Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Abstract: An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.

Abstract: An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.

Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Abstract: Disclosed herein is a touch panel including a transparent substrate divided into an active region and a non-active region as an edge of the active region, a printing layer formed in the non-active region of one surface of the transparent substrate, an adhesive film formed to cover the printing layer on one surface of the transparent substrate, an insulating layer formed on one surface of the adhesive film and having an intaglio portion open toward one surface thereof, and an electrode formed within the intaglio portion.

Abstract: Disclosed herein is a touch panel, including: a substrate; a black matrix formed on the substrate and defining a pixel area; a first electrode formed on the black matrix; a color filter layer formed in the pixel area on the substrate; and a second electrode formed on the color filter layer.

Abstract: Disclosed herein are a touch sensor and a method of manufacturing the same. The touch sensor includes: a transparent substrate; a resin layer formed on one surface of the transparent substrate; and an electrode formed on one surface of the resin layer, wherein one surface of the resin layer is formed with a substrate prominence and depression part having a prominence and depression shape.

Abstract: Disclosed herein are a touch sensor and a method of manufacturing the same, the touch sensor including: a transparent substrate; a shielding film formed on one surface of the transparent substrate; a resin layer formed above the transparent substrate and one surface of the shielding film; and an electrode buried in one surface of the resin layer.

Abstract: Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel includes a transparent substrate, an insulating layer that is formed on the transparent substrate and has an intaglio portion formed thereon, an electrode layer that is embedded in the intaglio portion, and a light absorbing layer that is formed in an inner wall of the intaglio portion to be interposed between the inner wall of the intaglio portion and the electrode layer. In the touch panel, the electrode layer is formed to be embedded, and the light absorbing layer is further included, thereby durability and visibility of the touch panel.

Abstract: Disclosed herein is a method for manufacturing a touch panel, the method including: (A) applying a barrier layer to a transparent substrate; (B) patterning the bather layer using a stamp so that open parts are formed in the barrier layer; and (C) forming sensing electrodes in the open parts, the sensing electrode being made of a metal. The bather layer is patterned using the stamp and the sensing electrodes are then formed in the open parts of the barrier layer, thereby making it possible to simplify a manufacturing process as compared to a photolithography process and to reduce a manufacturing cost.

Abstract: Disclosed herein is a method of manufacturing a touch panel. A method of manufacturing a touch panel according to the present invention includes: patterning a transparent substrate using a stamp so that the transparent substrate has concave portions depressed therein; applying a barrier layer only to outer sides of the concave portions of the transparent substrate so that the concave portions are exposed; and forming sensing electrodes in the concave portions, the sensing electrode made of a metal.

Abstract: Disclosed herein a light emitting diode package including: a package body with an opening portion; a light emitting diode chip mounted on the bottom of the opening portion; and a sheet installed on the top of the opening portion and including an anti-reflecting unit formed in a moth-eye pattern, which can increase light emitting efficiency.

Abstract: Disclosed herein are an electronic paper display device including a lower electrode; twist balls provided in each cell of a barrier structure formed on the lower electrode; and an upper electrode provided above the twist balls and having an anti-reflection part provided on a surface thereof and having a moth-eye pattern, the surface facing the twist balls, and a method of manufacturing the same. According to the present invention, the upper electrode can be molded simultaneously with forming of the anti-reflection part rather than the anti-reflection coating film is formed on the upper electrode of the electronic paper display device through a separate process, thereby making it possible to simplify the manufacturing process of the upper electrode having the anti-reflection effects and reduce the manufacturing costs thereof, and improve productivity.

Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.

Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.

Abstract: Disclosed herein is a hybrid supercapacitor manufactured according to a method of manufacturing a hybrid supercapacitor including: forming a lithium thin film on one surface of a separator; facing the lithium thin film and an active material layer of an anode each other; forming an electrode cell by alternately disposing the anode and the cathode, having the separator therebetween; and pre-doping the anode with lithium ions from the lithium thin film by receiving the electrode cell and an electrode solution in a housing.

Abstract: Provided is a supercapacitor. The supercapacitor includes an electrode cell including a first electrode and a second electrode stacked alternately with inserting a separator therebetween, a first terminal extended from a first surface and a second surface opposing to each other at the electrode cell, a second terminal extended from a third surface and a fourth surface opposing to each other at the electrode cell and a housing to seal the electrode cell.