment for remote work in which security is ensured.
    Type: Application
    Filed: September 7, 2021
    Publication date: December 8, 2022
    Inventors: Seung-Hun HAN, Ju-Hyung SON, Tae-Ho NAM, Ara JO, Gak-Soo LIM, Byung-Joon KIM
  • Patent number: 11476826
    Abstract: A bulk acoustic wave resonator includes: a substrate; a membrane layer forming a cavity together with the substrate; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on a flat surface of the lower electrode; and an upper electrode covering a portion of the piezoelectric layer and exposing a side of the piezoelectric layer to air, wherein the piezoelectric layer includes a step portion extended from the side of the piezoelectric layer and disposed on the flat surface of the lower electrode.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: October 18, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Han, Dae Ho Kim, Yong Suk Kim, Seung Hun Han, Moon Chul Lee, Chang Hyun Lim, Sung Jun Lee, Sang Kee Yoon, Tae Yoon Kim, Sang Uk Son
  • Publication number: 20220208456
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.
    Type: Application
    Filed: June 3, 2021
    Publication date: June 30, 2022
    Inventors: Kyo Yeol LEE, Seung Hun HAN, Sang Wook LEE, Jung Min KIM, Jeong Ryeol KIM
  • Publication number: 20220208465
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.
    Type: Application
    Filed: September 7, 2021
    Publication date: June 30, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
  • Publication number: 20220208457
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.
    Type: Application
    Filed: August 26, 2021
    Publication date: June 30, 2022
    Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
  • Publication number: 20220208464
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.
    Type: Application
    Filed: September 3, 2021
    Publication date: June 30, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
  • Publication number: 20220177687
    Abstract: The present invention relates to a thermoplastic resin composition comprising: 100 parts by weight of a base resin comprising a first polymer obtained by graft polymerization of an aromatic vinyl-based monomer and a vinyl cyanide-based monomer to a diene-based rubber polymer, a second polymer comprising maleimide-based monomer units, maleic acid-based monomer units, and aromatic vinyl-based monomer units, and a third polymer comprising aromatic vinyl-based monomer units and vinyl cyanide-based monomer units; and 1 part by weight to 3 parts by weight of a fourth polymer comprising polyvinyl alcohol.
    Type: Application
    Filed: September 7, 2020
    Publication date: June 9, 2022
    Inventors: Jin Oh NAM, Seung Hun HAN, Seong Lyong KIM
  • Publication number: 20220103524
    Abstract: Disclosed herein are an apparatus and method for providing a remote work environment. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program performs Virtual Private Network (VPN) authentication in response to a request for remote access to a work network from a user terminal, performs user authentication in order to connect the user terminal that succeeds in VPN authentication to the work network, decrypts the encrypted user data area of the user terminal that is connected to the work network, and provides the remote work environment to the user terminal based on the user data area through the work network.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 31, 2022
    Inventors: Gak-Soo LIM, Sung-Jin KIM, Jung-Hwan KANG, Seung-Hun HAN, Byung-Joon KIM
  • Patent number: 11158589
    Abstract: A semiconductor device has a semiconductor chip region which contains a semiconductor chip and a first portion of a passivation film covering the semiconductor chip and a scribe line region which contains a second portion of the passivation film connected to the first portion of the passivation film, a first insulating film protruding from a distal end of the second portion of the passivation film, and at least a part of a first wiring. A first portion of the first insulating film is disposed along the distal end of the second portion of the passivation film, a second portion of the first insulating film protrudes laterally beyond the first portion of the first insulating film, and the first wiring protrudes laterally beyond the second portion of the first insulating film.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: October 26, 2021
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seung Hun Han, Yun Rae Cho, Nam Gyu Baek, Ae Nee Jang
  • Patent number: 11084921
    Abstract: The present invention relates to a thermoplastic resin composition, a method of preparing the same, and an injection-molded article including the same. More particularly, the present invention relates to a thermoplastic resin composition having superior vibration welding properties along with ABS-based resin-specific impact resistance, heat resistance, and the like due to inclusion of an ABS-based graft copolymer including a conjugated diene-based rubber polymer having an average particle diameter of 0.25 to 0.35 ?m; a rubber-modified graft copolymer including a diene-based rubber polymer having an average particle diameter of 0.6 to 10 ?m and prepared by continuous bulk polymerization; and a matrix resin, and an injection-molded article including the thermoplastic resin composition.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: August 10, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Dae San Jung, Seung Hun Han, Seong Lyong Kim
  • Publication number: 20210187924
    Abstract: A biaxially oriented polyester reflection film according to an embodiment of the present invention includes: a core layer having a plurality of voids, and containing homo-polyester, copolymer polyester, a resin incompatible with polyester, and inorganic particles; and a skin layer formed at least one surface of the core layer, and containing homo-polyester, copolymer polyester, and inorganic particles, wherein the biaxially oriented polyester reflection film is formed to have a plurality of light focusing structures, each of which has a concave center portion, and which are arranged in a grid pattern.
