Abstract: A semiconductor device is provided as follows. A first fin-type pattern is disposed on a substrate. A first field insulating film is adjacent to a sidewall of the first fin-type pattern. A second field insulating film is adjacent to a sidewall of the first field insulating film. The first field insulating film is interposed between the first fin-type pattern and the second field insulating film. The second field insulating film comprises a first region and a second region. The first region is closer to the sidewall of the first field insulating film. A height from a bottom of the second field insulating film to an upper surface of the second region is larger than a height from the bottom of the second field insulating film to an upper surface of the first region.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A liquid crystal display including a first substrate and a second substrate facing the first substrate, a gate line and a data line on the first substrate, a thin film transistor coupled to the gate line and the data line, a pixel electrode coupled to the thin film transistor, and a common electrode overlapping the pixel electrode with an insulating layer therebetween, and including a plurality of branch electrodes and a connector coupling the branch electrodes, the common electrode overlapping the data line and extending in parallel with the data line, wherein a width of the connector of the common electrode is about 8.0 ?m to about 13.5 ?m.

Abstract: Disclosed is a method of wiring a coil in parallel around a stator having a plurality of teeth, which includes the steps of: winding the coil around a tooth starting from a top or a bottom of the stator; continuously winding the coil around an adjacent tooth when winding on the tooth is completed; cutting an end portion of the coil positioned at either the top or the bottom of the stator; wiring the cut end portion of the coil using a bus-bar; and wiring a neutral point to the other end of either the top or the bottom of the stator.

Abstract: A display module and a display apparatus having the same are provided. The display module including a circuit board, a plurality of light emitting device packages disposed on the circuit board and electrically coupled to the circuit board, and a coating unit coated with coating solution containing a light diffusion agent covers the plurality of light emitting device packages and fills in a gap between the plurality of light emitting device packages, wherein the coating unit further includes at least one first light diffusion part that is curvedly formed on a surface of the coating unit onto which light emitted from the light emitting device packages is incident.

Abstract: A condensed cyclic compound and an organic light-emitting device including the condensed cyclic compound are provided.

Abstract: The present invention relates to a multi-luminous element and a method for manufacturing the same. The present invention provides the multi-luminous element comprising: a buffer layer disposed on a substrate; a first type semiconductor layer disposed on the buffer layer; a first active layer which is disposed on the first type semiconductor layer and is patterned to expose a part of the first type semiconductor layer; a second active layer disposed on the first type semiconductor layer which is exposed by the first active layer; and a second type semiconductor layer disposed on the first active layer and the second active layer, the first and second active layers being repeatedly disposed in the horizontal direction, and the method for manufacturing the same. The multi-luminous element according to the present invention reduces loss of light emitting efficiency and can generate multi-wavelength light by repeatedly disposing the first and second active layers in the horizontal direction.

Abstract: A catalyst for reforming hydrocarbons may include an inorganic oxide and a catalyst metal supported on the inorganic metal oxide. At least a portion of the catalyst metal may be supported in the form of a solid-solution particle. The catalyst metal may include a first metal (selected from cobalt, iron, copper, and manganese); nickel; and magnesium.

Abstract: A stator of a motor having a bus-bar wiring structure according to the present invention includes: a stator core configured of a core base in which a plurality of teeth is formed; an upper insulator coupled to a top of the stator core to insulate the teeth; a lower insulator coupled to a bottom of the stator core; a coil wound around the teeth when the upper insulator and the lower insulator are coupled; and a lower bus-bar housing coupled to a top of the upper insulator and having a plurality of bus-bar insertion units formed to insert a plurality of bus-bars.

Abstract: A method of preparing graphene includes supplying a gas on a metal catalyst, the gas including CO2, CH4, and H2O, and reacting and cooling the resultant.

Abstract: A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Abstract: A novel condensed cyclic compound and an organic light emitting device including the same are disclosed.

Abstract: Disclosed herein are zirconium alloy compositions having a low hydrogen pick-up rate and high hydrogen embrittlement resistance. This zirconium alloy composition can be usefully used as a nuclear fuel components in a nuclear power plant because it has a very low hydrogen pick-up rate and high hydrogen embrittlement resistance under operation environments of nuclear power plant.

Abstract: A zirconium alloy is manufactured through melting; solution heat treatment at 1,000 to 1,050° C. (?) for 30 to 40 min and ?-quenching using water; preheating at 630 to 650° C. for 20 to 30 min and hot rolling at a reduction ratio of 60 to 65%; primary intermediate vacuum annealing at 570 to 590° C. for 3 to 4 hr and primarily cold-rolled at a reduction ratio of 30 to 40%; secondary intermediate vacuum annealing at 560 to 580° C. for 2 to 3 hr and secondarily cold-rolled at a reduction ratio of 50 to 60%; tertiary intermediate vacuum annealing at 560 to 580° C. for 2 to 3 hr and tertiarily cold-rolled at a reduction ratio of 30 to 40%; and final vacuum annealing at 460 to 590° C. for 7 to 9 hr.

Abstract: A novel condensed cyclic compound and an organic light emitting device including the same are disclosed.

Abstract: A condensed cyclic compound and an organic light-emitting device including the condensed cyclic compound are provided.

Abstract: A zirconium alloy is manufactured through melting; solution heat treatment at 1,000 to 1,050° C. for 30 to 40 min and ?-quenching using water; preheating at 630 to 650° C. for 20 to 30 min and hot rolling at a reduction ratio of 60 to 65%; primary intermediate vacuum annealing at 570 to 590° C. for 3 to 4 hr and primarily cold-rolled at a reduction ratio of 30 to 40%; secondary intermediate vacuum annealing at 560 to 580° C. for 2 to 3 hr and secondarily cold-rolled at a reduction ratio of 50 to 60%; tertiary intermediate vacuum annealing at 560 to 580° C. for 2 to 3 hr and tertiarily cold-rolled at a reduction ratio of 30 to 40%; and final vacuum annealing at 440 to 650° C. for 7 to 9 hr.

Abstract: A binder composition for an electrode of a capacitive deionization apparatus includes a hydrophilic polymer, a cross-linking agent, an ion exchange group, and a latex in a form of an emulsion polymer having an ionic functional group on the surface.

Abstract: A guitar effector module includes: a component circuit board in which an analog guitar effector circuit is formed; a module case in which a knob for adjusting a sound by a circuit is mounted, and the component circuit board is installed therein; and a circuit connection unit, in which a circuit input unit, a circuit output unit, and a circuit power supply unit with respect to the circuit are formed, which is electrically connected with the component circuit board, and is installed on an external side of the module case.

Abstract: The present invention relates to a filter module including a substrate, a plurality of filters formed on the substrate, an amplifier formed on the substrate, a connection part for connecting the plurality of filters and the amplifier to the substrate, and a cover layer formed on the substrate to cover the plurality of filters and the amplifier.