Patents by Inventor Shao WEN
Shao WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110280441Abstract: A method controls a projection of a projector. The method predetermines hand gestures, and assigns an operation function of an input device to each of the predetermined hand gestures. When an electronic file is projected onto a screen, the projector receives an image of a speaker captured by an image-capturing device connected to the projector. The projector identifies whether a hand gesture of the speaker matches one of the predetermined hand gestures. If the hand gesture matches one of the hand gestures, the projector may execute a corresponding assigned operation function.Type: ApplicationFiled: October 6, 2010Publication date: November 17, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIEN-LIN CHEN, SHAO-WEN WANG
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Publication number: 20110069146Abstract: A method for processing images of a scene captured by a plurality of video cameras divides a coordinate plane of a scene into a plurality of partitions according to predetermined division points, and identifies information of the images. The method further distinguishes unusable areas of each image according to the information of the image and the division of the coordinate plane of the scene, and marks a character into each pixel point of the unusable areas of each image. The method further compresses each image by deleting the pixel points marked by the character to generate a compressed image, and integrates all compressed images to generate a panoramic image of the scene.Type: ApplicationFiled: December 25, 2009Publication date: March 24, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-WEN WANG, PI-JYE TSAUR
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Publication number: 20100322313Abstract: A system is disclosed for estimating a sum of absolute differences (SAD) between a macro block of a current frame and a candidate block of a reference block. The macro block includes a number of sub macro blocks of pixels. A number of sample pixels are selected from each of the number of sub macro blocks. A reference pixel corresponding to each of the sample pixels is found in the candidate block. The system obtains a sub SAD by multiplying an average of the absolute differences between pixel values of the selected pixels of each of the plurality of sub macro blocks and corresponding relative pixels of the candidate block by a corresponding pixel number. The SAD is obtained by adding all of the sub SADs together.Type: ApplicationFiled: October 22, 2009Publication date: December 23, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-WEN WANG, PI-JYE TSAUR
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Publication number: 20100314242Abstract: There is disclosed an environmentally friendly method for recovering gold, silver, copper and iron from valuable metal-contained plasma-molten slag. At first, plasma is used to burn the used printed circuit boards, thus producing the slag. Then, the slag is grinded. Then, leaching, crystallization, precipitation, replacement and electric winning are conducted to recover gold, silver, copper and iron.Type: ApplicationFiled: November 20, 2009Publication date: December 16, 2010Applicant: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCHInventors: Wen-Cheng Lee, Ching-Lian Chen, Ching-Hwa Lee, Kuan-Ting Liu, Shao-Wen Wu, Chen-Yu Yen
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Publication number: 20100229394Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a dry powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.Type: ApplicationFiled: May 24, 2010Publication date: September 16, 2010Applicant: Industrial Technology Research InstituteInventors: Ming-Jye Tsai, Jin-Cherng Shyu, Cheng-Tai Chou, Chia-Sheng Chiang, Lan-Kai Yeh, Shao-Wen Chen
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Patent number: 7730605Abstract: The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: April 17, 2007Date of Patent: June 8, 2010Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20090244071Abstract: Provided is a computer system and a computerized method to automatically generate the synthetic images that simulate the human activities in a particular environment. The program instructions are input in the form of the natural language. Particular columns are provided in the user interface to allow the user to select desired instruction elements from sets of limited candidates. The instruction elements form the program instructions. The system analyzes the program instructions to obtain the standard predetermined time evaluation codes of the instructions. Parameters not include in the input program instructions are generated automatically. Synthetic images are generated by using the input program instructions and the parameters obtained.Type: ApplicationFiled: July 14, 2008Publication date: October 1, 2009Applicant: China Motor Corporation.Inventors: Chung An Kuo, Feng Chou Kuo, Pei-Chao Chen, Mao-Jiun Wang, Chien-Fu Kuo, Hsu Lee, Shao-Wen Chang
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Patent number: 7578338Abstract: A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having a micro-structure layer. The heat dissipating apparatus includes a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: April 17, 2007Date of Patent: August 25, 2009Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20080310954Abstract: A pump includes a DC motor (10) defining a chamber (108) and having a rotor (112) and a shaft (110) suitably received in the chamber, a motor shell (20) set around the DC motor, a rear cover assembly (30) jointed to the motor shell, a front cover assembly (40) secured to the rear cover assembly, and a check valve assembly (50) and a diaphragm assembly (60) set between the front cover assembly and the rear cover assembly. The DC motor defines a number of air inlets (116) and air outlets (118) at two side walls (104, 106) thereof, respectively. The shaft is equipped with a rotatable fan (10). The motor shell has a number of ventilation holes (200) in communication with the air outlets. The rear cover assembly defines a number of through-holes (300) communicated to the air inlets. The through-holes, the air inlets, the chamber, the air outlets and the ventilation holes jointly define an air flow path.Type: ApplicationFiled: October 15, 2007Publication date: December 18, 2008Inventors: Xin-Hua Zhan, Shao-wen Pan, Chun-bo Chen
