Abstract: In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Abstract: In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Abstract: In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Abstract: Structures and methods for recovering data in a semiconductor memory device are disclosed herein. In one embodiment, a method of recovering data in a semiconductor memory device, can include: (i) pre-conditioning a first memory cell on the semiconductor memory device by using a formation voltage to program a first data state in the first memory cell; (ii) storing a second data state in a second memory cell on the semiconductor memory device by maintaining the second memory cell in a virgin state; (iii) mounting the semiconductor memory device on a printed-circuit board (PCB) by using a high temperature process that increases a resistance of the first memory cell; and (iv) performing a recovery of the first data state by reducing the resistance of the first memory cell.

Abstract: In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Abstract: An N-channel transistor protection circuit and method are disclosed that prevent gated diode breakdown in N-channel transistors that have a high voltage on their drain. The disclosed N-channel protection circuit may be switched in a high voltage mode between a high voltage level and a lower rail voltage. A high voltage conversion circuit prevents gated diode breakdown in N-channel transistors by dividing the high voltage across two N-channel transistors, MXU0 and MXU1, such that no transistor exceeds the breakdown voltage, Vbreakdown. An intermediate voltage drives the top N-channel transistor, MXU0. The top N-channel transistor, MXU0, is gated with a voltage level that is at least one N-channel threshold, Vtn, below the high voltage level, Vep, using the intermediate voltage level, nprot.

Abstract: A method and apparatus are disclosed for detecting if a semiconductor circuit has been exposed to ultra-violet light. An ultra-violet light detection circuit detects exposure to ultra-violet light and will automatically activate a security violation signal. The security violation signal may optionally initiate a routine to clear sensitive data from memory or prevent the semiconductor circuit from further operation. The ultra-violet light detection circuit detects whether a semiconductor circuit has been exposed to ultra-violet light, for example, by employing a dedicated mini-array of non-volatile memory cells. At least two active bit lines, blprg and bler, are employed corresponding to program and erase, respectively. One of the bit lines is only programmable and the other bit line is only eraseable. Generally, all of the bits in the dedicated non-volatile memory array are initially in approximately the same state, which could be erased, programmed or somewhere in between.

Abstract: An emulated EEPROM memory array is disclosed based on non-volatile floating gate memory cells, such as Flash cells, where a small group of bits share a common source line and common row lines, so that the small group of bits may be treated as a group during program and erase modes to control the issues of program disturb and effective endurance. The bits common to the shared source line make up the emulated EEPROM page which is the smallest unit that can be erased and reprogrammed, without disturbing other bits. The memory array is physically divided up into groups of columns. One embodiment employs four memory arrays, each consisting of 32 columns and 512 page rows (all four arrays providing a total of 1024 pages with each page having 8 bytes or 64 bits). A global row decoder decodes the major rows and a page row driver and a page source driver enable the individual rows and sources that make up a given array.

Abstract: A multi-mode architecture is disclosed for a semiconductor circuit, such as a smart card, microcontroller or another single-chip data processing circuit. The disclosed semiconductor circuit supports at least two modes of operation. A memory management unit restricts each application to a predetermined memory range and enforces certain mode-specific restrictions for each memory partition. In a secure kernel mode, all resources and services on the semiconductor circuit, such as special function registers, are accessible. In an application mode, certain special function registers are not accessible (and thus, the resources associated with such special function registers are also not accessible). The operating system is normally executed in a secure kernel mode, where most, if not all resources are accessible. Likewise, a user application is normally executed in a user mode, where certain resources are not accessible.

Abstract: A method and apparatus are disclosed for detecting if a semiconductor circuit has been exposed to ultra-violet light. An ultra-violet light detection circuit detects exposure to ultra-violet light and will automatically activate a security violation signal. The security violation signal may optionally initiate a routine to clear sensitive data from memory or prevent the semiconductor circuit from further operation. The ultra-violet light detection circuit detects whether a semiconductor circuit has been exposed to ultra-violet light, for example, by employing a dedicated mini-array of non-volatile memory cells. At least two active bit lines, blprg and bler, are employed corresponding to program and erase, respectively. One of the bit lines is only programmable and the other bit line is only eraseable. Generally, all of the bits in the dedicated non-volatile memory array are initially in approximately the same state, which could be erased, programmed or somewhere in between.

Abstract: An N-channel transistor protection circuit and method are disclosed that prevent gated diode breakdown in N-channel transistors that have a high voltage on their drain. The disclosed N-channel protection circuit may be switched in a high voltage mode between a high voltage level and a lower rail voltage. A high voltage conversion circuit prevents gated diode breakdown in N-channel transistors by dividing the high voltage across two N-channel transistors, MXU0 and MXU1, such that no transistor exceeds the breakdown voltage, Vbreakdown. An intermediate voltage drives the top N-channel transistor, MXU0. The top N-channel transistor, MXU0, is gated with a voltage level that is at least one N-channel threshold, Vtn, below the high voltage level, Vep, using the intermediate voltage level, nprot.

Abstract: An emulated EEPROM memory array is disclosed based on non-volatile floating gate memory cells, such as Flash cells, where a small group of bits share a common source line and common row lines, so that the small group of bits may be treated as a group during program and erase modes to control the issues of program disturb and effective endurance. The bits common to the shared source line make up the emulated EEPROM page which is the smallest unit that can be erased and reprogrammed, without disturbing other bits. The memory array is physically divided up into groups of columns. One embodiment employs four memory arrays, each consisting of 32 columns and 512 page rows (all four arrays providing a total of 1024 pages with each page having 8 bytes or 64 bits). A global row decoder decodes the major rows and a page row driver and a page source driver enable the individual rows and sources that make up a given array.

Abstract: An non-volatile read only memory transistor for use in a memory array is disclosed. The non-volatile read only memory transistor features a substantially vertically oriented channel fabricated in a trench formed in the substrate. The channel length is dependent upon the depth of the trench and therefore a dense array of NROM transistors can be formed without adversely affecting the channel length and therefore the operational performance of the transistor.

Abstract: A method is provided to determine erase threshold voltages of memory transistors and thereby identify unusable memory transistors. A voltage is applied to the common source of a selected memory transistor and gradually incremented until a logical HIGH bit is read as a logical LOW bit. By iteratively incrementing Vbias, the erase threshold voltage for each memory transistor can be determined. In one process, the erase threshold voltage for each memory transistor in a memory device is determined and then the memory device is put under stress tests to simulate normal operative conditions. After the stress tests, the erase threshold voltage of each memory transistor can be once again determined to ascertain the change in the erase threshold voltage, i.e., the data retention characteristic, of each memory transistor.

Abstract: Method and apparatus for a memory circuit having a sense amplifier circuit having a sensing amplifier connected to read the data content output of a memory cell where the sense amplifier circuit includes a current source transistor having a gate terminal and having a drain terminal connected to a voltage supply and having a source terminal connected to the sensing amplifier, with a selectable source current in order to account for variation from a desired source current due to variations in the designed source current transistor performance parameters.

Abstract: A method for boosting potential in the channel of unselected memory cells on a selected bit-line. In this method, a first voltage is applied to all the word-lines of the memory cells in the string. A second voltage is then applied to word-lines adjacent the selected word lines to isolate the selected memory cell. Next, a programming voltage is applied to the selected word-line. In one embodiment, a time delay is applied between applying the second voltage and applying the third voltages to ensure isolation of the selected memory cell before applying the third voltage.

Abstract: A bit line selector for a virtual ground non-volatile read only memory (“NROM”) cell array is disclosed. The selector transistors are oriented such that the channel length is perpendicular to the bit line and the channel width is parallel to the bit line. Subsequent reduction in the bit line pitch does not affect the channel width of the select transistors or their drive current.

Abstract: Programming lines are attached to reference cells of a memory device. A state machine controls voltages and/or currents applied to the reference cells via the programming lines to program and verify a program state of the reference cells. The state machine utilizes existing array cell programming operations conducted by the programming lines to the reference cells. The utilization of internal circuitry of the memory device in the programming of reference cells reduces the sort and test time of the memory device. The memory device may be a flash memory device or any device having reference cells, and the reference cells may be of any configuration or structure, including nitride layer cells.

Abstract: A refresh mechanism refreshes a supplied capacitor of a capacitor divider circuit at an interval that keeps an amount of charge degradation at a coupled up capacitor to less than a predetermined threshold. A node between the supplied capacitor and the coupled up capacitor provides a voltage sampling node having a divided voltage. Timing for the refresh operations may be established via internal clocks or internal oscillators running at multiples of other circuits already internal to the device utilizing the divided voltage. The divided voltage is then utilized for comparison, feedback (voltage regulation, for example), or other purposes. The invention is applicable to all types of circuits where degradation occurs due any type of leakage or other permutations affecting circuit operations.

Abstract: A decoder for decoding from two sides of a memory array. The decoder is positioned on two sides of the memory array. The decoder includes driver circuits that are connected to routing lines from the memory array. To reduce the size of the decoder, some of the routing lines extend from one side of the memory array and the remaining routing lines extend from the other side of the memory array.