Patents by Inventor Shantinath Ghongadi
Shantinath Ghongadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150191843Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.Type: ApplicationFiled: September 10, 2012Publication date: July 9, 2015Inventors: Zhian He, Jingbin Feng, Shantinath Ghongadi, Frederick D. Wilmot
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Patent number: 9028666Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: GrantFiled: April 30, 2012Date of Patent: May 12, 2015Assignee: Novellus Systems, Inc.Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
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Patent number: 9028657Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.Type: GrantFiled: September 10, 2010Date of Patent: May 12, 2015Assignee: Novellus Systems, Inc.Inventors: Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot
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Publication number: 20150122658Abstract: Certain embodiments disclosed herein pertain to methods and apparatus for electrodepositing material on a substrate. More particularly, a novel membrane for separating the anode from the cathode/substrate, and a method of using such a membrane are presented. The membrane includes at least an ion exchange layer and a charge separation layer. The disclosed embodiments are beneficial for maintaining relatively constant concentrations of species in the electrolyte over time, especially during idle (i.e., non-electroplating) times.Type: ApplicationFiled: April 18, 2014Publication date: May 7, 2015Applicant: Lam Research CorporationInventors: Doyeon Kim, Shantinath Ghongadi, Yuichi Takada, Ludan Huang, Tariq Majid
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Publication number: 20140001050Abstract: Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.Type: ApplicationFiled: June 18, 2013Publication date: January 2, 2014Inventors: Ludan Huang, Khuong Nguyen, Haiying Fu, Charles L. Merrill, Shantinath Ghongadi
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Publication number: 20130284604Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Inventors: Tighe A. Spurlin, Charles L. Merrill, Ludan Huang, Matthew Thorum, Lee Brogan, James E. Duncan, Frederick D. Wilmot, Marshall R. Stowell, Steven T. Mayer, Haiying Fu, David W. Porter, Shantinath Ghongadi, Jonathan D. Reid, Hyosang S. Lee, Mark J. Willey
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Patent number: 8540857Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.Type: GrantFiled: August 9, 2012Date of Patent: September 24, 2013Assignee: Novellus Systems, Inc.Inventors: Steven Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng
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Patent number: 8398831Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: GrantFiled: April 4, 2011Date of Patent: March 19, 2013Assignee: Novellus Systems, Inc.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
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Publication number: 20130062197Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.Type: ApplicationFiled: September 10, 2012Publication date: March 14, 2013Inventors: Zhian He, Jingbin Feng, Shantinath Ghongadi, Frederick D. Wilmot
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Patent number: 8377268Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: GrantFiled: June 6, 2011Date of Patent: February 19, 2013Assignee: Novellus Systems, Inc.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Publication number: 20120292192Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: ApplicationFiled: April 30, 2012Publication date: November 22, 2012Inventors: Manish RANJAN, Shantinath GHONGADI, Frederick Dean WILMOT, Douglas HILL, Bryan L. BUCKALEW
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Patent number: 8262871Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.Type: GrantFiled: December 17, 2009Date of Patent: September 11, 2012Assignee: Novellus Systems, Inc.Inventors: Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng
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Publication number: 20120181170Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.Type: ApplicationFiled: March 28, 2012Publication date: July 19, 2012Inventors: Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He, Steven T. Mayer, Robert Rash, Jonathan D. Reid, Yuichi Takada, James R. Zibrida
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Publication number: 20120175263Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.Type: ApplicationFiled: December 13, 2011Publication date: July 12, 2012Inventors: Kousik GANESAN, Tighe SPURLIN, Jonathan D. REID, Shantinath GHONGADI, Andrew McKERROW, James E. DUNCAN
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Patent number: 8172992Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.Type: GrantFiled: December 8, 2009Date of Patent: May 8, 2012Assignee: Novellus Systems, Inc.Inventors: Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He, Steven T. Mayer, Robert Rash, Jonathan D. Reid, Yuichi Takada, James R. Zibrida
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Publication number: 20120061246Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.Type: ApplicationFiled: September 10, 2010Publication date: March 15, 2012Inventors: Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot
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Publication number: 20110233056Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: ApplicationFiled: June 6, 2011Publication date: September 29, 2011Applicant: NOVELLUS SYSTEMS, INC.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Publication number: 20110181000Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: ApplicationFiled: April 4, 2011Publication date: July 28, 2011Applicant: NOVELLUS SYSTEMS, INC.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
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Patent number: 7985325Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: GrantFiled: October 30, 2007Date of Patent: July 26, 2011Assignee: Novellus Systems, Inc.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Patent number: 7935231Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: GrantFiled: October 31, 2007Date of Patent: May 3, 2011Assignee: Novellus Systems, Inc.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans