Abstract: A wireless receiver is disclosed. The wireless receiver includes a phased array antenna panel having a plurality of antennas, and a low resolution analog-to-digital (A/D) converter coupled to each of the plurality of antennas, where the low resolution A/D converter is configured to provide a digital output based on comparing a reference value with a sum of noise value and signal value of an analog input received by the corresponding one of the plurality of antennas. Noise signals received by the plurality of antennas are uncorrelated, and a signal to noise ratio (SNR) of the analog input can be less than one. The low resolution A/D converter can be a one-bit A/D converter. The one-bit A/D converter can be a comparator receiving the sum of noise value and signal value as one comparator input, and receiving the reference value as another comparator input.

Abstract: A wireless receiver includes an antenna receiving a right-handed circularly polarized (RHCP) signal and a left-handed circularly polarized (LHCP) signal, a first amplifier and a second amplifier coupled to the antenna, an intermediate summer coupled to the first and second amplifiers and providing a first intermediate signal, an intermediate subtractor coupled to the first and second amplifiers and providing a second intermediate signal. The wireless receiver also includes a V-signal summer providing a V-component output based on a sum of the first intermediate signal and the second intermediate signal, and an H-signal subtractor providing an H-component output based on a difference between the first intermediate signal and the second intermediate signal. The wireless receiver is configured to provide the V-component output and the H-component output without using a phase shifter.

Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.

Abstract: A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

Abstract: A wireless transceiver using a phased array antenna panel for concurrently transmitting and receiving wireless signals is disclosed. The wireless transceiver includes receive antennas forming a receive configuration and transmit antennas forming a transmit configuration. The receive antennas form a receive beam at a receive frequency based on phase and amplitude information provided by a master chip in the phased array antenna panel. The transmit antennas form a transmit beam at a transmit frequency based on phase and amplitude information provided by the master chip in the phased array antenna panel. The phase and amplitude information for the receive antennas is provided by an RF front end chip that is connected to the master chip. The phase and amplitude information for the transmit antennas is provided by the RF front end chip that is connected to the master chip.

Abstract: The present disclosure provides for a fabrication layout and design for transmission lines that are implemented as part of a differential Wilkinson power divider/combiner. The transmission lines are configured and arranged in a poly-loop line geometry. The poly-loop line geometry includes overlapping transmission lines to route differential signals within the differential Wilkinson power divider/combiner. The overlapping transmission lines each include a crossover region to route the differential signals. The crossover represents a spacing between the overlapping transmission lines that encompasses a magnetic flux of the overlapping transmission lines.

Abstract: A stacked synthesizer for wide local oscillator (LO) generation using a dynamic divider. The phase locked loop can include a plurality of voltage controlled oscillators (VCOs), and a selector that can be configured to select an output of one of the plurality of VCOs. The selected output of one of the plurality of VCOs can be provided to an on-chip dynamic divider and to an off-chip dynamic divider for LO sharing. The dynamic dividers can be configured to generate synthesizer outputs based on a multiplication of the selected output of one of the plurality of VCOs by a factor (1+1/M), where M is a variable number.

Abstract: An electronic device has a force touch function. The electronic device includes an image display module having a touch electrode. A cover window attaches to a front surface of the image display module. A housing receives the image display module therein, and supports the cover window. A panel moving part is between the housing and the image display module. A driving circuit senses a touch force based on a distance between the image display module and the housing which are spaced from each other with the panel moving part interposed in-between.

Abstract: The present disclosure provides for a fabrication layout and design for transmission lines that are implemented as part of a differential Wilkinson power divider/combiner. The transmission lines are configured and arranged in a poly-loop line geometry. The poly-loop line geometry includes overlapping transmission lines to route differential signals within the differential Wilkinson power divider/combiner. The overlapping transmission lines each include a crossover region to route the differential signals. The crossover represents a spacing between the overlapping transmission lines that encompasses a magnetic flux of the overlapping transmission lines.

Abstract: An electronic device includes circuitry configured to determine an antenna operation mode for one or more antenna arrays. The circuitry is further configured to control the one or more antenna arrays to operate in a combined antenna mode via a Wilkinson combiner. The circuitry is also configured to control the one or more antenna arrays to operate in an isolated antenna mode via a single-pole, multi-throw switch.

Abstract: A stacked synthesizer for wide local oscillator (LO) generation using a dynamic divider. The phase locked loop can include a plurality of voltage controlled oscillators (VCOs), and a selector that can be configured to select an output of one of the plurality of VCOs. The selected output of one of the plurality of VCOs can be provided to an on-chip dynamic divider and to an off-chip dynamic divider for LO sharing. The dynamic dividers can be configured to generate synthesizer outputs based on a multiplication of the selected output of one of the plurality of VCOs by a factor (1+1/M), where M is a variable number.

Abstract: A reconfigurable antenna structure includes first and second reconfigurable antennas, a configuration module, and an antenna processing circuit. The first reconfigurable antenna is configured, in response to a first configuration signal, to have a first radiation pattern and to have a first frequency bandwidth and the second reconfigurable antenna is configured, in response to a second configuration signal, to have a second radiation pattern and to have a second frequency bandwidth. The configuration module is configured to generate the first and second configuration signals. The antenna processing circuit is configured to send one or more transmit signals to one or more of the first and second reconfigurable antennas for transmission via one or more of the channels of interest and receive one or more receive signals from the one or more of the first and second reconfigurable antennas.

Abstract: A poly spiral antenna includes spiral antenna sections and interconnecting traces. A first spiral antenna section has a first interwoven spiral pattern and a first excitation configuration to provide a first radiation pattern component. A second spiral antenna section has a second interwoven spiral pattern and a second excitation configuration to provide a second radiation pattern component. A third spiral antenna section has a third interwoven spiral pattern and a third excitation configuration to provide a third radiation pattern component. The interconnecting traces couple the first, second, and third spiral antenna sections together such that the first, second, and third radiation pattern components form a radiation pattern of the poly spiral antenna.

Abstract: In accordance with one example, an antenna structure includes a three-dimensional dipole antenna having a first arm and a second arm that are suspended above a ground plane. One or more three-dimensional monopole antennas have corresponding monopole elements positioned in a plane of symmetry between the arms of the dipole. Other examples are disclosed.

Abstract: A system and method utilizes an array of unit coils for wireless charging and/or near field communication. The array of unit coils can be configured to provide magnetic fields of various shapes to accommodate consuming devices and/or to accommodate types of devices. The array of unit coils can be any type of coils (e.g., eccentric coils that provide a concentrated current field and a strong magnetic field). The array of unit coils can be powered by one or more power sources.

Abstract: A three-dimensional multiple spiral antenna includes a substrate, a plurality of spiral antenna sections, and a feed point module. The substrate has a three-dimensional shaped region and each spiral antenna section is supported by a corresponding section of the three-dimensional shaped region and conforms to the corresponding section of the three-dimensional shaped region such that, collectively, the spiral antenna sections have an overall shape approximating a three-dimensional shape. The feed point module is coupled to a connection point of at least one of the spiral antenna sections.

Abstract: An antenna array structure includes a plurality of antennas, wherein a first antenna has a first geometric shape, provides a first radiation pattern, and has a first frequency bandwidth. A second antenna has a second geometric shape to provide a second radiation pattern and has a second frequency bandwidth. The first and second frequency bandwidths at least partially overlap to include channels of interest. An antenna processing circuit sends one or more transmit signals to one or more of the antennas for transmission via one or more of the channels of interest and receives one or more receive signals from the one or more of the antennas or from another one or more of the antennas via the one or more of the channels of interest or from another one or more of the channels of interest.

Abstract: An RF structure includes a PA, a PA ground switch coupled between the PA output and ground, a LNA, and a LNA ground switch coupled between the LNA input and ground. The RF structure includes a plurality of directional antenna structures, each including an antenna, a transmit quarter wavelength circuit coupled between the PA output and the antenna, a receive quarter wavelength circuit coupled between the antenna and the LNA input, and an antenna switch coupled between the antenna and ground. Switch control circuitry controls the PA ground switch, the LNA ground switch, and the plurality of antenna switches during transmit and receive operations to control the flow of RF receive signals from the antennas to the LNA and the flow of RF transmit signals from the PA to the antennas. The transmit and receive quarter wavelength circuits may be traces or be constructed of lumped circuit elements.

Abstract: Disclosed are a method of modeling a haptic signal from a haptic object, a display apparatus, and a driving method thereof, which realize a tactile sense having a shape and texture of a haptic object. The method includes obtaining measurement data corresponding to a shape of a texture object while moving a sensor unit with respect to a haptic object including the texture object, obtaining force measurement data corresponding to a level of pressure applied to the haptic object, calculating shape modeling data and impulse modeling data corresponding to the texture object, based on the measurement data, calculating friction force modeling data corresponding to the texture object, based on the force measurement data, generating setting information of a haptic signal corresponding to the haptic object, based on the shape modeling data, the impulse modeling data, and the friction force modeling data, and storing the setting information of the haptic signal.

Abstract: A touch sensing system and a driving method thereof are provided. The touch sensing system includes: a touch screen drive circuit which senses a change in the amount of electric charge in touch sensors during a sensing period, generates raw data and temporarily stores it in a buffer memory, transmits the raw data read out from the buffer memory to an algorithm execution unit during a raw data transmission period, and calculates the coordinates of touch input by the algorithm execution unit during an algorithm execution period. The touch screen drive circuit controls the amount of data stored in the buffer memory and the start timing of a read operation to make the sensing period and the raw data transmission period overlap each other.