Abstract: A device for indicating a replacement time of a composite leaf spring constantly monitors durability of the composite leaf spring, which is formed by mixing unidirectional glass fiber and epoxy resin, and informs a driver of an appropriate replacement time of the composite leaf spring based on the monitoring result.

Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively. Each of the first and second carrier receivers may further include a digital mixer for farther translating the frequencies of the receive signal in the digital domain.

Abstract: A multi-plate spring suspension of composite material for a vehicle includes: a first bracket unit mounted to a rubber spring; a second bracket unit mounted to a trunnion base; and a plurality of composite springs manufactured by impregnating reinforcing fibers with resin, coupled to the first bracket unit and the second bracket unit at opposite ends thereof, respectively, and being vertically spaced apart from each other.

Abstract: The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.

Abstract: A bracket apparatus for a composite spring, may include a lower bracket disposed to come into contact with a composite spring when a U-bolt is fastened to a nut; an upper bracket disposed above the lower bracket so as not to be decoupled therefrom by the nut; and an elastic member disposed between the lower bracket and the upper bracket to provide a force such that the lower and upper brackets move away from each other.

Abstract: A variable feedback gain delta modulator includes group of capacitors commonly connected to a first terminal and are respectively classified into a first capacitor group and a second capacitor group; a comparator for sequentially generating n-bit digital output signals based on a voltage of the first terminal; and a switch group including switches respectively connected to the capacitors, wherein the switches are respectively classified into a first switch group and a second switch group respectively connected to the first capacitor group and the second capacitor group, and the first switch group and the second switch group respectively operate according to a first control signal and a second control signal that are determined based on the n-bit digital output signals and the variable feedback gain.

Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: A bandgap reference voltage generation system includes a common mode voltage generator, a bandgap reference voltage generation circuit, and a switch controller. The bandgap reference voltage generation circuit includes a plurality of transistors having source terminals respectively connected to drain terminals of a plurality of PMOS transistors. The switch controller provides a ground voltage to the bandgap reference voltage generation circuit in a first mode and a common mode voltage to the bandgap reference voltage generation circuit in a second mode. The bandgap reference voltage generation circuit causes the plurality of the transistors to operate in a linear region by providing the common mode voltage to gate electrodes of the plurality of the transistors in the first mode and a saturation region by providing the ground voltage to the gate electrodes of the plurality of the transistors in the second mode.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively, Each of the first and second carrier receivers may further include a digital mixer for farther translating the frequencies of the receive signal in the digital domain.

Abstract: Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.

Abstract: A radio frequency (RF) integrated circuit is provided. The RF integrated circuit supports carrier aggregation and includes first receiving circuits and a first shared phase locked loop circuit that provides a first frequency signal of a first frequency to the first receiving circuits. One of the first receiving circuits includes an analog to digital converter (ADC) and a digital conversion circuit. The ADC converts an RF signal received by the one of the first receiving circuits to a digital signal by using the first frequency signal. The digital conversion circuit generates a digital baseband signal by performing frequency down conversion on the digital signal.

Abstract: A reference voltage circuit is provided. The reference voltage circuit includes a first current bias circuit including a first node; a second current bias circuit including a plurality of NMOS transistors and a second node, and an amplifier configured to output a reference voltage having same value as the second voltage. The plurality of NMOS transistors include a first NMOS transistor and a second NMOS transistor, the first NMOS transistor is connected to the first node, and the plurality of NMOS transistors are connected to the second node and configured to perform a sub-threshold operation based on a first voltage of the first node so that a second voltage is generated at the second node.

Abstract: Provided is a method for preparing a needle-like sulfide-based solid electrolyte. The method may include: preparing a solid electrolyte admixture comprising an organic solvent, Li2S, P2S5, and LiCl; synthesizing a solid electrolyte by stirring the solid electrolyte admixture at a temperature of about 30 to 60° C. for about 22 to 26 hours; first stirring the solid electrolyte at a speed of about 80 to 120 rpm for about 5 to 10 minutes; after the first stirring, second stirring the first stirred solid electrolyte at a speed of about 250 to 300 rpm; vacuum-drying the second stirred solid electrolyte for about 12 to 24 hours; and heat-treating the vacuum-dried solid electrolyte at a temperature of about 350 to 550° C. for about 1 to 5 hours.

Abstract: Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.

Abstract: A bandgap reference voltage generation system includes a common mode voltage generator, a bandgap reference voltage generation circuit, and a switch controller. The bandgap reference voltage generation circuit includes a plurality of transistors having source terminals respectively connected to drain terminals of a plurality of PMOS transistors. The switch controller provides a ground voltage to the bandgap reference voltage generation circuit in a first mode and a common mode voltage to the bandgap reference voltage generation circuit in a second mode. The bandgap reference voltage generation circuit causes the plurality of the transistors to operate in a linear region by providing the common mode voltage to gate electrodes of the plurality of the transistors in the first mode and a saturation region by providing the ground voltage to the gate electrodes of the plurality of the transistors in the second mode.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

Abstract: A suspension system for a vehicle includes: a composite leaf spring having a protective member which covers an outer surface of the composite leaf spring; and an abrasion-preventing pad coupled to the composite leaf spring and shielding.

Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.