    Type: Application
    Filed: October 2, 2018
    Publication date: June 24, 2021
    Applicant: TORAY ADVANCED MATERIALS KOREA INC.
    Inventors: Seung Hun HAN, Kil Joong KIM, Gi Jeong MOON
  • Publication number: 20210189139
    Abstract: Disclosed is a microcapsule composed of a transparent capsule wall material and configured to contain therein color particles selected from among color magnetic pigment particles and color pigment particles, magnetically color-tunable particles, and a solvent, thus exhibiting a superior structural color expression effect compared to a conventional microcapsule, and realizing a full range of colors, thereby enabling use thereof as a print medium.
    Type: Application
    Filed: June 13, 2019
    Publication date: June 24, 2021
    Inventors: Seung Hun HAN, Jae Hyun JOO, Jiyoung RYU
  • Patent number: 11043689
    Abstract: An embodiment of the present invention provides an electrode assembly in which a first electrode having a first electrode coated region and a first electrode uncoated region, a separator, and a second electrode having a second electrode coated region and a second electrode uncoated region are stacked and wound around a winding axis, wherein the first electrode coated region may include a first substrate, a first small electrode portion including first active material layers formed on both surfaces of the first substrate, and a second small electrode portion including a first active material layer formed on the other surface of the first substrate in which one surface thereof is exposed, and the second small electrode portion may be positioned at a first curved portion formed by first winding of the electrode assembly.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: June 22, 2021
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Dongsik Yoon, Yiseop Ahn, Hoyong An, Junghyun Lee, Myungduk Lim, Hyesun Jung, Seung-Hun Han
  • Publication number: 20210146684
    Abstract: This disclosure relates to a printing device for printing or dispensing a curable printing composition which is capable of changing color in response to the application of a magnetic field in the non-cured state. The printing device may be a handheld device such as a portable pen. The present disclosure further relates to curable compositions, cartridges and methods which may be used in combination with the aforementioned printing devices or in other applications.
    Type: Application
    Filed: April 5, 2019
    Publication date: May 20, 2021
    Inventors: Seung Hun HAN, Jeongmi HA, Jin Sung CHA, Woo Yong JUNG, Jiyoung RYU, Jae Hyun JOO
  • Publication number: 20210143109
    Abstract: A semiconductor device in which reliability and production yield are improved by reducing or preventing the spreading of cracks that may occur in the die sawing process, and a method for fabricating the same are provided. The semiconductor device includes a substrate which includes a first chip region and a scribe lane region surrounding the first chip region, a first low-k insulating film, which includes a first insulating material having a dielectric constant lower than silicon oxide, on the substrate in the first chip region, a wiring structure, which includes a second low-k insulating film including the first insulating material and a first wiring pattern in the second low-k insulating film, on the substrate in the scribe lane region, and a first protective insulating film, which includes a second insulating material different from the first insulating material, between the first low-k insulating film and the wiring structure.
    Type: Application
    Filed: January 19, 2021
    Publication date: May 13, 2021
    Inventors: Yun Rae Cho, Ae Nee Jang, Seung Hun Han
  • Patent number: 10930602
    Abstract: A semiconductor device in which reliability and production yield are improved by reducing or preventing the spreading of cracks that may occur in the die sawing process, and a method for fabricating the same are provided. The semiconductor device includes a substrate which includes a first chip region and a scribe lane region surrounding the first chip region, a first low-k insulating film, which includes a first insulating material having a dielectric constant lower than silicon oxide, on the substrate in the first chip region, a wiring structure, which includes a second low-k insulating film including the first insulating material and a first wiring pattern in the second low-k insulating film, on the substrate in the scribe lane region, and a first protective insulating film, which includes a second insulating material different from the first insulating material, between the first low-k insulating film and the wiring structure.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 23, 2021
    Inventors: Yun Rae Cho, Ae Nee Jang, Seung Hun Han