Patents by Inventor Seung Mo Kim

Seung Mo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090296374
    Abstract: An optical member includes a base body, a plurality of light-concentrating lenses and a plurality of light-diffusing patterns. The base body has a first surface and a second surface which is opposite to the first surface and receives light from light sources. The light-concentrating lenses are formed on the first surface. The light-diffusing patterns are respectively formed at positions of the second surface respectively corresponding to the light sources to reduce an amount of light reflected by the light-concentrating lenses. Each of the light-diffusing patterns includes curved surfaces extending in a first direction and has a width which is in a predetermined range. The light-diffusing patterns are separated from one another in a second direction substantially perpendicular to the first direction.
    Type: Application
    Filed: May 19, 2009
    Publication date: December 3, 2009
    Inventors: Seung-Mo Kim, Kang-Woo Lee, Jin-Sung Choi
  • Publication number: 20090180298
    Abstract: An optical sheet (140) includes a base layer (142a) and a light condensing pattern (142b) formed on the base layer integrally with the base layer and including one or more peaks and one or more valleys. Each of the base layer and the light condensing pattern includes a continuous phase and a dispersed phase. The dispersed phase is stretched in a main stretching direction.
    Type: Application
    Filed: August 13, 2008
    Publication date: July 16, 2009
    Inventors: Dong-Hoon Kim, Jin-Sung Choi, Joong-Hyun Kim, Seung-Hwan Chung, Seung-Mo Kim
  • Publication number: 20090168183
    Abstract: The present invention relates to an optical member for controlling light refraction and a display. An optical member of the present invention includes a base material and a foaming portion having a large number of foam elements. According to the present invention, a reflection or diffusion sheet can be manufactured by controlling the size of foam elements in the optical member. In addition, there is provided an optical member, which is formed of a foaming resin, which has no light diffusing agent in a base material layer and does not require a conventional stretching process, thereby securing light scattering power.
    Type: Application
    Filed: December 9, 2008
    Publication date: July 2, 2009
    Inventors: Seung-Mo KIM, Kim Joong-Hyun, Choi Jin-Sung, Kim Dong-Hoon
  • Publication number: 20080278949
    Abstract: An optical sheet includes a base film, a plurality of prism patterns and a plurality of first embossing patterns. The prism patterns are formed on an upper surface of the base film. Each of the prism patterns has the shape of a trigonal prism and includes a first inclined surface and a second inclined surface. The first and second inclined surfaces are inclined with respect to the upper surface of the base film and meet each other at a peak portion. First embossing patterns are formed at the peak portion.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 13, 2008
    Inventors: Dong-Hoon Kim, Jin-Sung Choi, Jeong-Hwan Lee, Seung-Mo Kim
  • Publication number: 20080106672
    Abstract: A polarizing plate includes a base layer, a buffer layer and a plurality of conductive lattice lines. The buffer is formed on the base layer. The conductive lattice lines are formed on the buffer layer in a stripe shape to reflect and polarize incident light. The buffer layer protects the conductive lattice lines. The conductive lattice lines include a silver (Ag) layer or an aluminum (Al) layer. Therefore, the buffer layer protects the conductive lattice lines, so that the lifetime of the polarizing plate may be increased. Furthermore, the display quality of a display panel and a display device having the polarizing plate may be enhanced.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 8, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joong-Hyun Kim, Jin-Sung Choi, Jeong-Hwan Lee, Seung-Mo Kim, Jin-Mi Jung, Kang-Woo Lee
  • Publication number: 20080068532
    Abstract: A liquid crystal display (“LCD”) device includes an LCD panel, light sources disposed under the LCD panel, a diffusion film disposed between the light sources and the LCD panel, the diffusion film including a film body including a base resin and diffusion elements distributed in the base resin, and a light shield layer formed on a surface of the film body to correspond to the light sources, and an optical plate disposed between the light sources and the diffusion film.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 20, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-mo KIM, Tae-seok JANG, Jin-sung CHOI, Jeong-hwan LEE, Dong-hoon KIM
  • Publication number: 20080062720
    Abstract: A backlight assembly includes a light generating unit, a light guide plate guiding light supplied from the light generating unit, at least one optical sheet disposed over the light guide plate, and a protection sheet disposed over the optical sheet. The protection sheet includes a diffusion layer formed on a first side of the protection sheet facing the optical sheet. The diffusion layer has a thickness in a range from about 5 ?m to about 100 ?m. The protection sheet further includes a scratch prevention layer formed on a second side located opposite the first side. The scratch prevention layer has a thickness in a range from about 1 ?m to about 10 ?m.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 13, 2008
    Inventors: Seung-Hwan Chung, Jeong-Hwan Lee, Seung-Mo Kim, Jin-Mi Jung
  • Publication number: 20070040958
    Abstract: An annealing apparatus and a method of annealing a protection sheet is provided. The annealing method includes disposing the protection sheet in a chamber and injecting high-pressure carbon dioxide (CO2) gas into the chamber or heating the protection sheet at a predetermined temperature in the chamber. In the annealing method a crystalline phase of molecules in the protection sheet is changed to be an amorphous phase of molecules by such that the protection sheet has a refractive index with substantially the same distribution.
    Type: Application
    Filed: August 14, 2006
    Publication date: February 22, 2007
    Inventors: Jin-Sung Choi, Seung-Mo Kim, Jheen-Hyeok Park
  • Patent number: 7009283
    Abstract: A semiconductor package having a fully encapsulated heat sink is disclosed, along with leadframes for making the package. A semiconductor chip is mounted on a surface of the heat sink. The heat sink is in an electrically insulative, thermally conductive connection with a plurality of leads that extend from a first end that overhangs the heat sink to an second end outside of the package body. A ring of a double sided adhesive tape attaches the heat sink to the overhanging portion of the leads. The heat sink design minimizes voids and damage caused by the encapsulation process, while maintaining thermal performance comparable to conventional, exposed heat sinks.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: March 7, 2006
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher J. de Simone, Lucian M. Hand, Gi Jeong Kim, Seung Mo Kim, Jin An Lee
  • Patent number: 6424023
    Abstract: A leadframe and molded semiconductor package made using the leadframe are disclosed. The leadframe includes leads extending from a dam bar toward a central chip mounting region. A pseudo tie bar extends diagonally from three of the four corners of the dam bar toward the chip mounting region. A resin introduction slot is at the remaining corner of the dam bar. The resin introduction slot is wider than a space between adjacent leads. The leads adjacent to the resin introduction slot increase in width as they extend from the dam bar toward the chip mounting region. The leadframe is used to form a semiconductor package having a package body formed of a molded resin. The leadframe design minimizes voids and damage caused by the molding process.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: July 23, 2002
    Assignee: Amkor Technology, Inc.
    Inventors: Gi Jeong Kim, Seung Mo Kim, Jin An Lee