Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

Abstract: A steel composition is provided and includes carbon of about 0.5 to 0.7 wt %; silicon of about 1.3 to 2.3 wt %; manganese of about 0.6 to 1.2%; chromium of about 0.6 to 1.2 wt %; molybdenum of about 0.1 to 0.5 wt %; nickel of about 0.05 to 0.8 wt %; vanadium of about 0.05 to 0.5 wt %; niobium of about 0.05 to 0.5 wt %; titanium of about 0.05 to 0.3 wt %; cobalt of about 0.01 to 3 wt %; zirconium of about 0.001 to 0.2 wt %; yttrium of about 0.01 to 1.5 wt %; copper of about 0.3% or less but greater than 0 wt %; aluminum of about 0.3% or less but greater than 0 wt %; nitrogen of about 0.03% or less but greater than 0 wt %; oxygen of about 0.003% or less but greater than 0 wt %. Additionally, a balance iron, based on the total weight is included.

Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.

Abstract: Disclosed herein is a high strength special steel including, by weight %: carbon (C): from about 0.1 to 0.5%; silicon (Si): from about 0.1 to 2.3%; manganese (Mn): from about 0.3 to 1.5%; chromium (Cr): from about 1.1 to 4.0%; molybdenum (Mo): from about 0.3 to 1.5%; nickel (Ni): from about 0.1 to 4.0%; vanadium (V): from about 0.01 to 0.50%; boron (B): from about 0.001 to 0.010%; niobium (Nb): from about 0.05 to 0.50%; and the balance of iron (Fe) and inevitable impurities.

Abstract: An ultrahigh-strength spring steel, used as steel for a vehicle engine valve spring may include 0.5 to 0.7 wt % of C, 1.3 to 2.5 wt % of Si, 0.6 to 1.2 wt % of Mn, 0.6 to 1.5 wt % of Cr, 0.01 to 0.5 wt % of Mo, 0.01 to 0.9 wt % of Ni, 0.5 wt % or less (excluding 0 wt %) of V, 0.5 wt % or less (excluding 0 wt %) of Nb, 0.3 wt % or less (excluding 0 wt %) of Ti, 1.0 wt % or less (excluding 0 wt %) of Co, 0.1 wt % or less (excluding 0 wt %) of B, 0.3 wt % or less (excluding 0 wt %) of W, 0.3 wt % or less (excluding 0 wt %) of Cu, 0.3 wt % or less (excluding 0 wt %) of Al, 0.03 wt % or less (excluding 0 wt %) of N, 0.003 wt % or less (excluding 0 wt %) of O, and a remainder of Iron (Fe) and inevitable impurities.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: The present invention relates to: a composition for detecting a gastric cancer marker comprising a preparation for measuring the expression level or methylation level of mRNA of ADCY3 or a protein thereof; a kit for diagnosing gastric cancer, containing the composition; a method for diagnosing gastric cancer by treating a biological sample with the preparation to ascertain whether a material for complementarily binding to the preparation exists and comparing the amount thereof with a control group; a composition for treating and preventing gastric cancer, containing a preparation capable of inhibiting ADCY3 polynucleotide or ADCY3 polypeptide; and a method for treating gastric cancer by administering the composition to an individual. According to the present invention, it is possible to diagnose gastric cancer with high diagnostic sensitivity and specificity using ADCY3 as a marker for diagnosing gastric cancer, and thus can greatly contribute to reducing mortality due to gastric cancer.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: Disclosed herein is a method of treating a composite piston pin, including: preparing the piston pin of which at least surface layer includes a composite material including a reinforcing fiber and a resin; improving roughness by processing the surface layer of the piston pin; and forming a coating layer on the surface layer processed to reduce a friction coefficient of the piston pin.

Abstract: Disclosed herein is a method of treating a composite piston pin, including: preparing the piston pin of which at least surface layer includes a composite material including a reinforcing fiber and a resin; improving roughness by processing the surface layer of the piston pin; and forming a coating layer on the surface layer processed to reduce a friction coefficient of the piston pin.

Abstract: Disclosed herein is a high manganese steel including: 0.5 to 1.2 wt % of carbon (C), 0.1 to 2.3 wt % of silicon (Si), 15 to 30 wt % of manganese (Mn), 7.0 to 13.0 wt % of aluminum (Al), 0.01 to 3.0 wt % of nickel (Ni), 0.01 to 0.5 wt % of chromium (Cr), 0.01 to 0.4 wt % of molybdenum (Mo), 0.01 to 0.5 wt % of vanadium (V), 0.005 to 0.3 wt % of niobium (Nb), 0.005 to 0.3 wt % of titanium (Ti), and remainder iron (Fe) and other inevitable impurities.

