Patents by Inventor Seung Hyun Ra
Seung Hyun Ra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120043945Abstract: There is provided an apparatus for equalizing voltage using a time switch. The apparatus for equalizing voltage includes a plurality of energy storage unit cells connected in series; a single first balance capacitor connected with each energy storage unit cell in parallel through the first switch module for equally charging voltage between the plurality of energy storage unit cells; and a first switch module including a plurality of switches disposed between each energy storage unit cell and the first balance capacitor to sequentially open and close the connection between each energy storage unit cell and the first balance capacitor, whereby the voltage unbalance between the energy storage unit cells can be prevented at low cost.Type: ApplicationFiled: January 12, 2011Publication date: February 23, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Wook KIM, Bae Kyun KIM, Hee Bum LEE, Young Hak JEONG, Seung Hyun RA
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Patent number: 8058787Abstract: The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.Type: GrantFiled: September 23, 2008Date of Patent: November 15, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Hyun Ra, Kay Hyeok An, Young Hee Lee, Jong Myeon Lee
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Publication number: 20110058307Abstract: The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.Type: ApplicationFiled: November 18, 2009Publication date: March 10, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Ho Lee, Seung Hyun Ra, Dong Sup Park, Yeong Su Cho, Sang Kyun Lee, Hyun Chul Jung, Chang Ryul Jung
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Publication number: 20110058306Abstract: Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon.Type: ApplicationFiled: November 4, 2009Publication date: March 10, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Ho Lee, Seung Hyun Ra, Dong Sup Park, Yeong Su Cho, Sang Kyun Lee, Hyun Chul Jung, Chang Ryul Jung
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Publication number: 20100277052Abstract: The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.Type: ApplicationFiled: September 23, 2008Publication date: November 4, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Hyun Ra, Kay Hyeok An, Young Hee Lee, Jong Myeon Lee
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Publication number: 20100233496Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.Type: ApplicationFiled: July 29, 2009Publication date: September 16, 2010Inventors: Hak-Kwan Kim, Seung-Hyun Ra, Jun-Hee Bae, Hyun-Chul Jung
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Publication number: 20100220430Abstract: It relates to a supercapacitor using an ion-exchanger, particularly to a supercapacitor which may optimize the capacity of current collection by employing an ion-exchanger instead of a binder in manufacturing of supercapacitor electrodes.Type: ApplicationFiled: December 23, 2009Publication date: September 2, 2010Inventors: Jun-Hee BAE, Seung-Hyun Ra, Hak-Kwan Kim, Hyun-Chul Jung
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Publication number: 20100195269Abstract: It discloses a hybrid supercapacitor including a carbon aerogel cathode and a surface-oxidized transition metal nitride aerogel anode which is able to increase energy density and power density with increase of overall cell potential and at the same time lower internal resistance of the electrode and equivalent series resistance by using a monolithic electrode with no use of current collector and binder.Type: ApplicationFiled: August 6, 2009Publication date: August 5, 2010Inventors: Hak-Kwan KIM, Seung-Hyun RA, Jun-Hee BAE, Hyun-Chul JUNG
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Patent number: 7666292Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.Type: GrantFiled: January 17, 2006Date of Patent: February 23, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Choon Cho, Il Sang Maeng, Choon Keun Lee, Seung Hyun Ra
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Patent number: 7644496Abstract: A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.Type: GrantFiled: October 10, 2007Date of Patent: January 12, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong-Bok Kwak, Seung-Hyun Ra, Choon-Keun Lee, Jae-Choon Cho, Sang-Moon Lee
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Patent number: 7562447Abstract: Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.Type: GrantFiled: March 27, 2007Date of Patent: July 21, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Choon Keun Lee, Seung Hyun Ra, Sang Moon Lee, Jung Woo Lee, Jeong Bok Kwak, Jae Choon Cho, Chi Seong Kim
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Patent number: 7438622Abstract: The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.Type: GrantFiled: February 25, 2005Date of Patent: October 21, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Hyun Ra, Kay Hyeok An, Young Hee Lee, Jong Myeon Lee
