Patents by Inventor Shao Liu
Shao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12206047Abstract: A light-emitting diode (LED) chip includes a substrate and an epitaxial structure. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer that are sequentially disposed on the substrate in such order. The second semiconductor layer has a light-emitting surface that is opposite to the active layer and that is formed with a microstructure. The microstructure includes a plurality of first protrusions that are separately disposed on the light-emitting surface, and a plurality of second protrusions that are disposed on the first protrusions and on the light-emitting surface between any two adjacent ones of the first protrusions.Type: GrantFiled: February 22, 2022Date of Patent: January 21, 2025Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.Inventors: Poyang Chang, Linrong Cai, Shao-Hua Huang, Liqin Zhu, Shuangliang Liu
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Publication number: 20240393325Abstract: The present disclosure relates to a method of distinguishably detecting two biomarkers with cross-reactivity in a biological sample. The method comprises providing two sensor units specific to the two biomarkers, respectively; obtaining binding affinities of a series of known concentrations of the two biomarkers to the sensor units, respectively; contacting the biological sample with the two sensor units to produce two signals; and calculating the concentrations of the two biomarkers in the biological sample with the two signals and the binding affinities.Type: ApplicationFiled: May 24, 2023Publication date: November 28, 2024Inventors: Wen-Yih CHEN, Hardy Wai-Hong CHAN, Yuh-Shyong YANG, Ching-Wei TSAI, Wei-Jane CHIU, Yi-Shao LIU, Lin-Ai TAI
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Publication number: 20240365003Abstract: An image capturing device comprising an image sensor and a processing circuit. The processing circuit is configured to perform following steps: (a) outputting first sensing frames by the image sensor in a first mode, wherein a first frame time duration is determined between adjacent ones of the first sensing frames; (b) switching from the first mode to a second mode in a transition time interval; (c) setting the transition time interval such that a difference between the transition time interval and the first frame duration is smaller than a predetermined value; and (d) outputting second sensing frames by the image sensor in the second mode.Type: ApplicationFiled: April 29, 2024Publication date: October 31, 2024Applicant: MEDIATEK INC.Inventors: Yan-Shao Liu, Yun-Feng Tseng, Chi-Cheng Ju
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Patent number: 11980864Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.Type: GrantFiled: August 10, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Patent number: 11828722Abstract: A biological device includes a substrate, a gate electrode, and a sensing well. The substrate includes a source region, a drain region, a channel region, a body region, and a sensing region. The channel region is disposed between the source region and the drain region. The sensing region is at least disposed between the channel region and the body region. The gate electrode is at least disposed on or above the channel region of the substrate. The sensing well is at least disposed adjacent to the sensing region.Type: GrantFiled: December 16, 2019Date of Patent: November 28, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ta-Chuan Liao, Chien-Kuo Yang, Yi-Shao Liu, Tung-Tsun Chen, Chan-Ching Lin, Jui-Cheng Huang, Felix Ying-Kit Tsui, Jing-Hwang Yang
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Publication number: 20230375501Abstract: A method of making a biochip includes forming an opening extending completely through a fluidic substrate. Forming the opening includes defining a plurality of sidewalls on the fluidic substrate, wherein the plurality of sidewalls defines a channel in fluid communication with the opening, and each of the plurality of sidewalls comprises polydimethylsiloxane (PDMS). The method further includes coating a surface of the fluidic substrate with a silicon oxide coating wherein, the silicon oxide coating is between adjacent sidewalls of the plurality of sidewalls. The method further includes bonding the fluidic substrate to a detection substrate.Type: ApplicationFiled: July 31, 2023Publication date: November 23, 2023Inventors: Yi-Shao LIU, Chun-Ren CHENG, Chun-Wen CHENG
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Publication number: 20230375499Abstract: A biological device includes a substrate, a gate electrode, and a sensing well. The substrate includes a source region, a drain region, a channel region, a body region, and a sensing region. The channel region is disposed between the source region and the drain region. The sensing region is at least disposed between the channel region and the body region. The gate electrode is at least disposed on or above the channel region of the substrate. The sensing well is at least disposed adjacent to the sensing region.Type: ApplicationFiled: July 31, 2023Publication date: November 23, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ta-Chuan LIAO, Chien-Kuo YANG, Yi-Shao LIU, Tung-Tsun CHEN, Chan-Ching LIN, Jui-Cheng HUANG, Felix Ying-Kit TSUI, Jing-Hwang YANG
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Patent number: 11823602Abstract: A layout arrangement of a driver integrated circuit includes multiple output pads, a plurality of switching circuits, and multiple data channel circuits. The output pads include a first output pad and a second output pad and are configurable to be coupled to a plurality of data lines. The switching circuits include a first switching circuit. A first selection terminal of the first switching circuit is coupled to the first output pad via a first connecting wire. A second selection terminal of the first switching circuit is coupled to the second output pad via a second connecting wire. The data channel circuits include a first data channel circuit. An output terminal of the first data channel circuit is coupled to a common terminal of the first switching circuit via a third connecting wire. The third connecting wire is longer than the first connecting wire and the second connecting wire.Type: GrantFiled: April 25, 2022Date of Patent: November 21, 2023Assignee: Novatek Microelectronics Corp.Inventors: Hsiu-Hui Yang, Yu-Shao Liu
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Patent number: 11824002Abstract: An integrated circuit structure comprises a base and a plurality of metal levels over the base. A first metal level includes a first dielectric material. The first metal level further includes a first plurality of interconnect lines in the first dielectric material, wherein the first plurality of interconnect lines in the first metal level have variable widths from relatively narrow to relatively wide, and wherein the first plurality of interconnect lines have variable heights based on the variable widths, such that a relatively wide one of the first plurality of interconnect lines has a taller height from the substrate than a relatively narrow one of the first plurality of interconnect lines, and a shorter distance to a top of the first metal level.Type: GrantFiled: June 28, 2019Date of Patent: November 21, 2023Assignee: Intel CorporationInventors: En-Shao Liu, Joodong Park, Chen-Guan Lee, Walid M. Hafez, Chia-Hong Jan, Jiansheng Xu
