Patents by Inventor Seung In BAIK

Seung In BAIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923145
    Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1<A2/M1?1.5 and A2<A1 in which A1 is an average grain size of the dielectric layers in a central region of the active portion, A2 is an average grain size of the dielectric layers at an active boundary part of the active portion adjacent to the side margin portion, and M1 is an average grain size of the dielectric layers in a central region of the side margin portion.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hee Lee, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hyoung Uk Kim, Jae Sung Park
  • Patent number: 11894192
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 6, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
  • Publication number: 20230411075
    Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 21, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyoung Uk Kim, Seung In Baik, Hyung Soon Kwon, Ji Hong Jo
  • Patent number: 11830678
    Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/G1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Su Hong, Seung In Baik, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Patent number: 11804331
    Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyoung Uk Kim, Seung In Baik, Ji Su Hong, Eun Ha Jang, Jae Sung Park, Chung Eun Lee
  • Patent number: 11791103
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeg Soon An, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park, Je Hee Lee
  • Patent number: 11776748
    Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is greater than 0.2 mol and less than or equal to 1.5 mol based on 100 mol of titanium (Ti) of the base material main ingredient.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: October 3, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyoung Uk Kim, Seung In Baik, Hyung Soon Kwon, Ji Hong Jo
  • Patent number: 11735361
    Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor including the same are provided. The dielectric ceramic composition includes a BaTiO3-based base material main ingredient and an accessory ingredient, where the accessory ingredient includes dysprosium (Dy) and niobium (Nb) as first accessory ingredients. A total content of the Dy and Nb is less than or equal to 1.5 mol, based on 100 mol of Ti of the base material main ingredient, and a content of the Dy satisfies 0.7 mol<Dy<1.1 mol, based on 100 mol of Ti of the base material main ingredient.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Young Choi, Hyung Soon Kwon, Seung In Baik, Ji Hong Jo
  • Publication number: 20230253153
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Gi NAM, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK
  • Publication number: 20230207203
    Abstract: A multilayer capacitor is provided. The multilayer capacitor includes a body and an external electrode disposed outside the body, wherein the body includes an active portion including a plurality of dielectric layers and a plurality of internal electrodes stacked with dielectric layers interposed therebetween, and a side margin portion covering at least one side surface of side surfaces to which the internal electrodes are exposed in the laminate, wherein the side margin portion includes a dielectric including a BaTiO3-based main component, a first subcomponent including a rare earth element, and a second subcomponent including Zr, wherein, based on a molar content per 100 moles of the main component, when a molar content of the rare earth element is RE, a molar content of Zr and RE satisfies 0.20?Zr/RE?0.37.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hee LEE, Seung In BAIK, Ji Su HONG, Jae Sung PARK, Jong Ho LEE
  • Patent number: 11657971
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Gi Nam, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Patent number: 11636979
    Abstract: A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1?Tb/Dy<0.15 in which Tb/Dy is a ratio of the content of terbium (Tb) to the content of dysprosium (Dy).
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 25, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun Chun, Hong Gi Nam, Je Hee Lee, Ji Su Hong, Seung In Baik, Jae Sung Park
  • Publication number: 20230082113
    Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Young HAM, Ji Hong JO, Seung In BAIK, Hyung Soon KWON
  • Patent number: 11538631
    Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: December 27, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Young Ham, Ji Hong Jo, Seung In Baik, Hyung Soon Kwon
  • Publication number: 20220270824
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1] ?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.
    Type: Application
    Filed: October 13, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeg Soon AN, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK, Je Hee LEE
  • Publication number: 20220270822
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y)(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.
    Type: Application
    Filed: September 3, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
  • Publication number: 20220230810
    Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/B1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.
    Type: Application
    Filed: October 20, 2021
    Publication date: July 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Su Hong, Seung In Baik, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Publication number: 20220208455
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Application
    Filed: June 4, 2021
    Publication date: June 30, 2022
    Inventors: Hong Gi NAM, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK
  • Publication number: 20220181080
    Abstract: A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1?Tb/Dy<0.15 in which Tb/Dy is a ratio of the content of terbium (Tb) to the content of dysprosium (Dy).
    Type: Application
    Filed: August 2, 2021
    Publication date: June 9, 2022
    Inventors: Hee Sun CHUN, Hong Gi NAM, Je Hee LEE, Ji Su HONG, Seung In BAIK, Jae Sung PARK
  • Publication number: 20220157530
    Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.
    Type: Application
    Filed: July 14, 2021
    Publication date: May 19, 2022
    Inventors: Hyoung Uk Kim, Seung In Baik, Ji Su Hong, Eun Ha Jang, Jae Sung Park, Chung Eun Lee