Patents by Inventor Seung Hwan Kim

Seung Hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11764128
    Abstract: A semiconductor chip includes a body part having a front surface and a rear surface, a plurality of through electrodes penetrating the body part and arranged in a first direction in an array region, a plurality of front surface connection electrodes respectively coupled to the through electrodes over the front surface of the body part, and a plurality of rear surface connection electrodes respectively coupled to the through electrodes over the rear surface of the body part. The array region includes a central region and edge regions positioned on both sides of the central region in the first direction. A center of the front surface connection electrode and a center of the rear surface connection electrode that are positioned in each of the edge regions are positioned at a distance farther from the central region than a center of the corresponding through electrode.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: September 19, 2023
    Assignee: SK hynix Inc.
    Inventors: Seung Hwan Kim, Hyun Chul Seo, Hyeong Seok Choi, Moon Un Hyun
  • Publication number: 20230291934
    Abstract: An image encoding/decoding method and apparatus for signaling a VPS and a recording medium storing a bitstream are provided. An image decoding method may comprise obtaining first information indicating whether each output layer set (OLS) specified by a video parameter set (VPS) includes only one layer, obtaining second information indicating the number of decoded picture buffer (DPB) parameter syntax structures in the VPS, based on the first information, obtaining the DPB parameter syntax structures in the VPS based on the second information, and managing a DPB based on the DPB parameter syntax structures.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 14, 2023
    Inventors: Seethal PALURI, Hendry HENDRY, Seung Hwan KIM
  • Publication number: 20230291903
    Abstract: An image encoding/decoding method and apparatus are provided. The image decoding method performed by the image decoding apparatus, according to the present disclosure, may comprise the steps of: determining whether a color space transformation is applied to residual samples of a current block; determining quantization parameter of the current block on the basis of whether the color space transformation is applied; and determining a transformation coefficient of the current block on the basis of the quantization parameter. The step of determining the quantization parameter may be performed by limiting the range of an effective value of the quantization parameter such that a value of the quantization parameter has a value less than or equal to a predetermined upper value and greater than or equal to a predetermined lower value.
    Type: Application
    Filed: May 16, 2023
    Publication date: September 14, 2023
    Inventors: Jie ZHAO, Seung Hwan Kim, Hendry Hendry, Seethal Paluri
  • Publication number: 20230284434
    Abstract: A semiconductor device includes: a word line stack disposed over a lower structure and including a plurality of word lines stacked in a direction vertical to a surface of the lower structure; and pillar-shaped slits penetrating edge parts of the word lines and including an etch stopper.
    Type: Application
    Filed: September 30, 2022
    Publication date: September 7, 2023
    Inventors: Myoung Jin Kang, Seung Hwan Kim
  • Publication number: 20230283810
    Abstract: A method of encoding video data by a device is provided. Transform coefficient values associated with a chroma coding block are received. The chroma coding block is one of chroma coding blocks resulting from partitioning a chroma coding tree block and misaligned with a luma coding tree block corresponding to the chroma coding tree block and partitioned into luma coding blocks which are organized into quantization groups such that luma quantization parameters are determined for the luma coding tree block. One of the luma quantization parameters that is mapped to the chroma coding block is identified. A predictive quantization parameter is derived by using a value derived from the identified luma quantization parameter. A chroma quantization parameter is determined by adding a delta quantization parameter associated with each of the chroma coding blocks to the predictive quantization parameter. Level values are generated based on the determined chroma quantization parameter.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: JIE ZHAO, SEUNG-HWAN KIM, KIRAN MUKESH MISRA, CHRISTOPHER ANDREW SEGALL
  • Publication number: 20230276065
    Abstract: Provided is an image encoding/decoding method and apparatus. The image decoding method comprises obtaining subpicture information from a bitstream, deriving one or more subpictures in a current picture based on the subpicture information, and decoding a current subpicture in the current picture based on the subpicture information. The subpicture information may comprise a first flag specifying whether each of the one or more subpictures is treated as a picture, and, based on the bitstream including at least one first layer referring to a current layer including the current picture, the first flag for the first subpicture included in a first layer and corresponding to the current subpicture, and the first flag for the current subpicture have the same value.
    Type: Application
    Filed: March 31, 2021
    Publication date: August 31, 2023
    Inventors: Hendry HENDRY, Seung Hwan KIM, Seethal PALURI
  • Patent number: 11743469
    Abstract: Disclosed herein are an image encoding/decoding method and apparatus. An image decoding method performed by an image encoding apparatus may include acquiring size information indicating a size of a current slice corresponding to at least a portion of a current picture from a bitstream and determining the size of the current slice based on the size information.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: August 29, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Hendry Hendry, Seung Hwan Kim, Seethal Paluri
  • Publication number: 20230269570
    Abstract: An apparatus for a vehicle emergency call that makes an emergency call when a vehicle is rolled over. The apparatus for a vehicle emergency call includes: a longitude and latitude calculation unit configured to calculate longitude and latitude values of a positioning sensor; an altitude calculation unit configured to calculate a measured altitude; a rollover determination unit configured to determine whether the vehicle is rolled over; and a communication unit transmitting an emergency call message to an emergency rescue center.
    Type: Application
    Filed: December 8, 2022
    Publication date: August 24, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Seung Hwan KIM
  • Publication number: 20230269928
    Abstract: A method for fabricating a semiconductor device includes: forming a stack body by alternately stacking a plurality of semiconductor layers and a plurality of etch stopper layers over a substrate; forming a plurality of steps by etching a first portion of the stack body to stop at the etch stopper layer; forming a slit by etching a second portion of the stack body; replacing the etch stoppers of the steps with sacrificial dielectric layers through the slit; replacing the sacrificial dielectric layers with word lines; and forming contact plugs coupled to the word lines.
    Type: Application
    Filed: September 30, 2022
    Publication date: August 24, 2023
    Inventors: Hyewon YOON, Seung Hwan Kim
  • Publication number: 20230269929
    Abstract: A semiconductor device includes: a lower structure; an active layer over the lower structure; a bit line coupled to one side of the active layer and extending vertically from the lower structure; a data storage element coupled to another side of the active layer; a word line disposed adjacent to the active layer and extending in a direction crossing the active layer; and a capping layer disposed between the word line and the data storage element and including a trap-suppressing material in contact with the active layer.
    Type: Application
    Filed: October 26, 2022
    Publication date: August 24, 2023
    Inventors: Dong Il SONG, Seung Hwan Kim
  • Publication number: 20230262218
    Abstract: An image encoding/decoding method and device are provided. An image decoding method performed by an image decoding device according to the present disclosure may comprise the steps of: determining a prediction mode of the current block on the basis of prediction information obtained from a bitstream; on the basis of the prediction mode of the current block, obtaining a flag indicating whether a color space transform is applied to a residual sample of the current block; determining a quantization parameter of the current block on the basis of the flag; and determining a transform coefficient of the current block on the basis of the quantization parameter.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Inventors: Jie ZHAO, Seung Hwan KIM, Hendry HENDRY, Seethal PALURI
  • Patent number: 11716483
    Abstract: An image encoding/decoding method and apparatus are provided. An image decoding method performed by an image decoding apparatus may comprise parsing weight information specifying a weight for a reference sample from a bitstream according to a weight parameter syntax structure, and decoding a current block by performing inter prediction based on the weight information. The parsing according to the weight parameter syntax structure may comprise obtaining weight number information specifying the number of weight information obtained from the bitstream according to the weight parameter syntax structure and obtaining weight information from the weight parameter syntax structure based on the weight number information.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: August 1, 2023
    Assignee: LG Electronics Inc.
