Patents by Inventor Seung In BAIK
Seung In BAIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240282525Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00?G1/G2<1.50.Type: ApplicationFiled: January 17, 2024Publication date: August 22, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Won RYOO, Kyung Sik KIM, Seung In BAIK, Min Young CHOI, Jong Hwan LEE, Hyung Soon KWON
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Publication number: 20240258032Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.Type: ApplicationFiled: April 10, 2024Publication date: August 1, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Young HAM, Ji Hong JO, Seung In BAIK, Hyung Soon KWON
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Publication number: 20240242884Abstract: A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectric layer includes a rare earth element, Mn, and Ti. The rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element. The number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol?RE?0.9 mol and 1<A2/A1 are satisfied. The number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less.Type: ApplicationFiled: September 11, 2023Publication date: July 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Soon KWON, Hyoung Uk KIM, Kyung Sik KIM, Ji Su HONG, Seung In BAIK, Min Young CHOI, Si Taek PARK, Jong Hwan LEE, Jae Sung PARK
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Publication number: 20240212937Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces in the first direction, third and fourth surfaces in a second direction, and fifth and sixth surfaces in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Side margin portions includes BaTiO3, Zn, and Zr, an amount of Zn and an amount of Zr in the side margin portions are 0.5 mol or more and 1.0 mol or less, relative to 100 mol of Ti included in the side margin portions. The amount of Zn and the amount of Zr in the side margin portions are different from an amount of Zn and an amount of Zr in the dielectric layer.Type: ApplicationFiled: May 5, 2023Publication date: June 27, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Sik KIM, Seung In BAIK, Jong Hwan LEE, Min Young CHOI
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Patent number: 12009152Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.Type: GrantFiled: April 17, 2023Date of Patent: June 11, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong Gi Nam, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
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Patent number: 11984267Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.Type: GrantFiled: November 22, 2022Date of Patent: May 14, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Young Ham, Ji Hong Jo, Seung In Baik, Hyung Soon Kwon
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Patent number: 11923145Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1<A2/M1?1.5 and A2<A1 in which A1 is an average grain size of the dielectric layers in a central region of the active portion, A2 is an average grain size of the dielectric layers at an active boundary part of the active portion adjacent to the side margin portion, and M1 is an average grain size of the dielectric layers in a central region of the side margin portion.Type: GrantFiled: September 2, 2021Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Hee Lee, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hyoung Uk Kim, Jae Sung Park
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Patent number: 11894192Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.Type: GrantFiled: September 3, 2021Date of Patent: February 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
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Publication number: 20230411075Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.Type: ApplicationFiled: August 23, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyoung Uk Kim, Seung In Baik, Hyung Soon Kwon, Ji Hong Jo
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Patent number: 11830678Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/G1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.Type: GrantFiled: October 20, 2021Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Su Hong, Seung In Baik, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
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Patent number: 11804331Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.Type: GrantFiled: July 14, 2021Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyoung Uk Kim, Seung In Baik, Ji Su Hong, Eun Ha Jang, Jae Sung Park, Chung Eun Lee
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Patent number: 11791103Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.Type: GrantFiled: October 13, 2021Date of Patent: October 17, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyeg Soon An, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park, Je Hee Lee
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Patent number: 11776748Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.Type: GrantFiled: December 2, 2021Date of Patent: October 3, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyoung Uk Kim, Seung In Baik, Hyung Soon Kwon, Ji Hong Jo
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Patent number: 11735361Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is less than or equal to 1.5 mol, based on 100 mol of Ti of the base material main ingredient, and a content of the Dy satisfies 0.7 mol<Dy<1.1 mol, based on 100 mol of Ti of the base material main ingredient.Type: GrantFiled: July 16, 2021Date of Patent: August 22, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Young Choi, Hyung Soon Kwon, Seung In Baik, Ji Hong Jo
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Publication number: 20230253153Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong Gi NAM, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK
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Publication number: 20230207203Abstract: A multilayer capacitor is provided. The multilayer capacitor includes a body and an external electrode disposed outside the body, wherein the body includes an active portion including a plurality of dielectric layers and a plurality of internal electrodes stacked with dielectric layers interposed therebetween, and a side margin portion covering at least one side surface of side surfaces to which the internal electrodes are exposed in the laminate, wherein the side margin portion includes a dielectric including a BaTiO3-based main component, a first subcomponent including a rare earth element, and a second subcomponent including Zr, wherein, based on a molar content per 100 moles of the main component, when a molar content of the rare earth element is RE, a molar content of Zr and RE satisfies 0.20?Zr/RE?0.37.Type: ApplicationFiled: November 28, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Hee LEE, Seung In BAIK, Ji Su HONG, Jae Sung PARK, Jong Ho LEE
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Patent number: 11657971Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.Type: GrantFiled: June 4, 2021Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong Gi Nam, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
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Patent number: 11636979Abstract: A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1?Tb/Dy<0.15 in which Tb/Dy is a ratio of the content of terbium (Tb) to the content of dysprosium (Dy).Type: GrantFiled: August 2, 2021Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Sun Chun, Hong Gi Nam, Je Hee Lee, Ji Su Hong, Seung In Baik, Jae Sung Park
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Publication number: 20230082113Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.Type: ApplicationFiled: November 22, 2022Publication date: March 16, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Young HAM, Ji Hong JO, Seung In BAIK, Hyung Soon KWON
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Patent number: 11538631Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.Type: GrantFiled: March 31, 2020Date of Patent: December 27, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Young Ham, Ji Hong Jo, Seung In Baik, Hyung Soon Kwon