Patents by Inventor Seung Hyun Hong

Seung Hyun Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11252812
    Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Seung Hyun Hong, Jang Hyun Kim
  • Patent number: 11215251
    Abstract: The present disclosure relates a brake disc and a method of manufacturing the same, in which the depth of the coating layer containing a nitride is adjustable and corrosion resistance and wear resistance can be improved. A brake disc according to an embodiment of the present disclosure includes: a disc base material made of gray cast iron; and a coating layer formed on a surface of the disc base material and including a nitride produced as nitrogen is diffused into a ferrite matrix structure.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: January 4, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Soon Woo Kwon, Chung An Lee, Min Woo Kang, Seung Hyun Hong
  • Publication number: 20210407094
    Abstract: An apparatus and a method for segmenting a steel microstructure phase are provided. The apparatus includes a storage configured for storing a machine learning algorithm and a processing device that segments a microstructure phase using the machine learning algorithm. The processing device is configured to receive label data, to learn a machine learning model by use of the label data as learning data for the machine learning model, and to segment a phase of a steel microstructure image by use of the learned machine learning model.
    Type: Application
    Filed: April 14, 2021
    Publication date: December 30, 2021
    Inventors: Min Woo KANG, Soon Woo KWON, Chung An LEE, Hyun Ki KIM, Seung Hyun HONG, Jun Yun KANG
  • Publication number: 20210404034
    Abstract: A copper alloy for engine valve seats manufactured by laser cladding improves wear resistance of the copper alloy. The copper alloy includes 12 to 24 wt % of Ni, 2 to 4 wt % of Si, 4 to 12 wt % of Mo, 15 to 35 wt % of Fe, and the remaining wt % of Cu and impurities.
    Type: Application
    Filed: October 20, 2020
    Publication date: December 30, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Nam Kim, Min Woo Kang, Seung Hyun Hong
  • Patent number: 11209872
    Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: December 28, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Jong In Ryu, Seung Hyun Hong, Jang Hyun Kim
  • Publication number: 20210395862
    Abstract: A copper alloy for valve seats, and more particularly a copper alloy for valve seats with improved wear resistance, contains 12 to 24% by weight of Ni, 2 to 4% by weight of Si, 7 to 13% by weight of Cr, 20 to 35% by weight of Fe, and a balance of Cu and other impurities.
    Type: Application
    Filed: October 20, 2020
    Publication date: December 23, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Min Woo Kang, Soon Woo Kwon, Hyun Ki Kim, Chung An Lee, Seung Hyun Hong, Young Nam Kim
  • Patent number: 11198920
    Abstract: Disclosed is a method for manufacturing high-carbon bearing steel, which include: heating a billet at a temperature of about 950 to 1,050° C. for about 70 to 120 minutes, rolling the billet to manufacture a wire rod, winding the wire rod to manufacture a wire rod coil, cooling the wire rod coil, and subsequently heat treating the wire rod coil for spheroidizing and carbonitriding, respectively. The bearing steel may include an amount of about 0.9 to 1.3 wt % of carbon (C), an amount of about 1.1 to 1.6 wt % of silicon (Si), an amount of about 1.0 to 1.5 wt % of manganese (Mn), an amount of about 1.5 to 1.9 wt % of chromium (Cr), an amount of about 0.2 to 0.6 wt % of nickel (Ni), an amount of about 0.1 to 0.3 wt % of molybdenum (Mo), and the balance iron (Fe) based on the total weight thereof.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: December 14, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Hyundai Steel Company
    Inventors: Jae-Yoon Hwang, Min-Woo Kang, Shin-Woong Jeong, Soon-Jae Won, Sang-Min Song, Seung-Hyun Hong, Min-Woo Kang
  • Patent number: 11137041
    Abstract: A brake disk includes a basic material formed of gray cast iron, a decarburized layer formed on the basic material and formed via decarburizing, and a nitride compound layer formed on the decarburized layer and formed via nitriding of a nitride. A method of manufacturing a brake disk includes preparing a disk formed of gray cast iron, performing heat treatment of the disk to form a pre-decarburized layer and a base layer of gray cast iron over which the pre-decarburized layer is formed, and nitriding a portion of the pre-decarburized layer to form a nitride compound layer including a nitride and a decarburized layer over which the nitride compound layer is formed.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: October 5, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Min Woo Kang, Chung An Lee, Seung Hyun Hong, Soon Woo Kwon
  • Publication number: 20210115535
    Abstract: A composition of a copper alloy for a laser cladding valve sheet is disclosed. The copper alloy includes a matrix structure and a hard phase, which includes 12 to 24 wt % of Ni, 2 to 4 wt % of Si, 8 to 30 wt % of Fe, more than 5 wt % and less than 10 wt % of Mo, 2 to 10 wt % of Al, and the balance Cu. The interfacial delamination may be suppressed in a fatigue environment by micronizing the hard phase and the distribution thereof, thereby improving fatigue resistance and wear resistance.
    Type: Application
    Filed: February 10, 2020
    Publication date: April 22, 2021
    Inventors: Min-Woo Kang, Soon-Woo Kwon, Chung-An Lee, Seung-Hyun Hong, Young-Nam Kim
  • Publication number: 20210120664
    Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.
