Patents by Inventor Seung In BAIK

Seung In BAIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140170394
    Abstract: Disclosed is an environmentally-friendly sheet using a PLA resin. The environmentally-friendly sheet using the PLA resin according to the present invention comprises: a back layer; a printed layer which is formed on the upper part of the back layer, wherein a printing pattern is formed on the upper surface thereof; and a transparent layer formed on the upper part of the printed layer, wherein one or more of the back layer, the printed layer, and the transparent layer have a PLA (polylactic acid) resin.
    Type: Application
    Filed: August 16, 2012
    Publication date: June 19, 2014
    Applicant: LG Hausys, Ltd.
    Inventors: Seung Baik Nam, Jeong Ho Jeong, Jong Seok Son
  • Publication number: 20120156438
    Abstract: The present invention relates to a composite panel comprising: a surface-material layer; a substrate layer formed on the surface-material layer; and a profile which has the shape of a polygonal frame, receives the surface-material layer on the inside, is formed with a slot-in projection on at least one side and is formed with a slot-in recess on at least one side, and relates to a production method for the composite panel. The present invention can provide a composite material which entails a straightforward construction method and which can maintain a high degree of thermal conductivity and can minimise level differences in the constructed product surface, and provide a production method for the composite panel.
    Type: Application
    Filed: November 22, 2010
    Publication date: June 21, 2012
    Applicant: LG HAUSYS, LTD.
    Inventor: Seung Baik Nam
  • Publication number: 20120060007
    Abstract: A method and apparatus for controlling traffic of multiprocessor system or multi-core system is provided. The traffic control apparatus of a multiprocessor system according to the present invention includes a request handler for processing a traffic request of a first processor, and a Quality of Service (QoS) manager for receiving a QoS guaranty start instruction for a second processor from the multiprocessor system, and for transmitting, when traffic of the second processor is detected, a traffic adjustment signal to the request handler. The request handler adjusts the traffic of the first processor according to the received traffic adjustment signal. The traffic control method and apparatus of the present invention is capable of adjusting the required bandwidths of individual technologies and guaranteeing the real-timeness in the multiprocessor system or multi-core system.
    Type: Application
    Filed: September 2, 2011
    Publication date: March 8, 2012
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Min Seung BAIK, Joong Baik KIM, Seung Wook LEE, Soon Wan KWON
  • Patent number: 7678466
    Abstract: Disclosed herein is a flooring comprising a surface layer made of a synthetic resin, and a wood-based board as a base. Preferably, the surface layer includes a printed layer formed by general gravure, transfer, heat-sublimation, silk screen or digital printing using a printer, a protective made of a synthetic resin, and a UV-curable or heat-curable surface treatment layer. The wood-based board is selected from plywood, medium-density fiberboard (MDF), high-density fiberboard (HDF), particle board, and resin-wood flour composite board. The flooring may further comprise a bottom layer laminated under the wood-based board for protecting the flooring against moisture from the bottom. The flooring is cut into pieces having an appropriate size, and the pieces are processed into a finished product in a tongue and groove (T & G) shape.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: March 16, 2010
    Assignee: LG Chem, Ltd.
    Inventor: Seung-Baik Nam
  • Publication number: 20090197036
    Abstract: Disclosed is a wood flooring containing laminated wood and high-density fiberboard using a symmetric structure and a process for manufacturing the same. The wood flooring includes a high-density fiberboard core layer and an upper laminated wood layer and lower laminated wood or veneer layer symmetrically stacked about the high-density fiberboard core layer to achieve a stable structure, and the lower laminated wood or veneer layer has a density of 100±30% of that of the upper laminated wood layer to keep the balance therebetween. With this configuration it is possible to completely eliminate deformation problems caused by variation of environmental conditions such as temperature, humidity, etc., and to impart the natural texture of raw lumber and high durability to the flooring surface.
    Type: Application
    Filed: July 25, 2006
    Publication date: August 6, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-chul Hwang, Jae-Wan Sung, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Bum-Soo Kim
  • Publication number: 20090049786
    Abstract: Disclosed herein is a low-priced flooring comprising a transfer-printed high-density fiberboard (HDF). According to the flooring, an aqueous primer layer is formed on a high-density fiberboard as a core layer and transfer printing is performed on the surface of the primer layer to form a printed layer so that the background fiber pattern of the high-density fiberboard is covered, the adhesion of the core layer to the printed layer is enhanced, and the natural beauty of wood is faithfully imparted to the surface of the flooring.
    Type: Application
    Filed: October 20, 2006
    Publication date: February 26, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-Chul Hwang, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Jae-Wan Sung
  • Publication number: 20050281986
    Abstract: Disclosed herein is a flooring comprising a surface layer made of a synthetic resin, and a wood-based board as a base. Preferably, the surface layer includes a printed layer formed by general gravure, transfer, heat-sublimation, silk screen or digital printing using a printer, a protective made of a synthetic resin, and a UV-curable or heat-curable surface treatment layer. The wood-based board is selected from plywood, medium-density fiberboard (MDF), high-density fiberboard (HDF), particle board, and resin-wood flour composite board. The flooring may further comprise a bottom layer laminated under the wood-based board for protecting the flooring against moisture from the bottom. The flooring is cut into pieces having an appropriate size, and the pieces are processed into a finished product in a tongue and groove (T & G) shape.
    Type: Application
    Filed: April 14, 2005
    Publication date: December 22, 2005
    Inventor: Seung-Baik Nam