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Patent number: 11768170Abstract: A biochip including a fluidic substrate having an opening extending completely through the fluidic substrate. The biochip further includes a silicon oxide coating on the fluidic substrate. The biochip further includes a plurality of sidewalls on the fluidic substrate, wherein the plurality of sidewalls defines a channel in fluid communication with the opening, the silicon oxide coating is between adjacent sidewalls of the plurality of sidewalls, and each of the plurality of sidewalls comprises polydimethylsiloxane (PDMS). The biochip further includes a detection substrate spaced from the fluidic substrate.Type: GrantFiled: April 2, 2021Date of Patent: September 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Shao Liu, Chun-Ren Cheng, Chun-Wen Cheng
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Patent number: 11703475Abstract: A method includes mounting an integrated electro-microfluidic probe card to a device area on a bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface and a second major surface opposite the first major surface. The method further includes electrically connecting at least one electronic probe tip extending from the first major surface to a corresponding conductive area of the device area. The method further includes stamping a test fluid onto the device area. The method further includes measuring via the at least one electronic probe tip a first electrical property of one or more bio-FETs of the device area based on the test fluid.Type: GrantFiled: September 30, 2019Date of Patent: July 18, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng, Chun-Wen Cheng
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Publication number: 20230081170Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.Type: ApplicationFiled: October 31, 2022Publication date: March 16, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Alexander KALNITSKY, Yi-Shao LIU, Kai-Chih LIANG, Chia-Hua CHU, Chun-Ren CHENG, Chun-Wen CHENG
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Patent number: 11537739Abstract: The present application is related to system and method for analyzing confidential data. Firstly, a first key is used to obtain a first analysis authorization for proceeding a first analysis responsive to an operational model in an encrypted cloud space with a connection of a network. Then, the result of the first analysis is verified. While the verifying of the operational model is pass, a second key is used to obtain a second analysis authorization for proceeding a second analysis responsive to an operational model without the connection of the network. Thereby, the cloud technique for analyzing data can be applied for analyzing confidential data.Type: GrantFiled: December 1, 2020Date of Patent: December 27, 2022Assignee: National Applied Research LaboratoriesInventors: Hsi-Ching Lin, Yu-Shao Liu, August Chao
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Publication number: 20220387959Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.Type: ApplicationFiled: August 10, 2022Publication date: December 8, 2022Inventors: Tung-Tsun CHEN, Yi-Shao LIU, Jui-Cheng HUANG, Chin-Hua WEN, Felix Ying-Kit TSUI, Yung-Chow PENG
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Patent number: 11504690Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.Type: GrantFiled: November 15, 2019Date of Patent: November 22, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Patent number: 11498044Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing circuits. Each sensing circuit is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements, in a same silicon layer as the rows of heating elements and the columns of heating elements, and configured to generate a bio-sensing signal and a temperature-sensing signal.Type: GrantFiled: November 15, 2019Date of Patent: November 15, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Patent number: 11491455Abstract: An integrated circuit includes an interconnection structure, first and second sensing pixels over the interconnection structure, and an isolation layer over the first and second sensing pixels. Each of the first and second sensing pixels includes a bio-sensing device, a temperature-sensing device, one or more heating elements adjacent to the bio-sensing device and the temperature-sensing device, and a sensing film over the bio-sensing device. The isolation layer includes a first opening configured to expose the sensing film of the first sensing pixel without exposing the sensing film of the second sensing pixel and a second opening configured to expose the sensing film of the second sensing pixel without exposing the sensing film of the first sensing pixel.Type: GrantFiled: November 15, 2019Date of Patent: November 8, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Patent number: 11486854Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.Type: GrantFiled: December 26, 2019Date of Patent: November 1, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng
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Patent number: 11446630Abstract: An integrated circuit includes a plurality of sensing pixels, each sensing pixel including a sensing film portion, a bio-sensing device configured to generate a first signal responsive to an electrical characteristic of the sensing film portion, a first switching device coupled between the bio-sensing device and a first signal path, a temperature-sensing device configured to generate a second signal responsive to a temperature of the sensing film portion, and a second switching device coupled between the temperature-sensing device and a second signal path.Type: GrantFiled: November 15, 2019Date of Patent: September 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Publication number: 20220246077Abstract: A layout arrangement of a driver integrated circuit includes multiple output pads, a plurality of switching circuits, and multiple data channel circuits. The output pads include a first output pad and a second output pad and are configurable to be coupled to a plurality of data lines. The switching circuits include a first switching circuit. A first selection terminal of the first switching circuit is coupled to the first output pad via a first connecting wire. A second selection terminal of the first switching circuit is coupled to the second output pad via a second connecting wire. The data channel circuits include a first data channel circuit. An output terminal of the first data channel circuit is coupled to a common terminal of the first switching circuit via a third connecting wire. The third connecting wire is longer than the first connecting wire and the second connecting wire.Type: ApplicationFiled: April 25, 2022Publication date: August 4, 2022Applicant: Novatek Microelectronics Corp.Inventors: Hsiu-Hui Yang, Yu-Shao Liu