Patents by Inventor Seung-Hun Han

Seung-Hun Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903011
    Abstract: A multilayer electronic component includes: a capacitor body including first and second internal electrodes disposed to be alternately exposed through opposite surfaces, respectively, with respective dielectric layers interposed therebetween; first and second thin film layers including at least one of titanium nitride (TiN), ruthenium (Ru), platinum (Pt), iridium (Ir), or titanium (Ti), disposed on the surfaces of the capacitor body, and connected to the first and second internal electrodes, respectively; and first and second external electrodes formed on the first and second thin film layers. A thickness of the first or second thin film layer is less than or equal to 60 nm.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hun Han, Sung Min Cho, Dong Joon Oh
  • Publication number: 20200350566
    Abstract: A rechargeable lithium battery includes a negative electrode including a negative current collector, a negative active material layer disposed on the negative current collector, and a negative electrode functional layer disposed on the negative active material layer; and positive electrode including a positive current collector and a positive active material layer disposed on the positive current collector, wherein the negative electrode functional layer includes flake-shaped polyethylene particles, the positive active material layer includes a first positive active material including at least one of a composite oxide of a metal selected from cobalt, manganese, nickel, and a combination thereof and lithium, a second positive active material including a compound represented by Chemical Formula 1, and carbon nanotubes, and the carbon nanotubes have an average length of 30 ?m to about 100 ?m. LiaFe1-x1Mx1PO4 ??[Chemical Formula 1] In Chemical Formula 1, 0.90?a?1.8, 0?x1?0.
    Type: Application
    Filed: April 30, 2020
    Publication date: November 5, 2020
    Inventors: Jaehwan HA, Kijun Kim, Junghyun Nam, Hoyong An, Heeeun Yoo, Yeonhee Yoon, Kyuseo Lee, Dongmyung Lee, Seung-Hun Han
  • Patent number: 10770232
    Abstract: A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hun Han, Sung Min Cho, Dong Joon Oh
  • Patent number: 10726996
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes with external electrodes disposed on one surface of the body, wherein the external electrodes include a first electrode layer disposed on one surface of the body, in contact with the internal electrodes, and including titanium nitride (TiN), and a second electrode layer disposed on the first electrode layer.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hun Han, Dong Joon Oh, Sung Min Cho, Chang Hak Choi, Seung Mo Lim, Woong Do Jung
  • Patent number: 10699845
    Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Suong Yang, Seung Hun Han, Sung Min Cho, Chang Soo Jang
  • Patent number: 10665393
    Abstract: A capacitor includes a support member included in a body, a plurality of pillars disposed in an upper portion of the support member and each having a lower portion wider than an upper portion, and a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween. Lower end portions of adjacent pillars are in contact with each other.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Dong Sik Yoo, Seung Hun Han, No Il Park, Seung Mo Lim, Hyun Ho Shin
  • Publication number: 20200126930
    Abstract: A semiconductor device in which reliability and production yield are improved by reducing or preventing the spreading of cracks that may occur in the die sawing process, and a method for fabricating the same are provided. The semiconductor device includes a substrate which includes a first chip region and a scribe lane region surrounding the first chip region, a first low-k insulating film, which includes a first insulating material having a dielectric constant lower than silicon oxide, on the substrate in the first chip region, a wiring structure, which includes a second low-k insulating film including the first insulating material and a first wiring pattern in the second low-k insulating film, on the substrate in the scribe lane region, and a first protective insulating film, which includes a second insulating material different from the first insulating material, between the first low-k insulating film and the wiring structure.
