Patents by Inventor Shao-Chien Lee
Shao-Chien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240023251Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.Type: ApplicationFiled: August 30, 2022Publication date: January 18, 2024Applicant: UNIMICRON TECHNOLOGY CORP.Inventors: Shao-Chien LEE, Ching-Sheng CHEN, Heng-Ming NIEN, Pei-Wei WANG
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Publication number: 20230389172Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11785707Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: GrantFiled: October 8, 2021Date of Patent: October 10, 2023Assignee: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11737209Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.Type: GrantFiled: January 13, 2022Date of Patent: August 22, 2023Assignee: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Ming-Ting Chang
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Patent number: 11665832Abstract: A circuit board structure includes a first sub-board including a plurality of circuit patterns, a second sub-board including a plurality of pads, and a connecting structure layer having a plurality of through holes and including an insulating layer, first and second adhesive layers, and a plurality of conductive blocks. The first adhesive layer is directly connected to the first sub-board. The second adhesive layer is directly connected to the second sub-board. The through holes penetrate through the first adhesive layer, the insulating layer, and the second adhesive layer. The conductive blocks are located in the through holes. An upper surface and a lower surface of each conductive block are respectively lower than a first surface of the first adhesive layer and a second surface of the second adhesive layer relatively away from the insulating layer. Each circuit pattern contacts the upper surface, and each pad contacts the lower surface.Type: GrantFiled: April 20, 2021Date of Patent: May 30, 2023Assignee: Unimicron Technology Corp.Inventors: John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng, Shao-Chien Lee, Tzyy-Jang Tseng
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Patent number: 11641720Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.Type: GrantFiled: April 6, 2021Date of Patent: May 2, 2023Assignee: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Shao-Chien Lee, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang, Chin-Min Hu
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Patent number: 11600936Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.Type: GrantFiled: May 18, 2021Date of Patent: March 7, 2023Assignee: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li
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Patent number: 11540396Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.Type: GrantFiled: March 3, 2021Date of Patent: December 27, 2022Assignee: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain
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Publication number: 20220256717Abstract: A circuit board structure includes a first sub-board including a plurality of circuit patterns, a second sub-board including a plurality of pads, and a connecting structure layer having a plurality of through holes and including an insulating layer, first and second adhesive layers, and a plurality of conductive blocks. The first adhesive layer is directly connected to the first sub-board. The second adhesive layer is directly connected to the second sub-board. The through holes penetrate through the first adhesive layer, the insulating layer, and the second adhesive layer. The conductive blocks are located in the through holes. An upper surface and a lower surface of each conductive block are respectively lower than a first surface of the first adhesive layer and a second surface of the second adhesive layer relatively away from the insulating layer. Each circuit pattern contacts the upper surface, and each pad contacts the lower surface.Type: ApplicationFiled: April 20, 2021Publication date: August 11, 2022Applicant: Unimicron Technology Corp.Inventors: John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng, Shao-Chien Lee, Tzyy-Jang Tseng
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Publication number: 20220240369Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.Type: ApplicationFiled: January 13, 2022Publication date: July 28, 2022Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Ming-Ting Chang
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Publication number: 20220232694Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: ApplicationFiled: October 8, 2021Publication date: July 21, 2022Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Publication number: 20220095464Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.Type: ApplicationFiled: April 6, 2021Publication date: March 24, 2022Applicant: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Shao-Chien Lee, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang, Chin-Min Hu
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Publication number: 20220071010Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.Type: ApplicationFiled: September 26, 2021Publication date: March 3, 2022Inventors: Tzyy-Jang TSENG, Cheng-Ta KO, Pu-Ju LIN, Chi-Hai KUO, Shao-Chien LEE, Ming-Ru CHEN, Cheng-Chung LO
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Publication number: 20220071000Abstract: The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.Type: ApplicationFiled: January 14, 2021Publication date: March 3, 2022Applicant: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain
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Publication number: 20220071015Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.Type: ApplicationFiled: March 3, 2021Publication date: March 3, 2022Applicant: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain
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Patent number: 11114782Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.Type: GrantFiled: August 13, 2019Date of Patent: September 7, 2021Assignee: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li
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Publication number: 20210273356Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.Type: ApplicationFiled: May 18, 2021Publication date: September 2, 2021Inventors: Tzyy-Jang TSENG, Pei-Wei WANG, Ching-Ho HSIEH, Shao-Chien LEE, Kuo-Wei LI
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Patent number: 10939538Abstract: A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.Type: GrantFiled: June 21, 2020Date of Patent: March 2, 2021Assignee: Unimicron Technology Corp.Inventors: Ming-Hao Wu, Shao-Chien Lee
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Publication number: 20200366012Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.Type: ApplicationFiled: August 13, 2019Publication date: November 19, 2020Inventors: Tzyy-Jang TSENG, Pei-Wei WANG, Ching-Ho HSIEH, Shao-Chien LEE, Kuo-Wei LI
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Patent number: 10736215Abstract: A multilayer circuit board structure includes a first multilayer circuit board and a second multilayer circuit board. The first multilayer circuit board includes a first patterned circuit layer and a first dummy circuit layer. The first dummy circuit layer surrounds the first patterned circuit layer. The second multilayer circuit board is disposed on the first multilayer circuit board, and includes a second patterned circuit layer and a second dummy circuit layer surrounding the second patterned circuit layer. The first patterned circuit layer is bonded to the second patterned circuit layer and the first dummy circuit layer is bonded to the second dummy circuit layer. A hollow space is defined between the first multilayer circuit board and the second multilayer circuit board.Type: GrantFiled: May 23, 2019Date of Patent: August 4, 2020Assignee: Unimicron Technology Corp.Inventors: Shao-Chien Lee, Ming-Hao Wu, Zong-Hua Li