Abstract: The present disclosure locates a new brown planthopper resistance gene BPH33.2 on the short arm of rice chromosome 4 by extreme mixed pool analysis (BSA-seq), and genetically transforming the gene BPH33.2 to make the susceptible rice to be the brown planthopper resistant phenotype rice; at the same time, the knockout of the gene BPH33.2 was used to cause the loss of the brown planthopper resistant phenotype in insect resistant rice, thus confirming the function of BPH33.2. The present disclosure also provides molecular markers closely linked with the rice brown planthopper resistance gene BPH33.2. Through experimental detection of molecular markers linked or co-segregated with these resistance loci, the brown planthopper resistance of rice plants can be accurately predicted at the seedling stage, accelerating the progress of the selection of brown planthopper-resistant rice varieties.

Abstract: An electronic anti-theft label of a nickel-titanium alloy temperature memory wire includes a first housing, a second housing with a boss, a locking beam, a locking catch, a rotating device, a nickel-titanium alloy temperature memory wire, and an unlocking device. The second coil on the unlocking device generates, after being energized, a magnetic field around. The second coil serving as a sending end is placed in a third groove, so that the first coil is induced to generate electricity by using the electromagnetic induction principle, and the first coil serves as a receiving end. The sending end sends an electromagnetic signal to the external environment under the action of electric power, and the receiving end receives the electromagnetic signal and converts the electromagnetic signal into current. The nickel-titanium alloy temperature memory wire is energized and heated to contract to drive the rotating device to move.

Abstract: Exemplary semiconductor processing methods may include providing a first silicon-containing precursor and a second silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The first silicon-containing precursors may include Si—O bonding. The methods may include forming a plasma of the first silicon-containing precursor and the second silicon-containing precursor in the processing region. The methods may include forming a layer of silicon-containing material on the substrate. The layer of silicon-containing material may be characterized by a dielectric constant less than or about 3.0.

Abstract: Exemplary semiconductor processing methods may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The methods may include forming a plasma of the silicon-containing precursor in the processing region. The plasma may be at least partially formed by a pulsing RF power operating at less than or about 2,000 W. The methods may include forming a layer of silicon-containing material on the substrate. The layer of silicon-containing material may be characterized by a dielectric constant less than or about 3.0.

Abstract: A novel spider electronic tag includes a take-up device; and a base connected to the take-up device through a retractable steel wire rope. The take-up device includes: a housing; a take-up assembly, mounted in the housing; and a locking fastener, mounted in the housing and configured to lock the take-up assembly; the locking fastener includes: a rotating ratchet member, fixedly arranged at the top of the take-up assembly; and a leaf spring, embedded in an inner circumferential wall of the housing and configured to cooperate with the rotating ratchet member to lock the take-up assembly. The steel wire rope is passed in a listed sequence through the rotating ratchet member, the take-up assembly and the base clockwise from top to bottom, and two ends of the steel wire rope are fixed inside the rotating ratchet member, to connect the take-up device with the base.

Abstract: Implementations of chip packaging structures, semiconductor structures and fabricating methods thereof are disclosed. A chip packaging structure comprises a substrate comprising: a signal transmitting wiring structure embedded in the substrate, and a thermal transmitting wiring structure embedded in the substrate. The chip packaging structure further comprises a first chip on the substrate and electrically connected with the signal transmitting wiring structure. The chip packaging structure further comprises at least one thermal conductive structure on the substrate, in thermal contact with the thermal transmitting wiring structure, and laterally surrounding the first chip.

Abstract: A semiconductor structure, a fabricating method thereof, and a chip packing structure are provided. The disclosed semiconductor structure includes a printed circuit board, a chip packing structure, and a ball grid array connected between the printed circuit board and the chip packing structure. The ball grid array includes first solder balls each having a first lateral size, and second solder balls each having a second lateral size greater than the first lateral size. The second solder balls are located at corners of the ball grid array, respectively.

Abstract: Examples of the present disclosure disclose a package structure and a fabrication method thereof, a memory system and an electronic apparatus. The package structure includes: a substrate; a first stack structure located on the substrate and including: at least one first chip; a molding layer located on the substrate and encapsulating the first stack structure; and first support structure penetrating the molding layer and located on the periphery of the first stack structure. The first support structure has a height greater than that of the first stack structure.