    Type: Application
    Filed: July 16, 2019
    Publication date: April 23, 2020
    Inventors: Yun Rae Cho, Ae Nee Jang, Seung Hun Han
  • Publication number: 20200051932
    Abstract: A semiconductor device has a semiconductor chip region which contains a semiconductor chip and a first portion of a passivation film covering the semiconductor chip and a scribe line region which contains a second portion of the passivation film connected to the first portion of the passivation film, a first insulating film protruding from a distal end of the second portion of the passivation film, and at least a part of a first wiring. A first portion of the first insulating film is disposed along the distal end of the second portion of the passivation film, a second portion of the first insulating film protrudes laterally beyond the first portion of the first insulating film, and the first wiring protrudes laterally beyond the second portion of the first insulating film.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: SEUNG HUN HAN, YUN RAE CHO, NAM GYU BAEK, AE NEE JANG
  • Publication number: 20200035649
    Abstract: A semiconductor package includes a package substrate, a plurality of external connections under the package substrate, a master chip on the package substrate, at least one slave chip on the master chip, a plurality of first bumps and a plurality of second bumps between the package substrate and the master chip, and a plurality of wires connecting the package substrate to the at least one slave chip. The package substrate includes a plurality of first paths connecting the plurality of first bumps to the plurality of external connections and a plurality of second paths connecting the plurality of second bumps to the plurality of wires. An upper surface of the package substrate includes a first edge and a second edge that extend in a first direction and a third edge and a fourth edge that extend in a second direction.
    Type: Application
    Filed: April 5, 2019
    Publication date: January 30, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ae-nee JANG, Nam-gyu BAEK, Yun-rae CHO, Seung-hun HAN
  • Patent number: 10490356
    Abstract: A capacitor includes a body including a substrate and a capacitance layer disposed on the substrate. The substrate includes a plurality of first trenches penetrating from one surface of the substrate to an interior of the substrate, and a first capacitor layer disposed on the one surface of the substrate and in the first trenches. The first capacitor layer includes a first dielectric layer and first and second electrodes disposed on opposing sides thereof. The capacitance layer includes a plurality of second trenches penetrating from one surface of the capacitance layer to an interior of the capacitance layer, and a second capacitor layer disposed on the one surface of the capacitance layer and in the second trenches. The second capacitor layer includes a second dielectric layer and third and fourth electrodes disposed on opposing sides thereof. A method of manufacturing the capacitor is also provided.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 26, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Dong Sik Yoo, Seung Hun Han, No Il Park, Seung Mo Lim, Hyun Ho Shin
  • Patent number: 10439222
    Abstract: A positive electrode composition for a rechargeable lithium battery includes a positive active material, a binder, and an aqueous solvent, wherein the binder includes carboxylmethyl cellulose having an average polymerization degree of about 700 to about 1200, and a positive electrode for a rechargeable lithium battery and a rechargeable lithium battery including the same are provided.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 8, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Seung-Hun Han, Myung-Duk Lim, Chae-Woong Cho
  • Patent number: 10439210
    Abstract: In an aspect, a positive active material composition for a rechargeable lithium battery including a positive active material coated with a vanadium pentaoxide (V2O5) and an aqueous binder, a positive electrode including the same, and a rechargeable lithium battery including the positive electrode is disclosed.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: October 8, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Seung-Hun Han, Myung-Duk Lim, Chae-Woong Cho
  • Patent number: 10365939
    Abstract: A method and apparatus for providing an operating system based on a lightweight hypervisor. An electronic device includes a hypervisor, an operating system monitor, and a virtualized operating system. The hypervisor enables the virtualized operating system and a physical machine to share the resources of the physical machine. If the virtualized operating system accesses the resource, the operating system monitor determines whether to allow the access to the resource. Also, the operating system monitor verifies the integrity of the virtualized operating system and determines whether a threat to the virtualized operating system exists.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: July 30, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung-Hun Han, Jung-Hwan Kang, Wook Shin, Hyoung-Chun Kim
  • Patent number: 10364329
    Abstract: The present invention relates to a thermoplastic resin composition. More particularly, the present invention relates a thermoplastic resin composition including 100 parts by weight of a base resin including (a) an aromatic vinyl compound-conjugated diene-based compound-vinyl cyan compound copolymer and (b) an aromatic vinyl compound-vinyl cyan compound copolymer; and (c) greater than 0.05 parts by weight and less than 11 parts by weight of a polyolefin oxide-based triblock copolymer, and a molded article including the same. In accordance with the present invention, the thermoplastic resin composition having superior chemical resistance and paintability with identical or superior impact strength, fluidity, and heat resistance, to conventional thermoplastic resin compositions, and a molded article including the same are provided.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: July 30, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Seung Hun Han, Dae San Jung, Seong Lyong Kim, Hyun Ho Joo, Soo Kyeong Lee
  • Publication number: 20190229362
    Abstract: An embodiment of the present invention provides an electrode assembly in which a first electrode having a first electrode coated region and a first electrode uncoated region, a separator, and a second electrode having a second electrode coated region and a second electrode uncoated region are stacked and wound around a winding axis, wherein the first electrode coated region may include a first substrate, a first small electrode portion including first active material layers formed on both surfaces of the first substrate, and a second small electrode portion including a first active material layer formed on the other surface of the first substrate in which one surface thereof is exposed, and the second small electrode portion may be positioned at a first curved portion formed by first winding of the electrode assembly.
