Patents by Inventor Seung Sik Kim

Seung Sik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250109084
    Abstract: A method for preparing neopentyl glycol, including: performing a hydrogenation reaction in a first hydrogenation reactor to obtain a first reaction product including neopentyl glycol; supplying the first reaction product to a flash drum to obtain hydrogen and a first degassed solution stream from which the hydrogen has been degassed; supplying the hydrogen to a second hydrogenation reactor; supplying the first degassed solution stream to a first heat exchanger to lower the temperature; supplying a part of the first degassed solution stream having the lowered temperature to the second hydrogenation reactor as a second branch stream; performing the hydrogenation reaction in the second hydrogenation reactor to obtain a second reaction product including neopentyl glycol; and introducing the second reaction product to a neopentyl glycol refining process to obtain neopentyl glycol.
    Type: Application
    Filed: September 1, 2023
    Publication date: April 3, 2025
    Inventors: Sung Kyun Kim, Sung Kyu Lee, Na Ro Ha, Seung Sik Cho
  • Patent number: 12263713
    Abstract: An air conditioner for a vehicle may include a first air conditioner provided on the engine compartment side with respect to a dash panel, and including an intake unit of suctioning internal or external air and blowing same to the vehicle interior side; and a second air conditioner provided on the vehicle interior side with respect to the dash panel, and including a duct for discharging conditioned air to the vehicle interior side. The dash panel has a through hole formed therein, and has an air guide which connects the first air conditioner and the second air conditioner to each other through the through hole.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 1, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Hanon Systems
    Inventors: Seung Ho Lee, Seo-Jun Yoon, Sang Ki Lee, Yong Sik Kim, Myung Hun Kang, Eung Young Kim, Jung Mo Kwak
  • Publication number: 20250101776
    Abstract: A locking mechanism for a console device, which restricts a console armrest of the console device disposed between a driver seat and a passenger seat inside a vehicle, includes a housing mounted on a front surface of a console box of the console device, a pivoting lever pivotably coupled to an inner surface of the housing, a slider pivotably coupled to an upper body of the pivoting lever, an inertial member interlocking portion coupled to a lower body of the pivoting lever, an inertial member seating portion which is mounted on the housing and on which an inertial member is seated, and the inertial member provided between the inertial member interlocking portion and the inertial member seating portion and configured to operate the inertial member interlocking portion when a collision of the vehicle occurs.
    Type: Application
    Filed: January 5, 2024
    Publication date: March 27, 2025
    Inventors: Min-Woo Kwon, Jae-Hyun An, Chang-Hoon Yang, Hong-Sik Chang, Sung-Hwan Kim, Seung-Mok Yu, Ji-Hun Lee
  • Publication number: 20250100280
    Abstract: An apparatus for manufacturing display devices includes: a stage; and a head unit disposed on the stage and including a nozzle unit. The head unit further includes a first coating portion covering a bottom surface of the head unit and at least a part of an inner surface of the nozzle unit, and where a thickness of at least a part of the first coating portion becomes narrower toward a top of the first coating portion.
    Type: Application
    Filed: June 4, 2024
    Publication date: March 27, 2025
    Inventors: Byeong Jun LEE, Jae Sik KIM, Jung Han SEO, Woo Yong SUNG, Kwan Hyuck YOON, Seung Ho YOON, Hye Min LEE, Seung Gun CHAE
  • Patent number: 12257587
    Abstract: A filter manufacturing method includes: folding a filter media up and down and forming a wrinkle shape composed of a plurality of bent parts and a connection part connecting adjacent bent parts among the plurality of bent parts; and forming a conductive coating layer pattern on the filter media. The filter manufacturing method further includes: electrically connecting a first end and a second end of the conductive coating layer pattern to a first power source. In particular, the conductive coating layer pattern includes a plurality of parallel patterns, and the plurality of parallel patterns are formed to be positioned on the connection part.
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: March 25, 2025
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Seoul National University R&DB Foundation
    Inventors: Dong Ho Kwon, Gee Young Shin, Myung Hoe Kim, Seung Sik Han, Seung Hwan Ko, Sung Geun Han, Jin Mo Kim
  • Patent number: 12252180
    Abstract: A lower cross member for a vehicle is disposed on a floor of a vehicle. The lower cross member includes a core member and a reinforcing layer. The core member is made of a composite material containing 70 wt. % or more of unidirectional carbon fibers, and the reinforcing layer is made of a composite material containing 70 wt. % or more of fiberglass.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: March 18, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Kolon Spaceworks Co., Ltd.
    Inventors: Sang Yoon Park, Seung Chan Lee, Yong Beom Lee, Pil Won Kang, Hyun Sik Kim, Sang Sun Park, Hee Seouk Chung, Seung Uk Kang, Chi Hoon Choi, Seong Jong Kim, Dong Won Kim
  • Publication number: 20250081704
    Abstract: A light emitting diode device including a substrate, a plurality of terminals disposed on the substrate, and a plurality of light sources disposed on the substrate, electrically connected to the plurality of terminals, and configured to emit light, in which each of the light sources includes a light emitting diode chip, and a wall surrounding side surfaces of the light emitting diode chip, at least one of the light sources includes a wavelength converter disposed on the light emitting diode chip, and at least two light sources share the wall.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Sik HONG, Hyuck Jun KIM
  • Publication number: 20250081442
    Abstract: A semiconductor device includes a common conductive line extending in a first direction; a memory cell array including a plurality of horizontal layers stacked in the first direction while sharing the common conductive line; and a selector structure operatively coupled to the common conductive line, wherein the selector structure includes, a plurality of select transistors stacked in the first direction; and a selector commonly coupled to the select transistors.
    Type: Application
    Filed: February 1, 2024
    Publication date: March 6, 2025
    Inventors: Seung Hwan KIM, Kang Sik CHOI
  • Publication number: 20250066925
    Abstract: A method of manufacturing interior parts for a vehicle includes: forming a first plating layer on a surface of an injection molded product through electroless plating; printing a symbol part on the first plating layer; partially removing the first plating layer to a size corresponding to the symbol part from a rear surface of the injection molded product; forming a second plating layer on the first plating layer; and removing the symbol part and the first plating layer from the surface of the injection molded product on which the second plating layer is formed.
    Type: Application
    Filed: December 15, 2023
    Publication date: February 27, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO.,LTD., ALPS ELECTRIC KOREA CO.,LTD.
    Inventors: Young Ju Lee, Kwang Pyo Cho, Hong Sik Chang, Seung Sik Han, Young Jai Im, Jun Sik Kim, Young Do Kim, Jung Sik Choi, Tae Kyoung Jung, In Ho Park, Seon Dong Kim, Dae Woo Park
  • Publication number: 20250069630
    Abstract: A semiconductor device may include a bit line extending in a third direction, a plurality of active layers extending in a first direction and contacting the bit line, a plurality of word lines extending in a second direction and each disposed at an top surface or bottom surface of each of the plurality of active layers, a plurality of capacitors contacting the plurality of active layers, and a contact formed in at least one active layer disposed at the uppermost part of the bit line, among the plurality of active layers. The bit line and the contact may be electrically connected or separated by using, as a control line, a word line disposed in the top surface or bottom surface of the at least one active layer, among the plurality of word lines.
    Type: Application
    Filed: December 19, 2023
    Publication date: February 27, 2025
    Inventors: Hyung Sik WON, Seung Hwan KIM, Jun Ho CHEON
  • Publication number: 20250065430
    Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.
    Type: Application
    Filed: November 16, 2022
    Publication date: February 27, 2025
    Inventors: Jun Sik KIM, Young Do KIM, Jung Sik CHOI, Tae Kyoung JUNG, Seung Ho KIM, In Ho PARK
  • Patent number: 12235054
    Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: February 25, 2025
    Assignee: HANON SYSTEMS
    Inventors: Seung Hark Shin, Woon Sik Kim, Dae Sung Noh, Hyunwoo Cho, Min Won Seo, Sung Hong Shin, Jong Du Lee, Jung Hyun Cho, Uk Huh
  • Publication number: 20250055039
    Abstract: A method of preparing a lithium secondary battery is provided which may effectively perform pre-lithiation, wherein, a closed square band-shaped lithium foil having an opening formed at a center thereof is prepared during the preparation of the lithium secondary battery, and a negative electrode is disposed in the opening of the lithium foil, but pre-lithiation of the negative electrode may be performed without a separate pre-lithiation process by disposing the negative electrode and the lithium foil so as not to overlap with each other and disposing a negative electrode tab so as to be in contact with the lithium foil.
    Type: Application
    Filed: October 29, 2024
    Publication date: February 13, 2025
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Gui Long JIN, Seung He WOO, Hyo Sik KIM
  • Publication number: 20250056881
    Abstract: A display device includes a display layer comprising pixels, each of the pixels having at least one thin-film transistor, a connection line electrically connected to the at least one thin-film transistor, the connection line being exposed on a lower surface of the display layer through a first contact hole formed in the display layer, a barrier layer disposed on the lower surface of the display layer and including a second contact hole connected to the first contact hole, a lead line disposed on a lower surface of the barrier layer and electrically connected to the connection line through the second contact hole, a pad part disposed on the lower surface of the barrier layer and electrically connected to the lead line, and a lower film overlapping the lower surface of the barrier layer and the lead line.
    Type: Application
    Filed: October 25, 2024
    Publication date: February 13, 2025
    Applicant: Samsung Display Co., Ltd.
    Inventors: Se Hoon JEONG, Seung Wook KWON, Jae Sik KIM, Woo Yong SUNG, Seo Yeon LEE, Ung Soo LEE, Ja Min LEE, Jeong Seok LEE, Seung Gun CHAE, Seung Yeon CHAE
  • Publication number: 20250051525
    Abstract: The present invention relates to a hydroxylphenyl-terminated polysiloxane, a polysiloxane-polycarbonate copolymer comprising the same as repeating unit, and a method for preparing the copolymer, and more specifically, a polysiloxane of a specific structure having terminal silane unit comprising optionally substituted hydroxylphenyl group, and a polysiloxane-polycarbonate copolymer which comprises the polysiloxane and a polycarbonate block as repeating units, and thereby shows the same or more excellent transparency and significantly further improved flame retardancy as compared with the level of conventional polysiloxane-polycarbonate copolymer, and a method for preparing the same.
    Type: Application
    Filed: July 4, 2022
    Publication date: February 13, 2025
    Applicant: SAMYANG CORPORATION
    Inventors: Seong Hyen HEO, Mi Ran KIM, Kyung Moo SHIN, Yun Ju CHANG, Seung Pil JUNG, Jin Sik CHOI, YU IL KIM, Jong Yoon KIM, Seong Woo SEO
  • Publication number: 20250053410
    Abstract: A firmware upgrade apparatus and method are disclosed. A firmware upgrade apparatus according to some embodiments of the present invention includes access points, a relay configured to upload firmware data to the access point, a node configured to upload the firmware data to the relay, and an over-the-air (OTA) access point configured to upload the firmware data to the node.
    Type: Application
    Filed: August 8, 2024
    Publication date: February 13, 2025
    Inventors: Seung Sik LEE, Ho Yong KANG, Ja Beom GU, Dae Ho KIM, Jung Sik SUNG, Jun Hee LEE
  • Publication number: 20250042746
    Abstract: The present disclosure describes to a method embodiment for preparing a carbon nanotube composite that includes performing a first ultrasonic treatment on a first mixture containing a carbon nanotube (CNT) fiber and an acid to form a carbon nanotube fiber swollen body, and performing a second ultrasonic treatment on a second mixture containing the carbon nanotube fiber swollen body, an aromatic monomer, and an initiator to form a carbon nanotube composite including a surface coated with an aromatic monomer-derived conductive polymer, and an embodiment of the carbon nanotube composite prepared therefrom.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 6, 2025
    Inventors: Gwan Sik Kim, Kyong Hwa Song, Deok Woo Yun, Hyeon Su Jeong, Seung Min Kim, Nam Dong Kim, Sung Ju Lee
  • Publication number: 20250046608
    Abstract: A method for fabricating a semiconductor device is provided. The method comprises providing a mask which includes first particles, and second particles spaced apart from the first particles, on a surface of the mask, applying a first adhesive over the first particles on the mask, irradiating the first adhesive with light on a first position of the first particles to cure the first adhesive, resulting in a cured first adhesive, forming a first adhesive film from the cured first adhesive in which the first particles are stuck to the first adhesive and removing the first adhesive film on the mask, wherein the first adhesive overlaps a first region of the surface of the mask in which the first particles are disposed, and does not overlap a second region spaced laterally from the first region of the mask.
    Type: Application
    Filed: February 14, 2024
    Publication date: February 6, 2025
    Inventors: Jin Wook Jung, Young Duk Suh, Sun Moon Kim, Myung-Sik Lee, Seung Hee Lee, Do Hyun Jung
  • Publication number: 20250044660
    Abstract: An optical path control member according to an embodiment includes a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; a light conversion unit disposed between the first electrode and the second electrode and including a plurality of accommodating parts in which a light conversion material is disposed; and a first sealing part and a second sealing part formed in a cutting region formed by cutting the second substrate, the second electrode, and the light conversion unit, and extending in a first direction, wherein the first sealing part and the second sealing part include a sealing region disposed inside the cutting region and an anchor region disposed inside the accommodating part, respectively, and wherein a size of the anchor region of the first sealing part is greater than a size of the anchor region of the second sealing part.
    Type: Application
    Filed: November 23, 2022
    Publication date: February 6, 2025
    Inventors: Jong Sik LEE, Seung Jin KIM, Jin Gyeong PARK, Joon Jae OH
  • Patent number: D1066038
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: March 11, 2025
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Hyo Eun Lee, Jun Sik Moon, Ga Young Kim, Bom I Park, Jae Kwon Yun, Seung Ho Jung