Abstract: The present application provides a chip package structure and a fabrication method thereof, a memory and a memory system. The chip package structure includes a substrate, a chip on a side of the substrate, an energy storage material layer on a side of the chip opposite the substrate, and a package layer that includes a first portion covering the chip and a second portion covering the energy storage material layer. According to the present application, by disposing the energy storage material layer on a side of the chip, the energy storage material layer absorbs the heat generated by the chip, thereby improving the heat dissipation capability of the chip package structure for the chip.

Abstract: Examples of the present disclosure provide a package structure, the package structure including: a package substrate; a semiconductor device on the package substrate; and a molding layer over the semiconductor device, the molding layer having a plurality of grooves disposed at its surface.

Abstract: The present disclosure provides a package structure and its forming method, a memory system and its forming method. The package structure includes: a plastic encapsulation layer and a rib like structure, wherein, the rib like structure is located on the plastic encapsulation layer, and a bottom surface of the rib like structure is located on a top surface of the plastic encapsulation layer.

Abstract: A reconfigurable triplexer that can support more frequency bands than a traditional triplexer is disclosed. For example, the reconfigurable triplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable triplexer includes a multi-stage filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the triplexer to support a variety of sets of frequencies. For instance, unlike traditional triplexers, the reconfigurable triplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: Reconfigurable output baluns for wideband push-pull amplifiers are disclosed. In certain embodiments, a mobile device includes a transceiver that generates a first radio frequency signal of a first frequency band and a second radio frequency signal of a second frequency band, and a front-end system including a push-pull power amplifier that selectively amplifies one of the first radio frequency signal or the second radio frequency signal based on a band control signal. The push-pull power amplifier includes an input balun, an output balun, and a pair of amplifiers coupled between the input balun and the output balun. The band control signal is operable to control an impedance of the output balun.

Abstract: A distribution network risk identification system and method and a computer storage medium include: multi-source information data for risk identification is acquired; the multi-source information data is analyzed and processed to obtain a risk characteristic; a risk identification index is calculated on the basis of the risk characteristic, and a state of a power grid is determined according to the risk identification index; a temporal and spatial variation rule and variation trend of the risk characteristic are analyzed; a location and cause of occurrence of a risk are determined according to the temporal and spatial variation rule and variation trend of the risk characteristic; a severity of the risk is analyzed by adopting an analogue simulation manner; and the severity of the risk is assessed, and risk early warning information is issued on the basis of an assessment result.

Abstract: A reconfigurable triplexer that can support more frequency bands than a traditional triplexer is disclosed. For example, the reconfigurable triplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable triplexer includes a multi-stage filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the triplexer to support a variety of sets of frequencies. For instance, unlike traditional triplexers, the reconfigurable triplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: A phosphorus-based calcification inhibitor (“inhibitor”) configured to prevent calcification of anaerobic granular sludge.

Abstract: A reconfigurable triplexer that can support more frequency bands than a traditional triplexer is disclosed. For example, the reconfigurable triplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable triplexer includes a multi-stage filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the triplexer to support a variety of sets of frequencies. For instance, unlike traditional triplexers, the reconfigurable triplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: The present invention belongs to the technical field of wastewater treatment, and particularly relates to a method for pre-conditioning high-calcium wastewater by calcification blocking, and a device for implementing the method. The method for treating high-calcium wastewater by calcification blocking includes mixing high-calcium wastewater, an alkalizing agent and a chelating agent, and carrying out alkalizing conditioning pretreatment under a condition of stirring by bubbling of a biogas, so as to obtain pre-conditioned wastewater. The pre-conditioned wastewater is mixed with anaerobic granular sludge, and an anaerobic reaction is performed in a high hydraulic shear flow field formed by the biogas, so as to generate the biogas and calcium scale. A part of the biogas for the stirring is refluxed by bubbling of the biogas and the rest of the biogas is refluxed for forming the high hydraulic shear flow field.

Abstract: Embodiments of the present invention pertain to a composite decalcification agent of calcified anaerobic granular sludge and a decalcification regeneration process.

Abstract: Embodiments of the present invention pertain to a composite decalcification agent of calcified anaerobic granular sludge and a decalcification regeneration process.