Abstract: A memory system has the capability to adjust a program or erase voltage if the time to program or erase is excessive. The memory system comprises at least a memory cell, a voltage value storage device, a voltage source, and a voltage adjustment circuit. The voltage value storage device stores a voltage value. The voltage source receives and converts the voltage value into a voltage. The voltage source applies the voltage to at least one memory cell. The voltage adjustment circuit is also coupled to receive the stored voltage value. The voltage adjustment circuit determines the time required to program or erase at least one memory cell using the voltage value. If the time to program or erase at least one memory cell is excessive, the voltage adjustment circuit increments the voltage value stored in the voltage value storage device.

Abstract: A method of erasing a memory cell that has a first region and a second region with a channel therebetween and a gate above the channel, and a charge trapping region that contains an initial amount of charge. The method includes applying a first cycle of voltages across the gate and the first region so that the first amount of charge is removed from the charge trapping region. A second amount of charge is written into the charge trapping region and subsequently a second cycle of one or more voltages is applied across the gate and the first region so that the second amount of charge is removed from the charge trapping region, wherein the initial applied voltage of the second cycle of voltages is equal to the final applied voltage of the first cycle of voltages.

Abstract: A programmable reference current source used with a memory array during test and user modes to program or erase verify. The reference current source is programmable so that optimal reference currents can be determined during test mode. A value representing the optimal reference current is stored so that the reference current source provides the determined reference current during user mode.

Abstract: A technique to determine whether multiple memory cells are programmed or erased. After a program or erase operation, respective program or erase verify operations are performed. A logical gate is coupled to measure the state of each memory cell. When all memory cells selected to be programmed or erased are programmed or erased then the output of the logical gate indicates successful program or erase verify. Thus, by using a single logical gate coupled to measure the states of multiple memory cells, only the output of the logical gate need be measured to determine successful program or erase verification of multiple memory cells.

Abstract: A capacitor structure which exhibits a constant capacitance at non-negative voltages is provided by erasing a P-well floating gate NMOS transistor prior to its use as a capacitor. By erasing the transistor, a negative threshold voltage is obtained, thereby turning on the transistor and placing the transistor in an inversion state where the MOS capacitance is voltage-independent. Such transistors can be utilized as capacitors, whereby one plate of the capacitor corresponds to the control gate of the transistor and the other plate corresponds to the commonly connected source, drain, P-well, and deep N-well regions of the transistor, in voltage regulator circuits or other circuits in which node stabilization is desired. As a result, the capacitance is constant even at initialization when zero volts is applied.

Abstract: A block decoder includes a p-well. A low voltage source is coupled to the p-well for asserting a body bias voltage to the p-well. An n-type word line pass transistor is positioned within the p-well and is coupled to a word line for passing programming voltages to the word line. A high voltage source is coupled to pass circuitry configured to assert a voltage on a gate of the pass transistor. The low voltage source is configured to apply a voltage of approximately 10 volts or more to the p-well during programming, thus reducing the voltage between the source and body region (and thus the threshold voltage as well) of NMOS transistors disposed within the p-well. Therefore, the amount of voltage needed to be applied to the pass transistors is reduced. Furthermore, the pass circuitry can work for lower supply voltages since the supply voltage is limited by the threshold voltage of the n-type transistors within the p-well.

Abstract: The present invention provides a method of verifying that all flash EEPROM transistors in a NAND string are properly erased without overerasing by applying a bias voltage to the source of the bottom select gate of the NAND array and applying a non-negative erase verify voltage to the control gates of each transistor during an erase verify. The bias voltage is at least equal to the erased threshold voltage of the worst case transistor to ensure proper erase verification. If all transistors are not erased, then another erase operation is performed. Erasing is repeated until the erase verify operation indicates that all transistors are properly erased. By erasing and verifying according to the present invention, the NAND array is completely and properly erased while minimizing overerasing the array.

Abstract: An EEPROM NAND array has floating gate memory cells coupled in series, each having a control gate, a floating gate, a body region, and an insulating layer between the floating gate and the body region. A negative charge pump is coupled to the body region. In programming, the body region of the memory cell selected for programming is biased to a negative voltage by the negative charge pump while the control gate of the memory cell is biased to a predetermined positive voltage sufficient to induce Fowler-Nordheim tunneling from the body region into the floating gate. The present invention allows the programming voltage requirement at the control gate of a NAND EEPROM memory cell to be significantly reduced which allows for the peripheral voltage delivery circuitry in NAND EEPROM arrays to be designed for lower voltages than for conventional NAND EEPROM arrays.

Abstract: A non-volatile memory device includes a plurality of MOS transistors 34 and 36 connected to respective word lines 16 and 18 to allow individual pages of memory stored in the memory cells 8a, 10a and 8b, 10b on the respective word lines 16 and 18 to be erased and erase verified. A method of erasing a page of memory cells includes the steps of applying an erase voltage to one of the MOS transistors 16 and 18 to erase the page of memory cells along the respective word line, and applying an initial erase-inhibit floating voltage to other MOS transistors which are connected to the word lines unselected for page erase. In an erase verify mode, an erase verify voltage is applied to the word line which was selected for page erase in the erase mode, and an erase verify unselect voltage is applied to the word lines which was not selected for page erase.

Abstract: In the programming of a non-volatile memory device, such as a NAND flash memory device 100, a positive bias voltage V.sub.bias is applied to a bit line 44 to set a respective memory gate 44a in a programmed state. In a further embodiment, the positive bias voltage V.sub.bias is obtained by dividing the select drain gate voltage V.sub.cc using two resistors 56 and 58 connected in series.

Abstract: A method is provided for biasing a NAND array EEPROM during programming to allow the array to be scaled down further before reach punchthrough. The sources of the ground-select transistors of the NAND array are biased at V.sub.cc instead of ground to reduce the voltage drop across the source and drain of the ground-select transistors. As a result, the channel length of the ground-select transistors can be further shortened before punchthrough is obtained, resulting in a higher density EEPROM.

Abstract: A programmable reference used to identify a state of an array cell in a multi-density or low voltage supply flash EEPROM memory array. The programmable reference includes one or more reference cells, each reference cell having a floating gate which is programmed to control its threshold value. The array cells are read by applying an identical voltage to the gate of the array cell and the reference cell and comparing outputs to determine the array cell state. During read of an array cell, the programmable reference cell is biased the same as the array cell, so that the difference in threshold values between reference cells and array cells remain constant with a change in V.sub.CC. Circuitry is included for programming the reference cells utilizing a simple resistor ratio. Programming is performed at test time, preferably by the manufacturer, to assure V.sub.CC remains within strict tolerances.

Abstract: A flash memory including a page buffer with bias circuitry and a reference array enabling reading and verifying values stored on a word line of memory cells in parallel using the page buffer irrespective of temperature, Vcc, and process variations. The bias circuitry includes a cascode transistor having a source connected to the reference cell array which provides a single reference signal. The bias cascode couples the reference signal to an input of a bias inverter in the bias generator, while a bias load transistor in the bias generator couples Vcc to the bias inverter input. The page buffer includes a set of latches that are each coupled to a memory cell by a cascode. A first inverter in each latch has transistors with sizes matching the transistors in the bias inverter. A latch load transistor is connected between a pull-up and pull-down transistor of a second inverter in each latch and is sized to match the bias load transistor.

Abstract: A method for programing a cell in an array of flash memory cells connected to a bit line using hot-electron injection. In the method, a negative word line voltage is applied to unselected cells connected to the bit line to create a negative gate to source voltage in the unselected cells. The negative gate to source voltage in the unselected cells is provided to prevent overerased cells, or cells which have a negative threshold, from turning on to reduce bit line leakage current.

Abstract: A method of converging threshold voltages of memory cells in a flash EEPROM array after the memory cells have been erased, the method including applying a gate voltage having an initial negative value which is increased to a more positive value in steps during application of a drain disturb voltage. By applying a gate voltage with an initial negative value, leakage current during convergence is reduced enabling all cells on bit lines of the array to be converged in parallel.

Abstract: A gate power supply for supplying power to the gates of flash EEPROM memory cells in a multi-density or low voltage supply memory array to determine the states stored by the memory cells. The gate power supply includes a multi-phase voltage pump to increase voltage supplied to the gates of the memory cells above a system voltage supply, V.sub.CC to increase the working margin between memory cell states. The gate power supply further includes a low power supply standby pump to maintain the boosted voltage during an inactive mode. The wordline decoder for the memory is divided into sections with a large n-well parasitic capacitance of each decoder section acting as a reservoir to store the charge supplied by the low power standby pump. In an active mode, the parasitic capacitance in unselected decoder sections supplies power to the input of the selected diecoder section while the multi-phase pump is turning on.