Abstract: Disclosed is a steel composition for hot stamping that comprises carbon (C) in an amount of about 0.22 to about 0.25 wt %, silicon (Si) in an amount of about 0.2 to about 0.3 wt %, manganese (Mn) in an amount of about 1.2 to about 1.4 wt %, titanium (Ti) in an amount of about 0.02 to about 0.05 wt %, chromium (Cr) in an amount of about 0.11 to about 0.2 wt %, boron (B) in an amount of about 0.005 to about 0.01 wt %, zinc (Zr) in an amount of about 0.005 to about 0.02 wt %, niobium (Nb) in an amount of about 0.01 to about 0.05 wt %, tungsten (W) in an amount of about 0.1 to about 0.5 wt %, iron (Fe) constituting the remaining balance of the steel composition, all the wt % based on the total amount of the steel composition.

Abstract: Disclosed is a high frequency heat treatment method of hot-stamping-treated ultra-high strength parts, which comprises: a first step of heating the parts until the temperature of a heat treatment zone thereof becomes the AC3 transformation point or higher; a second step of maintaining the temperature until phase transformation of the heat treatment zone to austenite is completed; and a third step of cooling the heat treatment zone to transform the structure thereof to ferrite-pearlite. The present method improves the energy absorbing efficiency by increasing the parts' elongation ratio by locally forming a softening structure which absorbs energy.

Abstract: A continuous annealing apparatus includes: a pre-treatment device to prepare a strip unwound from a coil; a heating device to heat the strip prepared by the pre-treatment device; a heat holding device to isothermally maintain the strip heated by the heating device; a first cooling device to cool the strip heat-maintained by the heat holding device; an annealing device including a first annealing device for annealing the strip, which, is cooled by the first cooling device, for a first time, and a second annealing device for winding the strip, which is cooled by the first cooling device, into a coil and then unwinding the coil into the strip again after annealing for a second time; a second cooling device to cool the strip annealed by the first annealing device or the second annealing device; and a post-treatment device to wind the strip cooled by the second cooling device into the coil.

Abstract: A bearing steel includes 1.0 to 1.3 wt % carbon; 0.9 to 1.6 wt % silicon; 0.5 to 1.0 wt % manganese; 1.5 to 2.5 wt % nickel; 1.5 to 2.5 wt % chromium; 0.2 to 0.5 wt % molybdenum; 0.01 to 0.06 wt % aluminum; 0.01 to 0.1 wt % copper; at least one selected from the group consisting of more than 0 wt % and less than 0.38 wt % vanadium and more than 0 wt % and less than 0.02 wt % niobium; and a balance of iron.

Abstract: A heat radiation-thermoelectric fin includes a thermoelectric inorganic material on a heterogeneous laminate of graphene. The heterogeneous laminate may be tube-shaped or plate-shaped, and a metal conductor may be coupled to one or more of the heterogeneous laminate. A thermoelectric module may be formed to include the fin, and a thermoelectric apparatus may include a heat supplier connected to the thermoelectric module.

Abstract: A carburized alloy steel includes, based on a total weight of the carburized alloy steel, 0.1 to 0.35 wt % carbon, 0.1 to 2.0 wt % silicon, 0.1 to 1.5 wt % manganese, 1.5 to 3.0 wt % chromium, 0.2 to 0.5 wt % molybdenum, greater than 0 to 0.07 wt % niobium, and a balance of iron.

Abstract: Disclosed herein is a high manganese steel including: 0.5 to 1.2 wt % of carbon (C), 0.1 to 2.3 wt % of silicon (Si), 15 to 30 wt % of manganese (Mn), 7.0 to 13.0 wt % of aluminum (Al), 0.01 to 3.0 wt % of nickel (Ni), 0.01 to 0.5 wt % of chromium (Cr), 0.01 to 0.4 wt % of molybdenum (Mo), 0.01 to 0.5 wt % of vanadium (V), 0.005 to 0.3 wt % of niobium (Nb), 0.005 to 0.3 wt % of titanium (Ti), and remainder iron (Fe) and other inevitable impurities.