Patents by Inventor Seung Mo Kim
Seung Mo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12263713Abstract: An air conditioner for a vehicle may include a first air conditioner provided on the engine compartment side with respect to a dash panel, and including an intake unit of suctioning internal or external air and blowing same to the vehicle interior side; and a second air conditioner provided on the vehicle interior side with respect to the dash panel, and including a duct for discharging conditioned air to the vehicle interior side. The dash panel has a through hole formed therein, and has an air guide which connects the first air conditioner and the second air conditioner to each other through the through hole.Type: GrantFiled: April 29, 2020Date of Patent: April 1, 2025Assignees: Hyundai Motor Company, Kia Corporation, Hanon SystemsInventors: Seung Ho Lee, Seo-Jun Yoon, Sang Ki Lee, Yong Sik Kim, Myung Hun Kang, Eung Young Kim, Jung Mo Kwak
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Publication number: 20250102786Abstract: Disclosed are an open-top two-photon light sheet microscope and an operating method thereof. The open-top two-photon light sheet microscope is capable of obtaining high-depth imaging, high-contrast resolution, and double contrast based on a Bessel beam, and enables rapid three-dimensional imaging by continuously capturing tissue on a per-plane basis without an optical clearing process or a sectioning process, and an operating method thereof.Type: ApplicationFiled: August 27, 2024Publication date: March 27, 2025Applicants: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION, THE ASAN FOUNDATION, FOUNDATION FOR INDUSTRY COOPERATION UNIVERSITY OF ULSANInventors: Ki Hean KIM, Won Yeong PARK, Su Il JEON, Seung-Mo HONG, Jinho SHIN
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Patent number: 12257587Abstract: A filter manufacturing method includes: folding a filter media up and down and forming a wrinkle shape composed of a plurality of bent parts and a connection part connecting adjacent bent parts among the plurality of bent parts; and forming a conductive coating layer pattern on the filter media. The filter manufacturing method further includes: electrically connecting a first end and a second end of the conductive coating layer pattern to a first power source. In particular, the conductive coating layer pattern includes a plurality of parallel patterns, and the plurality of parallel patterns are formed to be positioned on the connection part.Type: GrantFiled: April 4, 2024Date of Patent: March 25, 2025Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Seoul National University R&DB FoundationInventors: Dong Ho Kwon, Gee Young Shin, Myung Hoe Kim, Seung Sik Han, Seung Hwan Ko, Sung Geun Han, Jin Mo Kim
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Publication number: 20250091086Abstract: A cooking utensil having a thermochromic layer including a thermochromic pigment for a temperature sensor, includes: a metal substrate; a primer layer including a fluorine-based resin formed on at least a part of a surface of the metal substrate; a thermochromic layer including a thermochromic pigment formed on at least a part of a surface of the primer layer; and a top coating layer including a curing agent formed on surfaces of the primer layer and the thermochromic layer. The thermochromic pigment is a thermochromic pigment for a temperature sensor using bismuth vanadate.Type: ApplicationFiled: October 19, 2022Publication date: March 20, 2025Applicant: CFC Teramate Co., LTD.Inventors: Chi Won MOON, Jin Mo KIM, Seung Yup JEON, Ho Jun LEE, Ju Ho CHO, Ji Hye MIN
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Publication number: 20250092708Abstract: Proposed is a seismic-resistant joint structure of a PC column and a PC beam using a steel bracket, in which a steel bracket is installed on a PC column by protruding therefrom to mount a PC beam to the PC column so that the PC column and the PC beam are simply joined by using a bolt fastening method, thereby reducing construction and finishing work while preventing accidents to shorten a construction period, and enabling the implementation of the performance of an intermediate moment frame or higher.Type: ApplicationFiled: September 13, 2024Publication date: March 20, 2025Inventors: Jeong Wook KIM, Jun Sam KIM, Jin Mo AHN, Seung Je LEE, Byong Kap JEON
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Publication number: 20250091879Abstract: The present invention relates to: a method for preparing a non-oxidized carbon nanotube dispersion through mechanical impregnation so as to apply carbon nanotubes having a hydrophobic surface and a bundle shape as a high-performance conductive material of a negative electrode or a positive electrode for a secondary battery through solvent dispersion without acid treatment; and a non-oxidized carbon nanotube dispersion for a conductive material of a secondary battery, prepared by the method.Type: ApplicationFiled: November 5, 2024Publication date: March 20, 2025Inventors: Seung Yol JEONG, Byeong Guk KIM, Ick Jun KIM, Sun Hye YANG, Geon Woong LEE, Hye Jung LEE, Soo Yeon JEONG, Jung Mo KIM, Ji Hyeon RYU, Hee Jin JEONG
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Publication number: 20250096389Abstract: Provided is a battery pack and a vehicle including the same. The battery pack includes a plurality of pouch-type battery cells, a pack case having an inner space in which the plurality of pouch-type battery cells are accommodated, and a cell cover at least partially surrounding and supporting at least some of the plurality of pouch-type battery cells. The cell cover includes a first cover portion covering one side surface of at least one of the plurality of battery cells, a second cover portion covering the other side surface of at least one of the plurality of battery cells, and a third cover portion connecting the first cover portion to the second cover portion and covering an upper end portion of the at least one battery cell. A first venting hole through which gas or flame is discharged is formed in at least one portion of the third cover portion.Type: ApplicationFiled: July 14, 2023Publication date: March 20, 2025Applicant: LG Energy Solution, Ltd.Inventors: Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Jin-Yong Park, Se-Yun Chung, Myung-Woo Lee, Song-Ju Shin, Ho-June Chi, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Hyun-Mo Yoon, Tae-Kyeong Lee, Jong-Ha Jeong, Ji-Soo Hwang
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Publication number: 20250095971Abstract: A plasma processing apparatus includes: a plasma chamber; a radio frequency (RF) power supply configured to generate plasma in the plasma chamber; an electromagnet configure to apply a magnetic field to the plasma; and a pulse current generator configured to provide a pulse current to the electromagnet, wherein each period of the pulse current includes a first section and a second section subsequent to the first section, and the pulse current generator is further configured to: provide, at the first section, the pulse current to the electromagnet in a first direction to generate the magnetic field, and provide, at the second section, the pulse current to the electromagnet in a second direction opposite to the first direction to reduce intensity of the magnetic field generated at the first section.Type: ApplicationFiled: April 19, 2024Publication date: March 20, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Mo LEE, kyung-Sun Kim, Dong Hyeon Na, Jung Hyun Song, Myeong Soo Shin, Seung Bo Shim, Kui Hyun Yoon, Jun Ho Lee, Woong Jin Cheon, Dong Seok Han
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Patent number: 12251926Abstract: Disclosed herein are a metastructure having a zero elastic modulus zone, which can experience constant stress in a predetermined strain zone, and a method for designing the same. The metastructure includes a first unit and a second unit, wherein the first unit has a structure capable of buckling and has a stress-strain relation having a zone corresponding to a negative elastic modulus, the second unit is disposed adjacent to the first unit and has a stress-strain relation having a zone corresponding to a positive elastic modulus, and the metastructure has zero elastic modulus in a predetermined target strain zone through synthesis of the negative elastic modulus of the first unit with the positive elastic modulus of the second unit.Type: GrantFiled: December 19, 2022Date of Patent: March 18, 2025Assignee: CENTER FOR ADVANCED META-MATERIALSInventors: Bong Kyun Jang, Jae Hyun Kim, Se Jeong Won, Hak Joo Lee, Seung Mo Lee, Kwang Seop Kim
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Publication number: 20250087826Abstract: A battery pack includes a plurality of pouch-type battery cells; a pack case accommodating the pouch-type battery cells in the internal space; and a cell cover. The cell cover includes two unit covers at least partially spaced apart, provided to at least partially surround at least some of the pouch-type battery cells among the plurality of pouch-type battery cells in the internal space of the pack case. The cell cover is configured to allow venting gas to be discharged into the separation space between the two unit covers, thereby ensuring excellent safety when a thermal event occurs. Moreover, the present application discloses a battery module and a vehicle including the same.Type: ApplicationFiled: July 13, 2023Publication date: March 13, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
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Publication number: 20250070365Abstract: A cell assembly according to the present disclosure includes a cell stack including one pouch-type battery cell or two or more pouch-type battery cells stacked; and a cell cover covering two side portions of the cell stack along a widthwise direction of the cell stack and a top portion of the cell stack, wherein the cell cover is configured to adjust a width of the cell cover according to a width of the cell stack.Type: ApplicationFiled: August 7, 2023Publication date: February 27, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jin-Yong Park, Woo-Yong Kwon, Seung-Joon Kim, In-Soo Kim, Song-Ju Shin, Myung-Woo Lee, Jong-Mo Kang, Kyung-Woo Kim, Duck-Hee Moon, Tae-Kyeong Lee, Se-Yun Chung, Jong-Ha Jeong, Ho-June Chi, Ji-Soo Hwang
