Abstract: An ultrathin module is provided for special types of semiconductor devices such as image sensor devices and micro-electro-mechanical system (MEMS) devices. In the module, a chip cover is directly attached to a semiconductor chip so as to protect a light-sensing area or mechanical elements of the chip. The chip cover may also be used as a lens assembly and an infrared light filter. In a fabrication method, the chips are provided on a wafer, and the chip covers are attached to the chips, respectively, before the wafer is sliced to separate the chips from one another.

Abstract: A circuit board and a semiconductor package having the same are provided. The circuit board comprises a base substrate having interconnections, and solder ball lands disposed on one surface of the base substrate. The solder ball lands respectively have land holes having different sizes. The land hole disposed at the center portion of the base substrate and the land hole disposed at the edge portion of the base substrate may have different sizes. For example, the sizes of the land holes may increase from the center portion of the base substrate to the edge portion thereof, and alternatively, the sizes of the land holes may decrease from the center portion of the base substrate to the edge portion thereof.

Abstract: A method for manufacturing a semiconductor device may comprise preparing a wafer having a front surface and a back surface. The wafer may have a plurality of semiconductor chips and scribe lines between the adjacent semiconductor chips. The wafer may be sawn along the scribe lines to form grooves between the adjacent semiconductor chips. A liquid protection material may be screen printed or spin-coated to form a protection layer on the back surface and within the grooves. The protection layer within the grooves may be more narrowly cut to form individual semiconductor devices and to leave a protection layer remaining thereon.

Abstract: An ultrathin module is provided for special types of semiconductor devices such as image sensor devices and micro-electro-mechanical system (MEMS) devices. In the module, a chip cover is directly attached to a semiconductor chip so as to protect a light-sensing area or mechanical elements of the chip. The chip cover may also be used as a lens assembly and an infrared light filter. In a fabrication method, the chips are provided on a wafer, and the chip covers are attached to the chips, respectively, before the wafer is sliced to separate the chips from one another.

Abstract: An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract: A size reduced solid-state imaging apparatus may be provided. The solid-state imaging apparatus may include a wiring substrate having a body having a cavity on an area which a semiconductor chip may be mounted, a lead that may project inward into the cavity from the internal side of the body, and/or a tie bar.

Abstract: PURPOSE: A semiconductor package and a method for fabricating the same are provided to shorten a length of a signal line for connecting a semiconductor chip with a substrate and simplify a structure of the semiconductor package.

Abstract: A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract: A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract: An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract: In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other chips are bonded by means of a non-conductive adhesive that contains highly insulating beads. Encapsulation of the package is by a molding compound. A nitride film or an organic insulating film is disposed on a back side of the chips bonded by the non-conductive adhesive to improve the withstand voltage between these chips and the die pad.

Abstract: A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.

Abstract: A thin semiconductor package having a support film formed on an upper surface of the inner leads with a thickness approximately equal to the thickness of a portion of the molding compound overlaying the inner leads.