Abstract: A lighting device includes a lighting engine and at least a wavelength-converting element. The lighting engine includes a circuit board, a blue light emitting diode and a red light emitting diode. The blue light emitting diode and a red light emitting diode are disposed on the circuit board. The wavelength-converting element covers at least the blue light emitting diode. A wavelength-converted light is generated by converting a part of light emitted by the lighting engine through the wavelength-converting element. White light having a color temperature within a range from 2580K to 3220K on the black-body radiation of the CIE-1931 chromaticity diagram is generated by mixing the wavelength-converted light and non-converted light emitted by the lighting engine.

Abstract: The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of first grooves are larger than that of the second grooves, the depth of first grooves are larger than that of the second grooves, the density of first grooves are larger than that of the second grooves, and the first grooves and the second grooves are uniformly distributed over the polishing surface respectively. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove.

Abstract: The present invention provides a polishing pad, and more particularly, a polishing pad with two kinds of groove patterns. The polishing pad includes a polishing surface, on which is formed with at least a first groove and at least a second groove, wherein the characteristic of the polishing pad is in that: the first groove is connected to the second groove, and the width of first groove is larger than that of the second groove and the depth of first groove is larger than that of the second groove. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove. Thus the polishing particles or deposits will not easily remain on the polishing pad or further cause scratching and damaging of the surface of polished work piece.

Abstract: The present invention provides a polishing pad, and is more particularly related to a polishing pad, the width of groove bottom of polishing surface of which is 0 mm. The polishing pad includes a polishing surface on which comprises a plurality of grooves, wherein each groove includes a groove opening and a groove bottom, the characteristic of which being that the width of groove bottom of polishing surface is 0 mm. Therefore, when the polishing step is performed, it is not easy for polishing particles suspended in the slurry to deposit on the groove bottom and the deposits can be prevented from scratching the concerned work piece to avoid damage of work piece.

Abstract: The present invention provides a polishing pad with a pressure sensor and the polishing apparatus thereof. The polishing pad is used in the polishing process of semiconductor and other work piece, which includes at least one substrate, at least one pressure sensor and at least one signal transmitting module. The substrate has a polishing face, a bottom face opposite to the polishing face, and at least one cavity set on the bottom face of the substrate. The pressure sensor is set in the cavity and configured for providing a pressure signal. The signal transmitting module is set on the polishing pad and configured for transmitting a pressure signal. The pressure signal is a loading pressure value and/or loading pressure distribution on the polishing pad with a preset range. Thus, with the pressure signal, the polishing apparatus prevents the concerned work piece from being over polished to further improve polishing quality and yield.

Abstract: This invention is related to a polishing pad, and more particularly a polishing pad with flexible micro-structure. The polishing pad comprises a connecting surface and a polishing surface. The connecting surface is used to secure on a polishing device. The polishing surface with flexible micro-structure is used to grind and adequately press close to the surface of semiconductor piece. The present invention not only increases the area of polishing surface that contact with the semiconductor piece but also get over the difficulty in pressing close to different piece. It will save grinding time and have a better effect.