Abstract: The present disclosure relates to an apparatus and a method for assembling a composite material leaf spring module, wherein the efficiency of assembly of the composite material leaf spring module is improved and a camber of a spring member of a composite material is compensated for during assembly. An apparatus for assembling a composite material leaf spring module includes a first support configured to support a central portion of the composite material leaf spring module, a pair of second supports configured to individually support springs of the composite material leaf spring module, and a base connecting the first and second supports.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

Abstract: Disclosed herein is a backlight unit including a flat substrate, a light emitting device mounted on the flat substrate, a light guide plate disposed on the flat substrate, and a reflector being inserted to be disposed in a through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device. The light guide plate may include an inner wall surface defining the through-hole which accommodates the light emitting device. The contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

Abstract: A light emitting device apparatus is provided. For example, a light emitting device package include a substrate, a light emitting device, a reflection molding member, an upper cover and an interval maintaining part. The substrate includes a first electrode and a second electrode. The light emitting device includes a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode. The reflection molding member includes a form and a reflection cup part. The upper cover is formed in a shale corresponding to that of an upper surface of the reflection molding member, and the interval maintaining part is formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device.

Abstract: A power steering system of a vehicle and a control method are provided. The system includes a main hydraulic motor that receives engine power and generates a hydraulic pressure and an auxiliary hydraulic motor that generates a hydraulic pressure. A front wheel steering cylinder receives hydraulic pressure and generates power for steering front wheels and auxiliary steering of a driver. A rear wheel steering cylinder receives hydraulic pressure and generates power for steering rear wheels. An integrated control valve connected to the hydraulic motors and the steering cylinders through hydraulic pressure pipelines, and adjusts the hydraulic pressure of a main hydraulic motor to supply the pressure to the front wheel steering cylinder and adjusts the hydraulic pressure generated of the auxiliary hydraulic motor to supply the pressure to the front or rear wheel steering cylinder.

Abstract: A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.

Abstract: An analog-to-digital converter includes a sample hold circuit configured to receive an analog input signal based on an operating mode, the operating mode being one of at least two modes including a sample mode and a hold mode. The sample hold circuit includes a first transistor including a control terminal and a first terminal, the first transistor configured to receive a control signal via the control terminal and receive the analog input signal via the first terminal. The analog-to-digital converter further includes a bootstrap switch operationally connected to the control terminal and the first terminal of the first transistor, the bootstrap switch configured to form a first current path from a power source based on the analog input signal and a boosted voltage of the control terminal of the first transistor in the sample mode, the control terminal bing along the first current path in the sample mode.

Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.

Abstract: Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.

Abstract: An analog-to-digital converter includes a sample hold circuit configured to receive an analog input signal based on an operating mode, the operating mode being one of at least two modes including a sample mode and a hold mode. The sample hold circuit includes a first transistor including a control terminal and a first terminal, the first transistor configured to receive a control signal via the control terminal and receive the analog input signal via the first terminal. The analog-to-digital converter further includes a bootstrap switch operationally connected to the control terminal and the first terminal of the first transistor, the bootstrap switch configured to form a first current path from a power source based on the analog input signal and a boosted voltage of the control terminal of the first transistor in the sample mode, the control terminal bing along the first current path in the sample mode.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.

Abstract: Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.

Abstract: There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.

Abstract: Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.

Abstract: A semiconductor device and operating method thereof are provided.

Abstract: A light emitting device capable of bonding a lens at a preset accurate position, and a backlight unit comprising the same are provided. The light emitting device includes a molded material having an opening through which light generated from a light emitting element disposed in the molded material is emitted, a projecting support disposed along at least part of a circumference of the opening of the molded material, and a lens having an inner surface that defines an internal surface on which light emitted from the light emitting element is incident, an outer surface that defines an external surface from which the incident light is emitted to the outside, and a bottom surface that connects the inner surface and the outer surface, wherein a boundary between the inner surface and the bottom surface, a lower part of the inner surface, or the bottom surface contacts the projecting support.

Abstract: Disclosed is a method of manufacturing a crystallized glass for a secondary battery. The secondary battery include a solid electrolyte comprising sulfide, which can be prepared by synthesizing sulfides using thermal energy and vapor pressure as energy sources. The method of the present invention is suitable for manufacturing a crystallized glass for use as the electrolyte comprising sulfide of the secondary battery. The method includes dispersing two or more kinds of sulfides in a solvent and synthesizing the sulfides under conditions of a temperature equal to or greater than a boiling point of the solvent and high pressure greater than standard atmospheric pressure.