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Flame retardant resin composition for printed circuit board and printed circuit board using the same
Publication number: 20080090084Abstract: The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes: (a) a complex epoxy resin (b) an amino triazine type curing agent; (c) a curing accelerator; and (d) an inorganic filler, so that the flame retardant resin composition not only can show an excellent thermal stability, an excellent mechanical strength and a suitability for the imprinting lithography method but also can improve the reliability of a substrate by reducing a thermal expansion ratio, and to a printed circuit board using the same.Type: ApplicationFiled: September 14, 2007Publication date: April 17, 2008Inventors: Jae-Choon Cho, Myeong-Ho Hong, Seung-Hyun Ra, Jung-Woo Lee, Sang-Moon Lee -
Publication number: 20080086877Abstract: A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.Type: ApplicationFiled: October 10, 2007Publication date: April 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong-Bok Kwak, Seung-Hyun Ra, Choon-Keun Lee, Jae-Choon Cho, Sang-Moon Lee
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Publication number: 20080057444Abstract: A method of manufacturing a broad stamper is disclosed. Using a method that includes: stacking a first mask, in which a first pattern is perforated, on a positive photoresist layer; exposing an upper surface of the first mask to light; developing the positive photoresist layer to form an intaglio; and molding such that a relievo is formed, which is in correspondence with the intaglio, a broad stamper having multiple levels can be manufactured with a simple process.Type: ApplicationFiled: August 29, 2007Publication date: March 6, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung-Hyun Ra, Choon-Keun Lee, Sang-Moon Kee, Jae-Choon Cho
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Publication number: 20080054518Abstract: A method of manufacturing a stamper is disclosed. By using a method that includes: manufacturing a small stamper, in which a first relievo is formed; repeatedly imprinting the small stamper on a large master mold to form a first intaglio corresponding to the first relievo; and molding such that a second relievo is formed, which is in correspondence with the first intaglio, a broad stamper having identical repeated patterns may be manufactured.Type: ApplicationFiled: August 29, 2007Publication date: March 6, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung-Hyun RA, Myeong-Ho HONG, Hyuk-Soo LEE, Jung-Woo LEE, Jeong-Bok KWAK
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Patent number: 7338854Abstract: A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.Type: GrantFiled: December 3, 2004Date of Patent: March 4, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Sung Choo, Seung Hyun Ra, Yong Suk Kim, Jung Woo Lee, Hyo Soon Shin, Hyoung Ho Kim
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Publication number: 20080034581Abstract: A method for manufacturing a printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes loading an insulation substrate in which an align mark is formed, loading an imprinting mold in which a first align hole is perforated in correspondence with the align mark, aligning the insulation substrate and the imprinting mold by perceiving the align mark through the first align hole, and compressing the imprinting mold and the insulation substrate together such that the intaglio pattern is formed in correspondence with the raised pattern, it is possible is to use an existing optical system for an imprinting process in aligning an opaque imprinting mold and an insulation substrate, without installing expensive alignment instruments, and to manufacture several insulation substrates having circuit patterns by sequentially loading and aligning several imprinting molds and insulation substrates and compressing simultaneously.Type: ApplicationFiled: August 10, 2007Publication date: February 14, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung-Hyun Ra, Choon-Keun Lee, Sang-Moon Kee, Jae-Choon Cho
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Publication number: 20070264755Abstract: Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.Type: ApplicationFiled: March 27, 2007Publication date: November 15, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon Keun Lee, Seung Hyun Ra, Sang Moon Lee, Jung Woo Lee, Jeong Bok Kwak, Jae Choon Cho, Chi Seong Kim
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Patent number: 7203055Abstract: Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.Type: GrantFiled: December 15, 2004Date of Patent: April 10, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyo Soon Shin, Seung Hyun Ra, Yong Suk Kim, Hyoung Ho Kim, Ho Sung Choo, Jung Woo Lee