    Inventors: Seethal Paluri, Seung Hwan Kim, Jie Zhao
  • Patent number: 11706451
    Abstract: A system utilizing a high throughput coding mode for CABAC in HEVC is described. The system may include an electronic device configured to obtain a block of data to be encoded using an arithmetic based encoder; to generate a sequence of syntax elements using the obtained block; to compare an Absolute-3 value of the sequence or a parameter associated with the Absolute-3 value to a preset value; and to convert the Absolute-3 value to a codeword using a first code or a second code that is different than the first code, according to a result of the comparison.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: July 18, 2023
    Assignee: DOLBY INTERNATIONAL AB
    Inventors: Seung-Hwan Kim, Louis J. Kerofsky, Christopher A. Segall
  • Publication number: 20230223347
    Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 13, 2023
    Inventors: JONGHO PARK, Seung Hwan Kim, Jung Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
  • Publication number: 20230224470
    Abstract: An image encoding/decoding method and apparatus is provided. The image decoding method comprises determining whether first information specifying a value of a picture order count (POC) most significant bit (MSB) cycle of a current picture is present in a picture header, determining a POC MSB of the current picture based on whether the first information is present in the picture header, and deriving a POC of the current picture based on the determined POC MSB. Based on the first information being not present in the picture header and the current picture being not a CLVSS (coded layer video sequence start) picture, a POC difference between the current picture and a previous picture preceding the current picture in decoding order may be less than half a maximum value of a POC least significant bit (LSB) of the current picture.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Inventors: Hendry HENDRY, Hyeong Moon JANG, Jaehyun LIM, Nae Ri PARK, Seung Hwan KIM
  • Patent number: 11699626
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: July 11, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
  • Publication number: 20230217644
    Abstract: A semiconductor device may include a word line stack over a substrate; a plurality of supporters including vertically extending blocking spacers to support the word line stack; and storage nodes of a capacitor disposed laterally between the supporters.
    Type: Application
    Filed: June 20, 2022
    Publication date: July 6, 2023
    Inventor: Seung Hwan Kim
  • Publication number: 20230217645
    Abstract: A method for fabricating a semiconductor device includes: forming a stack body by alternately stacking a plurality of semiconductor layers and a plurality of sacrificial semiconductor layers over a lower structure; forming an opening by etching the stack body; forming a plurality of active layers and a plurality of lateral recesses by etching the semiconductor layers and the sacrificial semiconductor layers through the opening; forming sacrificial dielectric layers partially filling the lateral recesses and contacting the active layers; and replacing the sacrificial dielectric layers with word lines.
    Type: Application
    Filed: June 20, 2022
    Publication date: July 6, 2023
    Inventor: Seung Hwan KIM
  • Patent number: 11695929
    Abstract: An image encoding/decoding method and apparatus are provided. The image decoding method performed by the image decoding apparatus, according to the present disclosure, may comprise the steps of: determining whether a color space transformation is applied to residual samples of a current block; determining quantization parameter of the current block on the basis of whether the color space transformation is applied; and determining a transformation coefficient of the current block on the basis of the quantization parameter. The step of determining the quantization parameter may be performed by limiting the range of an effective value of the quantization parameter such that a value of the quantization parameter has a value less than or equal to a predetermined upper value and greater than or equal to a predetermined lower value.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: July 4, 2023
    Assignee: LG Electronics Inc.
    Inventors: Jie Zhao, Seung Hwan Kim, Hendry Hendry, Seethal Paluri
  • Patent number: 11695964
    Abstract: An image encoding/decoding method and apparatus for signaling a VPS and a recording medium storing a bitstream are provided. An image decoding method may comprise obtaining first information indicating whether each output layer set (OLS) specified by a video parameter set (VPS) includes only one layer, obtaining second information indicating the number of decoded picture buffer (DPB) parameter syntax structures in the VPS, based on the first information, obtaining the DPB parameter syntax structures in the VPS based on the second information, and managing a DPB based on the DPB parameter syntax structures.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: July 4, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Seethal Paluri, Hendry Hendry, Seung Hwan Kim