Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.

Abstract: The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.

Abstract: Provided is a method for preparing a needle-like sulfide-based solid electrolyte. The method may include: preparing a solid electrolyte admixture comprising an organic solvent, Li2S, P2S5, and LiCl; synthesizing a solid electrolyte by stirring the solid electrolyte admixture at a temperature of about 30 to 60° C. for about 22 to 26 hours; first stirring the solid electrolyte at a speed of about 80 to 120 rpm for about 5 to 10 minutes; after the first stirring, second stirring the first stirred solid electrolyte at a speed of about 250 to 300 rpm; vacuum-drying the second stirred solid electrolyte for about 12 to 24 hours; and heat-treating the vacuum-dried solid electrolyte at a temperature of about 350 to 550° C. for about 1 to 5 hours.

Abstract: The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated layer formed on the base substrate; a plurality of solder balls formed on the semiconductor laminated layer of the plurality of light emitting devices, respectively; a molding member configured to surround the light emitting devices and the solder balls; and a circuit board formed on the molding member, in which upper surfaces of the solder balls are exposed from the molding member, the circuit board includes a contact layer consisted of a metal pattern layer electrically connected with the plurality of solder balls exposed from the molding member and an insulating layer adjacently disposed to the metal pattern layer, and a thickness from the base substrate of each of the plurality of light emitting devices to an upper surface of each of the exposed solder balls is the same each other.

Abstract: A suspension system for a vehicle with a composite spring may include: a first longitudinally mounted spring 10 and a second longitudinally mounted spring 20 generating vertical stiffness of a vehicle; and a transversely mounted spring 30 generating roll stiffness and connected to the first and second longitudinally mounted springs. In particular, the transversely mounted spring 30 is connected to a vehicle body 1 by a support member 40. Stiffness of the vehicle may be further strengthened during a longitudinal behavior and a rolling behavior of the vehicle, and thus, running stability may be significantly enhanced.

Abstract: The present disclosure relates to an apparatus and a method for assembling a composite material leaf spring module, wherein the efficiency of assembly of the composite material leaf spring module is improved and a camber of a spring member of a composite material is compensated for during assembly. An apparatus for assembling a composite material leaf spring module includes a first support configured to support a central portion of the composite material leaf spring module, a pair of second supports configured to individually support springs of the composite material leaf spring module, and a base connecting the first and second supports.

Abstract: A multi-plate spring suspension of composite material for a vehicle includes: a first bracket unit mounted to a rubber spring; a second bracket unit mounted to a trunnion base; and a plurality of composite springs manufactured by impregnating reinforcing fibers with resin, coupled to the first bracket unit and the second bracket unit at opposite ends thereof, respectively, and being vertically spaced apart from each other.

Abstract: The present invention relates to a compound represented by Chemical Formula 1 or a pharmaceutically acceptable salt thereof. The compound according to the present invention can be usefully used for the prevention or treatment of autophagy-related diseases.

Abstract: The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet.

Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively. Each of the first and second carrier receivers may further include a digital mixer for further translating the frequencies of the receive signal in the digital domain.

Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Abstract: The present invention relates to a compound represented by Chemical Formula 1 or a pharmaceutically acceptable salt thereof. The compound according to the present invention can be usefully used for the prevention or treatment of autophagy-related diseases.

Abstract: A suspension system for a vehicle includes: a composite leaf spring having a protective member which covers an outer surface of the composite leaf spring; and an abrasion-preventing pad coupled to the composite leaf spring and shielding. The protective member and the abrasion-preventing pad are disposed at a portion of the composite leaf spring to which a U-bolt is mounted.

Abstract: A device for indicating a replacement time of a composite leaf spring constantly monitors durability of the composite leaf spring, which is formed by mixing unidirectional glass fiber and epoxy resin, and informs a driver of an appropriate replacement time of the composite leaf spring based on the monitoring result.

Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively. Each of the first and second carrier receivers may further include a digital mixer for farther translating the frequencies of the receive signal in the digital domain.

Abstract: A multi-plate spring suspension of composite material for a vehicle includes: a first bracket unit mounted to a rubber spring; a second bracket unit mounted to a trunnion base; and a plurality of composite springs manufactured by impregnating reinforcing fibers with resin, coupled to the first bracket unit and the second bracket unit at opposite ends thereof, respectively, and being vertically spaced apart from each other.

Abstract: The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.

Abstract: A bracket apparatus for a composite spring, may include a lower bracket disposed to come into contact with a composite spring when a U-bolt is fastened to a nut; an upper bracket disposed above the lower bracket so as not to be decoupled therefrom by the nut; and an elastic member disposed between the lower bracket and the upper bracket to provide a force such that the lower and upper brackets move away from each other.