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Publication number: 20070193029Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: April 17, 2007Publication date: August 23, 2007Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20070187074Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: April 17, 2007Publication date: August 16, 2007Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Patent number: 7257431Abstract: The present invention discloses a portable multimedia player which comprises a panel, a base, and an electric swiveling mechanism for two axes combining the panel and the base. The electric swiveling mechanism further comprises a first swiveling mechanism and a second swiveling mechanism for controlling yaw and pitch swiveling, respectively.Type: GrantFiled: July 28, 2005Date of Patent: August 14, 2007Assignee: Afreey Inc.Inventors: Chung-Chih Chen, Shao-Wen Kao, Chih-Chuan Ke, Zheng-Kai Hu
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Patent number: 7237337Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: November 24, 2004Date of Patent: July 3, 2007Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20070102829Abstract: A chip structure with solder bumps and the method for producing the same are disclosed. The chip structure with solder bumps includes a chip, a plurality of pads arranged on one surface of the chip, a protection layer formed on the surface of the chip and exposing the pads, a first photo-imaginable dielectric layer covered on the protection layer, a plurality of UBMs arranged on the pads, and extends over the first photo-imaginable dielectric layer respectively, a second photo-imaginable dielectric layer covered on the UBMs and the first photo-imaginable dielectric layer, and a plurality of conductive bumps relative to the pads and disposed on the UBMs respectively. Each UBM has a heat-dissipation portion extending to the edge of the surface of the chip. The second photo-imaginable dielectric layer reveals the heat-dissipation portions respectively.Type: ApplicationFiled: November 3, 2006Publication date: May 10, 2007Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.Inventors: Jian-Wen LO, Shao-Wen Fu
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Publication number: 20070025853Abstract: The present invention discloses a portable multimedia player which comprises a panel, a base, and an electric swiveling mechanism for two axes combining the panel and the base. The electric swiveling mechanism further comprises a first swiveling mechanism and a second swiveling mechanism for controlling yaw and pitch swiveling, respectively.Type: ApplicationFiled: July 28, 2005Publication date: February 1, 2007Inventors: Chung-Chih Chen, Shao-Wen Kao, Chih-Chuan Ke, Zheng-Kai Hu
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Publication number: 20060197191Abstract: A chip structure comprising a substrate, a circuitry unit, a plurality of bonding pads, a first passivation layer and a redistribution layer is provided. The circuitry unit is disposed on the substrate, and the bonding pads are disposed on the circuitry unit. Moreover, the first passivation layer is disposed on the circuitry unit and exposes the bonding pads. The redistribution layer of a Ti/Cu/Ti multi-layered structure is disposed on the first passivation layer, and is electrically connected with the bonding pads. In addition, the redistribution layer of a Ti/Cu/Ti multi-layered structure has excellent conductivity such that electrical characteristics of the chip structure are enhanced effectively.Type: ApplicationFiled: December 13, 2005Publication date: September 7, 2006Inventors: Mon-Chin Tsai, Chi-Yu Wang, Jian-Wen Lo, Shao-Wen Fu
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Publication number: 20060199306Abstract: A chip structure and the manufacturing process thereof are provided. The feature of the present application is that the chip structure has a first passivation layer covering a substrate of the chip and exposing each of bonding pads and a portion of the substrate surface, and a second passivation layer covering the sidewalls of the first passivation layer and the portion of substrate surface exposed by the first passivation layer, to prevent moisture infiltration from the edge of the substrate. Therefore, the reliability of the chip structure is enhanced.Type: ApplicationFiled: December 15, 2005Publication date: September 7, 2006Inventors: Mon-Chin Tsai, Jian-Wen Lo, Shao-Wen Fu, Chi-Yu Wang
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Publication number: 20060143916Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.Type: ApplicationFiled: May 19, 2005Publication date: July 6, 2006Inventors: Ming-Jye Tsai, Jin-Cherng Shyu, Cheng-Tai Chou, Chia-Sheng Chiang, Lan-Kai Yeh, Shao-Wen Chen
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Patent number: 7011145Abstract: A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.Type: GrantFiled: July 12, 2004Date of Patent: March 14, 2006Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Shao-Wen Chen, Jin-Cherng Shyu, Ming-Jye Tsai
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Publication number: 20060005952Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: November 24, 2004Publication date: January 12, 2006Inventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu