Abstract: A touch panel, a touch method of the touch panel, and a touch apparatus are provided. The touch panel includes: a touch layer including a plurality of touch areas; a pre-touch detection module configured to detect, among the plurality of touch areas, a touch area opposite to a touch object, the touch object being at a distance from the touch layer, the distance being greater than 0; and a pre-touch feedback module configured to generate a feedback signal based on the detected touch area. The feedback signals corresponding to the touch areas are different.

Abstract: The present disclosure provides a mobile terminal, including: a display screen provided at a front side of the mobile terminal; a first camera provided at a back side of the mobile terminal; and an instruction generator provided between the first camera and the display screen, and configured to generate a homepage key instruction signal in response to the first camera being pressed by a first operation mode, and the homepage key instruction signal instructs the display screen to wake up or display a home page.

Abstract: The present disclosure provides a camera module and a mobile device having the same. The camera module includes a main lens disposed to a back surface of the mobile device and at least one function key. The at least one function key is located on the back surface of the mobile device and adjacent to the main lens, and connected to a control system of the mobile device. The at least one function key corresponds to at least one control command of the control system when triggered.

Abstract: A fingerprint identification circuit, a method for manufacturing the fingerprint identification circuit, and a display device are provided. The fingerprint identification circuit includes: an array substrate and an opposite substrate arranged opposite to the array substrate; a fingerprint identification member arranged at a side of the array substrate proximate to the opposite substrate; and a backlight source arranged at a side of the array substrate distal to the opposite substrate. A light-shielding member and a partially-transparent member are arranged on the opposite substrate. An orthogonal projection of the partially-transparent member onto the array substrate at least partially overlaps an orthogonal projection of the fingerprint identification member onto the array substrate.

Abstract: A fingerprint identification device includes a base substrate, a plurality of photosensitive elements and an elastically deformable layer arranged at a first side of the base substrate, and a backlight source arranged at a second side of the base substrate. A light beam from the backlight source is capable of passing through a gap between two adjacent photosensitive elements toward the elastically deformable layer. The elastically deformable layer is nontransparent in the case of not being pressed by a finger, and capable of being deformed in such a manner as to correspond to valleys and ridges of the finger in the case of being pressed by the finger.

Abstract: Methods of magnetically shielding an MRAM structure on all six sides in a thin wire or thin flip chip bonding package and the resulting devices are provided. Embodiments include forming a first metal layer embedded between an upper and a lower portion of a PCB substrate, the first metal layer having a pair of metal filled vias laterally separated; attaching a semiconductor die to the upper portion of the PCB substrate between the pair of metal filled vias; connecting the semiconductor die electrically to the PCB substrate through the pair of metal filled vias; removing a portion of the upper portion of the PCB substrate outside of the pair of metal filled vias down to the first metal layer; and forming a second metal layer over and on four opposing sides of the semiconductor die, the second metal layer landed on the first metal layer.

Abstract: An encoding and decoding method, where the decoding method includes obtaining first information of a coding tree unit (CTU) in a to-be-decoded picture from a bitstream, where the first information indicates an allowed value range of a width-to-height ratio of a coding unit (CU) obtained by dividing the CTU, obtaining division information of the CTU from the bitstream, dividing the CTU into one or more CUs based on the first information and the division information, where a width-to-height ratio of the one or more CUs falls within the value range indicated by the first information, and the plurality of CUs do not overlap each other, and decoding the one or more CUs to obtain a reconstructed pixel of the one or more CUs.

Abstract: The present disclosure provides a pixel structure, a driving method thereof, a display substrate and a display device. The pixel structure includes a plurality of subpixels arranged on a substrate. Alignment directions of liquid crystals at a region corresponding to the adjacent subpixels in an identical row are not completely identical to each other, and/or alignment directions of liquid crystals at a region corresponding to the adjacent subpixels in an identical column are not completely identical to each other.

Abstract: An approach is provided for determining whether to reboot a computing node. Data specifying user behaviors and intra-box and inter-box factors associated with computing nodes are collected and classified in groups. Rules corresponding to the groups are generated. Each rule includes an indicator of whether the corresponding group is associated with permitting or not permitting a reboot. Computing node data is received which specifies inter-box and inter-box factors of the computing node and user operations of the computing node. After determining that the computing node data matches one of the groups, it is determined that a rule corresponding to the group includes an indicator of whether the computing node is permitted to be rebooted. Based on the indicator, the computing node is rebooted or not rebooted.

Abstract: Methods of magnetically shielding an MRAM structure on all six sides in a thin wire or thin flip chip bonding package and the resulting devices are provided. Embodiments include forming a first metal layer embedded between an upper and a lower portion of a PCB substrate, the first metal layer having a pair of metal filled vias laterally separated; attaching a semiconductor die to the upper portion of the PCB substrate between the pair of metal filled vias; connecting the semiconductor die electrically to the PCB substrate through the pair of metal filled vias; removing a portion of the upper portion of the PCB substrate outside of the pair of metal filled vias down to the first metal layer; and forming a second metal layer over and on four opposing sides of the semiconductor die, the second metal layer landed on the first metal layer.

Abstract: A method of coding implemented by a decoding device. The method includes receiving a bitstream from an encoding device, the bitstream containing a minimum block width and a minimum block height, partitioning a current block into sub-blocks until one of the sub-blocks reaches the minimum block width or the minimum block height, determining pixel values for the one of the sub-blocks that has reached the minimum block width or the minimum block height, and displaying, on a display of an electronic device, an image generated using the pixel values that were determined.

Abstract: Methods of magnetically shielding an MRAM structure on all six sides in a thin wire or thin flip chip bonding package and the resulting devices are provided. Embodiments include forming a first metal layer embedded between an upper and a lower portion of a PCB substrate, the first metal layer having a pair of metal filled vias laterally separated; attaching a semiconductor die to the upper portion of the PCB substrate between the pair of metal filled vias; connecting the semiconductor die electrically to the PCB substrate through the pair of metal filled vias; removing a portion of the upper portion of the PCB substrate outside of the pair of metal filled vias down to the first metal layer; and forming a second metal layer over and on four opposing sides of the semiconductor die, the second metal layer landed on the first metal layer.

Abstract: A mechanism of video coding is provided. The mechanism includes generating a reconstructed video frame. Noise suppression filter parameters are determined by partitioning the reconstructed video frame into blocks and matching the blocks to create patches. The noise suppression filter parameters are then determined based on the patches by creating a transformed matrix of patch frequencies. The noise suppression filter parameters include a noise estimation parameter that is a function of patch frequency. The noise suppression filter parameters are then employed to apply a noise suppression filter to the reconstructed video frame.

Abstract: A method of coding implemented by a decoding device. The method includes receiving a bitstream from an encoding device, parsing the bitstream to determine whether a directional prediction mode or a non-directional prediction mode is signaled, using non-directional intra prediction to generate an image when the non-directional prediction mode is signaled, parsing a distance-weighted directional intra prediction (DWDIP) flag from the bitstream when the directional prediction mode is signaled to determine whether the DWDIP flag has a first value or a second value, using distance-weighted directional intra prediction to generate the image when the DWDIP flag has the first value, using directional intra prediction to generate the image when the DWDIP flag has the second value, and displaying, on a display of an electronic device, the image generated.

Abstract: A video coding device selects a current block for sub-block based affine inter-prediction, and derives a sub-block size for a sub-block of the current block. The sub-block size includes a sub-block width and a sub-block height. The device determines a unidirectional width threshold (TwU), a bidirectional width threshold (TwB), a unidirectional height threshold (ThU), and a bidirectional height threshold (ThB), where a total value of TwB and ThB exceeds a total value of TwU and ThU. The device determines that the affine inter-prediction is unidirectional inter-prediction or bidirectional inter-prediction. Based on the determination, the device applies the TwU or the TwB to the sub-block width, and applies the ThU or the ThB to the sub-block height. The device then derives a motion vector for the sub-block based on motion vectors for the current block, the sub-block width, and the sub-block height.

Abstract: Cognitive expected program code installation result assessment by a method that includes collecting environment information about a cloud computing environment and collecting description information about program code for potential installation. The method maintains a hierarchical model for determining whether the program code is expected to install properly on the computer system, and uses the hierarchical model for such determining, including performing an analysis that proceeds through level(s) of the model based on the description information and arrives at an indication as to whether the program code is expected to install properly. The method performs processing based on determining whether the program code is expected to install properly, for instance by generating and providing a recommendation to a user regarding installation of the program code.

Abstract: An optical fingerprint identification device includes a cover plate, a piezoluminescent layer, an optical sensing layer and a patterned light shield layer. The piezoluminescent layer is arranged under the cover plate, and has a changed state of light emission when subjected to a pressure, to emit light of a certain wavelength. The optical sensing layer is configured to detect the light reflected by a finger. The patterned light shield layer is arranged between the optical sensing layer and the piezoluminescent layer, and is configured to block the light from directly going into the optical sensing layer.

Abstract: The present disclosure discloses an image registration method and apparatus. The method includes: determining a target plane; orthogonally projecting the optical center of each of the cameras in the planar camera array onto the target plane, to obtain a projected point of the optical center of each of the cameras; generating a rectangular grid on the target plane according to the projected points of the optical centers of the cameras in the planar camera array; obtaining a target grid point of each of the cameras according to the rectangular grid; determining a target camera coordinate system of each of the cameras; and registering, images collected by the cameras in the planar camera array. In embodiments of the present disclosure a target camera coordinate system of a camera is determined again, thereby greatly reducing complexity of subsequent image registration.

Abstract: A thick steel plate for high heat input welding and having great heat-affected area toughness and a manufacturing method therefor, comprising the steps of smelting, casting, rolling, and cooling. Also, the chemical composition of the steel plate satisfies 1?Ti/N?6 and (Ca+REM+Zr)/Al?0.11, where the effective S content in steel=S-0.8Ca-0.34REM-0.35Zr. and the effective S content in steel: 0.0006-0.005%; finely dispersed inclusions may be formed, and the amount of composite inclusion CaO+Al2O3+MnS+TiN in the steel plate is at a proportion of ?12%. With respect to welding in which the thickness of the steel plate is 50-70 mm, the tensile strength of a base material is ?510 MPa. and welding input energy is 200-400 kJ/cm, the average Charpy impact work of a welding heat-affected area of the steel plate at ?40 ° C. is 100 J or more, and at the same time, the average Charpy aging impact work of the base material of ½ thickness at ?40° C. is 46 J or more.

Abstract: A thick steel plate for high heat input welding and having great heat-affected area toughness and a manufacturing method therefor, comprising the steps of smelting, casting, rolling, and cooling. Chemical composition is properly controlled for the steel plate and satisfies 1?Ti/N?6 and Mg/Ti>0.017, where effective S content in steel=S?1.3 Mg?0.8 Ca?0.34 REM?0.35 Zr, and effective S content in steel: 0.0003-0.003%; finely dispersed inclusions may be formed in the steel plate, and the amount of composite inclusion MgO+Ti2O3+MnS in the steel plate is controlled at a proportion greater than or equal to 5%. The tensile strength of a base material so acquired is ?510 MPa, insofar as welding input energy is 200?400 kJ/cm, the average Charpy impact work of the steel plate at ?40 ° C. is 100 J or more, at the same time, the average Charpy aging impact work of the base material of ½ thickness at ?40° C. is 46 J or more.