Abstract: A compact high-brightness LED grow light fixture is described for use in growing plants under artificial light, or as a supplement to natural sunlight. The LED grow light uses a densely-packed array of high-brightness light emitting diodes (LEDs) that are not individually packaged where the array behaves similarly to a point source of light. The LED chips are distributed laterally over an area, where the LED chips have light emitting surfaces for emitting light in directions transverse to said area, wherein the dimensions of the area do not exceed 25 mm. Adjacent chips of the array are preferably separated by less than about 0.2 mm. The extended point source LED array, with its lens and associated reflector, result in a concentrated, partially-collimated light source, such that the intensity of the light does not diminish rapidly as distance from the light source increases. Thus, foliage that is lower down on the plant will receive almost as much light energy as does foliage on the top of the plant.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: A solar tracker includes a sunlight-detecting unit, a control unit, a first motor and a second motor. The sunlight-detecting unit detects the position of the sun. Based on the position of the sun, the control unit instructs the first motor to rotate a solar cell array and the second motor to tilt the solar cell array.

Abstract: At least one diffraction element is used to diffract light of multiple wavelengths into different wavelength components. Instead of moving the diffraction element as in certain prior filters, light from the at least one element is reflected back towards the at least one element so that light is diffracted at least twice by the at least one element. The reflection is such that at least one selected wavelength component of said wavelength components will pass from an input port to an output port or to another device.

Abstract: A solar tracker includes a sunlit-detecting unit, a control unit, a first motor and a second motor. The sunlit-detecting unit detects the position of the sun. Based on the position of the sun, the control unit instructs the first motor to rotate a solar cell array and the second motor to tilt the solar cell array.

Abstract: Disclosed is a controlling apparatus for use in a photovoltaic system. The photovoltaic system includes a solar cell array, an inverter and a solar tracker. The solar tracker includes a solar position sensor, a controller connected to the solar position sensor, a first motor connected to the controller for rotating the solar cell array according to the azimuth of the sun and a second motor connected to the controller for tilting the solar cell array according to the elevation of the sun. The controlling apparatus includes a central unit, a basic unit, a diagnosis unit, a maintenance unit, a security unit and a check unit.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: A monitoring system watches out at radiation dosage in areas of a radwaste warehouse remotely. The system uses a monitoring device to coordinate with the system. By using the system, the monitoring is safe and more than one area can be monitored at the same time.

Abstract: A monitoring system watches out at radiation dosage in areas of a radwaste warehouse remotely. The system uses a monitoring device to coordinate with the system. By using the system, the monitoring is safe and more than one area can be monitored at the same time.

Abstract: At least one diffraction element is used to diffract light of multiple wavelengths into different wavelength components. Instead of moving the diffraction element as in certain prior filters, light from the at least one element is reflected back towards the at least one element so that light is diffracted at least twice by the at least one element. The reflection is such that at least one selected wavelength component of said wavelength components will pass from an input port to an output port or to another device.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.

Abstract: In an epitaxial structure of a solid state lighting system, electrical current injection into the active layer is used to excite the photon emission. The present invention employs a unique waveguide layer in the epitaxial structure for trapping the light generated by the active layer in the fundamental waveguide mode. Multiple photonic crystal regions located either outside or inside one or more current injection regions extract photons from the waveguide layer(s). This novel design optimizes the interplay of electrical pumping, radiation and optical extraction to increase the optical output to several times that of conventional LEDs. A transparent and conductive ITO layer is added to the surface of an epitaxial structure to reduce the interface reflection in addition to functioning as a current spreading layer. The present invention creates solid state lighting with high optical output and high power efficiency.

Abstract: A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.

Abstract: A soft solder flowing into the recesses of a semiconductor thin film LED provides: (a) increased bonding strength and better mechanical durability, (b) improved heat dissipation, (c) enhanced light extraction when the LED film is bonded to a new carrier. Annealing localized islands of absorbing metal creates an ohmic contact. Those isolated islands are inter-connected by a layer of a highly reflective metal. This design enables a significant absorption reduction within the LED device and leads to a significant improvement of light extraction. Additionally, the light extraction efficiency of an isotropic light emitting device is improved via surface shaping of the device by a 2D-array of micro-lenses and photonic band gap structure. For manufacturability purpose the making of micron-size lenses of the surface of the chip may preferably be performed as a final step, preferably with optical lithography.

Abstract: A light-emitting diode (LED) for both AlGaInP- and GaN-based materials needs a good transparent current spreading layer to disseminate electrons or holes from the electrode to the active layer. The present invention utilizes a conductive and transparent ITO (Indium Tin Oxide) thin film with an ultra-thin (to minimize the absorption) composite metallic layer to serve as a good ohmic contact and current spreading layer. The present invention avoids the Schottky contact due to direct deposition of ITO on the semiconductor. For AlGaInP materials, a thick GaP current spreading layer is omitted by the present invention. For GaN-based LEDs with the present invention, semi-transparent Ni/Au contact layer is avoided. Therefore, the light extraction of LED can be dramatically improved by the present invention. Holes may be etched into the semiconductor cladding layer forming a Photonic Band Gap structure to improve LED light extraction.

Abstract: In an epitaxial structure of a solid state lighting system, electrical current injection into the active layer is used to excite the photon emission. The present invention employs a unique waveguide layer in the epitaxial structure for trapping the light generated by the active layer in the fundamental waveguide mode. Multiple photonic crystal regions with different characteristics located either outside or inside one or more current injection regions extract photons from the waveguide layer(s). The present invention creates solid state lighting with high optical output and high power efficiency.

Abstract: In an epitaxial structure of a solid state lighting system, electrical current injection into the active layer is used to excite the photon emission. The present invention employs a unique waveguide layer in the epitaxial structure for trapping the light generated by the active layer in the fundamental waveguide mode. Multiple photonic crystal regions located either outside or inside one or more current injection regions extract photons from the waveguide layer(s). This novel design optimizes the interplay of electrical pumping, radiation and optical extraction to increase the optical output to several times that of conventional LEDs. A transparent and conductive ITO layer is added to the surface of an epitaxial structure to reduce the interface reflection in addition to functioning as a current spreading layer. The present invention creates solid state lighting with high optical output and high power efficiency.

Abstract: A light-emitting diode (LED) for both AlGaInP- and GaN-based materials needs a good transparent current spreading layer to disseminate electrons or holes from the electrode to the active layer. The present invention utilizes a conductive and transparent ITO (Indium Tin Oxide) thin film with an ultra-thin (to minimize the absorption) composite metallic layer to serve as a good ohmic contact and current spreading layer. The present invention avoids the Schottky contact due to direct deposition of ITO on the semiconductor. For AlGaInP materials, a thick GaP current spreading layer is omitted by the present invention. For GaN-based LEDs with the present invention, semi-transparent Ni/Au contact layer is avoided. Therefore, the light extraction of LED can be dramatically improved by the present invention. Holes may be etched into the semiconductor cladding layer forming a Photonic Band Gap structure to improve LED light extraction.