Patents by Inventor Shanggar Periaman

Shanggar Periaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked die semiconductor package
    Patent number: 7279795
    Abstract: In one embodiment, the present invention includes a semiconductor package including a first semiconductor die with first active circuitry and a second semiconductor die with second active circuitry. An intermediate substrate may be located in the package between the first and second semiconductor dies to provide power to at least one of the dies. In this way, improved stacking within a single package is afforded. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: October 9, 2007
    Assignee: Intel Corporation
    Inventors: Shanggar Periaman, Kooi Chi Ooi
  • Stacked die semiconductor package
    Publication number: 20070152313
    Abstract: In one embodiment, the present invention includes a semiconductor package including a first semiconductor die with first active circuitry and a second semiconductor die with second active circuitry. An intermediate substrate may be located in the package between the first and second semiconductor dies to provide power to at least one of the dies. In this way, improved stacking within a single package is afforded. Other embodiments are described and claimed.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Shanggar Periaman, Kooi Ooi