    Type: Application
    Filed: December 9, 2020
    Publication date: April 22, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn HONG, Seung Hyun HONG, Jang Hyun KIM
  • Patent number: 10897811
    Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: January 19, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Seung Hyun Hong, Jang Hyun Kim
  • Publication number: 20200409426
    Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn HONG, Jong In RYU, Seung Hyun HONG, Jang Hyun KIM
  • Publication number: 20200377965
    Abstract: Disclosed is a method for manufacturing high-carbon bearing steel, which include: heating a billet at a temperature of about 950 to 1,050° C. for about 70 to 120 minutes, rolling the billet to manufacture a wire rod, winding the wire rod to manufacture a wire rod coil, cooling the wire rod coil, and subsequently heat treating the wire rod coil for spheroidizing and carbonitriding, respectively. The bearing steel may include an amount of about 0.9 to 1.3 wt % of carbon (C), an amount of about 1.1 to 1.6 wt % of silicon (Si), an amount of about 1.0 to 1.5 wt % of manganese (Mn), an amount of about 1.5 to 1.9 wt % of chromium (Cr), an amount of about 0.2 to 0.6 wt % of nickel (Ni), an amount of about 0.1 to 0.3 wt % of molybdenum (Mo), and the balance iron (Fe) based on the total weight thereof.
    Type: Application
    Filed: November 22, 2019
    Publication date: December 3, 2020
    Inventors: Jae-Yoon Hwang, Min-Woo Kang, Shin-Woong Jeong, Soon-Jae Won, Sang-Min Song, Seung-Hyun Hong, Min-Woo Kang
  • Publication number: 20200190642
    Abstract: Provided is a ferritic stainless steel having improved impact resistance and corrosion resistance at high temperatures by suppressing formation of a sigma phase in the steel. The ferritic stainless steel composition may include an amount of about 0.015% or less (excluding 0%) of carbon (C), an amount of about 0.17% or less (excluding 0%) of silicon (Si), an amount of about 1.35% or less (excluding 0%) of manganese (Mn), an amount of about 17 to 20% of chromium (Cr), an amount of about 0.1 to 0.5% of titanium (Ti), an amount of about 3 to 5% of aluminum (Al), and iron (Fe) constituting the remaining balance of the steel composition. In particular, the steel composition satisfies [Equation 1] below. (20Si+Mn)/Al<0.7??[Equation 1], where Si, Mn, and Al denote the content (%) of each component.
    Type: Application
    Filed: August 12, 2019
    Publication date: June 18, 2020
    Inventors: Min Woo Kang, Chung An Lee, Seung Hyun Hong, Soon Woo Kwon
  • Publication number: 20200191215
    Abstract: The present disclosure relates a brake disc and a method of manufacturing the same, in which the depth of the coating layer containing a nitride is adjustable and corrosion resistance and wear resistance can be improved. A brake disc according to an embodiment of the present disclosure includes: a disc base material made of gray cast iron; and a coating layer formed on a surface of the disc base material and including a nitride produced as nitrogen is diffused into a ferrite matrix structure.
    Type: Application
    Filed: August 7, 2019
    Publication date: June 18, 2020
    Inventors: Soon Woo Kwon, Chung An Lee, Min Woo Kang, Seung Hyun Hong
  • Publication number: 20200182318
    Abstract: A brake disk includes a basic material formed of gray cast iron, a decarburized layer formed on the basic material and formed via decarburizing, and a nitride compound layer formed on the decarburized layer and formed via nitriding of a nitride. A method of manufacturing a brake disk includes preparing a disk formed of gray cast iron, performing heat treatment of the disk to form a pre-decarburized layer and a base layer of gray cast iron over which the pre-decarburized layer is formed, and nitriding a portion of the pre-decarburized layer to form a nitride compound layer including a nitride and a decarburized layer over which the nitride compound layer is formed.
    Type: Application
    Filed: April 17, 2019
    Publication date: June 11, 2020
    Inventors: Min Woo KANG, Chung An LEE, Seung Hyun HONG, Soon Woo KWON
  • Publication number: 20200133347
    Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.
    Type: Application
    Filed: December 31, 2019
    Publication date: April 30, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn HONG, Jong In RYU, Seung Hyun HONG, Jang Hyun KIM
  • Patent number: 10629542
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Jang Hyun Kim, Hye Kyung Kim, Seung Hyun Hong, Jong In Ryu
  • Publication number: 20200098699
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong In RYU, Suk Youn HONG, Gi Su CHI, Seung Hyun HONG, Ki Chan KIM
  • Patent number: 10597749
    Abstract: A continuous annealing apparatus includes: a pre-treatment device to prepare a strip unwound from a coil; a heating device to heat the strip prepared by the pre-treatment device; a heat holding device to isothermally maintain the strip heated by the heating device; a first cooling device to cool the strip heat-maintained by the heat holding device; an annealing device including a first annealing device for annealing the strip, which, is cooled by the first cooling device, for a first time, and a second annealing device for winding the strip, which is cooled by the first cooling device, into a coil and then unwinding the coil into the strip again after annealing for a second time; a second cooling device to cool the strip annealed by the first annealing device or the second annealing device; and a post-treatment device to wind the strip cooled by the second cooling device into the coil.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: March 24, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Soon Woo Kwon, Min Woo Kang, Moon Ki Bae, Seung Hyun Hong