Abstract: A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.

Abstract: Disclosed is a full-color light emitting device with four leads in which three light emitting diode chips thereof having different light emission wavelengths can be individually controlled to realize emission of light beams of more diverse colors, while having a simplified connection structure, so that the light emitting device can be implemented even in the case in which a limited bonding area is provided. The device includes first through third sub-lead frames respectively having first through third leads, a main lead frame having a fourth lead, and a reflecting cup formed at one end of the fourth lead, and first through third light emitting diodes (LEDs) of different light emitting wavelengths mounted on a bottom surface of the reflecting cup. Each of the LEDs has first and second electrodes of different characteristics. The first electrode of the first LED and the first electrode of the second LED are commonly electrically connected to the first lead of the first sub-lead frame.