    Type: Application
    Filed: August 16, 2017
    Publication date: July 25, 2019
    Inventors: Dongsik YOON, Yiseop AHN, Hoyong AN, Junghyun LEE, Myungduk LIM, Hyesun JUNG, Seung-Hun HAN
  • Publication number: 20190177523
    Abstract: The present invention relates to a thermoplastic resin composition, a method of preparing the same, and an injection-molded article including the same. More particularly, the present invention relates to a thermoplastic resin composition having superior vibration welding properties along with ABS-based resin-specific impact resistance, heat resistance, and the like due to inclusion of an ABS-based graft copolymer including a conjugated diene-based rubber polymer having an average particle diameter of 0.25 to 0.35 ?m; a rubber-modified graft copolymer including a diene-based rubber polymer having an average particle diameter of 0.6 to 10 ?m and prepared by continuous bulk polymerization; and a matrix resin, and an injection-molded article including the thermoplastic resin composition.
    Type: Application
    Filed: November 29, 2017
    Publication date: June 13, 2019
    Inventors: Dae San JUNG, Seung Hun HAN, Seong Lyong KIM
  • Publication number: 20190157006
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes with external electrodes disposed on one surface of the body, wherein the external electrodes include a first electrode layer disposed on one surface of the body, in contact with the internal electrodes, and including titanium nitride (TiN), and a second electrode layer disposed on the first electrode layer.
    Type: Application
    Filed: September 6, 2018
    Publication date: May 23, 2019
    Inventors: Seung Hun HAN, Dong Joon OH, Sung Min CHO, Chang Hak CHOI, Seung Mo LIM, Woong Do JUNG
  • Publication number: 20190131069
    Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.
    Type: Application
    Filed: April 27, 2018
    Publication date: May 2, 2019
    Inventors: Jeong Suong Yang, Seung Hun Han, Sung Min Cho, Chang Soo Jang
  • Publication number: 20190123356
    Abstract: An electrode for a rechargeable lithium battery includes a current collector and an active material layer on the current collector, the active material layer including an active material and carbon nanotubes, and the carbon nanotubes having a Raman R value of about 0.8 to about 1.3 and an average length of about 40 ?m to about 250 ?m. The Raman R value refers to an intensity ratio R=Id/Ig obtained from a peak intensity (Ig) (G, about 1580 cm?1) and a peak intensity (Id) (D, about 1350 cm?1) in a Raman spectrum analysis.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 25, 2019
    Inventors: Youngsan KO, Minjae KIM, Kijun KIM, Dong-Ho SON, Woonsuk JANG, Seung-Hun HAN
  • Patent number: 10263992
    Abstract: A method for providing a browser using browser processes separated based on access privileges and an apparatus using the method. The method includes acquiring a first address corresponding to a first webpage; acquiring a first set of terminal access privileges based on the first address from a privilege control list and executing a first browser process corresponding to the first set of terminal access privileges; determining whether to allow rendering by comparing the first set of terminal access privileges with a second set of terminal access privileges corresponding to a second webpage when the first browser process attempts to render the second webpage; and if the rendering is not allowed, blocking the first browser process from rendering and rendering the second webpage by executing a second browser process corresponding to the second set of terminal access privileges.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: April 16, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Taeho Nam, Seung-hun Han, Jung-hwan Kang, Wook Shin, HyoungChun Kim, ByungJoon Kim, Sung-Jin Kim