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Publication number: 20250061827Abstract: A method of generating compensating data for a pixel circuit differences in a display device includes displaying a test image of pixels of the display device; generating a first camera image by photographing the test image; applying a test input signal to each of the pixels and sensing corresponding test outputs, wherein the test input signal is at least one of a test current and a test voltage; generating weights for the pixels based on the test outputs; generating a second camera image by applying the weights to the first camera image; and generating compensation data for the pixels based on the second camera image.Type: ApplicationFiled: June 3, 2024Publication date: February 20, 2025Inventors: Hak Mo CHOI, Se Yun KIM, Hyung Woo YIM, Hui Su KIM, Seung Ho PARK
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Patent number: 12230431Abstract: A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.Type: GrantFiled: February 4, 2021Date of Patent: February 18, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: No Il Park, Seung Mo Lim, Tae Jun Choi, Boum Seock Kim, Byung Soo Kang
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Patent number: 12205746Abstract: A coil component includes a body having one surface and the other surface, opposing each other, both lateral surfaces respectively connecting the one surface and the other surface and opposing each other, and both end surfaces respectively connecting the both lateral surfaces and opposing each other; a coil unit disposed in the body; a first external electrode and a second external electrode, respectively connected to the coil unit and disposed to be spaced apart from each other on the one surface of the body; and a first insulating layer covering the other surface of the body, the both lateral surfaces of the body, and the both end surfaces of the body.Type: GrantFiled: February 1, 2021Date of Patent: January 21, 2025Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hwan Yang, Seung Mo Lim, Tae Jun Choi, Byung Soo Kang, Yong Hui Li, Tai Yon Cho, No Il Park, Yoon Mi Cha, Boum Seock Kim, Seung Min Lee
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Publication number: 20250020445Abstract: Proposed are a wafer inspection apparatus and a method of inspecting a wafer using the wafer inspection apparatus. The proposed wafer inspection apparatus includes a horizontal magnetic field generation unit arranged proximate to a lateral surface of a wafer and forming a magnetic field in such a manner that lines of magnetic force propagate in a horizontal direction, a vertical magnetic field generation unit arranged under the wafer and generating a magnetic field in such a manner that lines of magnetic force propagate in a direction vertical to the wafer, an image measurement unit arranged over the wafer and measuring an image of the wafer, and a wafer movement stage moving the wafer in a first direction and a second direction.Type: ApplicationFiled: July 12, 2024Publication date: January 16, 2025Inventors: Chan Yong HWANG, Kyoung Woong MOON, Chang Soo KIM, Sang Sun LEE, Seung Mo YANG
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Patent number: 12062833Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.Type: GrantFiled: April 28, 2023Date of Patent: August 13, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
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Publication number: 20230335883Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.Type: ApplicationFiled: April 28, 2023Publication date: October 19, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan MANGRUM, Hyung Jun CHO, Byong Jin KIM, Gi Jeong KIM, Jae Min BAE, Seung Mo KIM, Young Ju LEE
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Publication number: 20230259549Abstract: The present disclosure relates to an image search system and method using extraction of a feature point of an object from an image. More specifically, the present disclosure relates to an image search system and method using extraction of a feature point of an object from an image in order to extract an object and a feature point from an image and turn the object and the feature point into big data, and extract an image satisfying a search condition and provide the image.Type: ApplicationFiled: July 20, 2021Publication date: August 17, 2023Inventor: Seung Mo KIM
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Patent number: 11677135Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad.Type: GrantFiled: January 27, 2021Date of Patent: June 13, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
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Publication number: 20220415733Abstract: In one example, an electronic device comprises a cavity substrate comprising a substrate base comprising a top side and a bottom side and a cavity wall over the substrate base and defining a cavity, an electronic component over the substrate base and in the cavity, a lid comprising a top side and a bottom side, wherein the lid is over the substrate base and the cavity wall to define an interior of the cavity and an exterior of the cavity, an adhesive between the bottom side of the lid and a top side of the cavity wall, and a vent seal between the interior of the cavity and the exterior of the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 29, 2021Publication date: December 29, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kwang Seok Oh, Chang Uk Jang, Jin Seok Ryu, Seung Jae Yu, Weilung Lu, Adrian Arcedera, Seung Mo Kim, Kyung Han Ryu, Yi Seul Han, Woo Jun Kim, Tae Yong Lee