Patents by Inventor Shaofeng Ding

Shaofeng Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200362401
    Abstract: Minimal-copy-ratio of templates is a problem in detecting early stage cancer where minimal copies of somatic cancer-specific mutations are targeted in the presence of large copies of wildtype genome DNA, commonly a 1/10,000 or even less minimal-copy-ratio between the mutant target and wildtype control templates. To overcome this problem, delayed pyrophosphorolysis activated polymerization (delayed-PAP) was developed which can delay product accumulation of the wildtype control to a much later time or cycle by up to 15 cycles or by 30,000 folds. In the multiplex format, delayed-PAP is particularly useful to amplify not only the wildtype control but also mutant target templates accurately and consistently in the minimal-copy-ratio situation.
    Type: Application
    Filed: May 11, 2019
    Publication date: November 19, 2020
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20200350248
    Abstract: A semiconductor device includes a substrate, a first electrode including a first hole, a first dielectric layer on an upper surface of the first electrode and on an inner surface of the first hole, a second electrode on the first dielectric layer, a second dielectric layer on the second electrode, a third electrode on the second dielectric layer and including a second hole, and a first contact plug extending through the second electrode and the second dielectric layer and extending through the first hole and the second hole. A sidewall of the first contact plug is isolated from direct contact with the sidewall of the first hole and a sidewall of the second hole, and has a step portion located adjacent to an upper surface of the second electrode.
    Type: Application
    Filed: October 22, 2019
    Publication date: November 5, 2020
    Inventors: Jinho PARK, Shaofeng DING, Yongseung BANG, Jeong Hoon AHN
  • Publication number: 20200343178
    Abstract: A semiconductor device includes a first electrode disposed on a substrate. A capacitor dielectric layer is on the first electrode. A second electrode is on the capacitor dielectric layer. A first insulating layer is on the first and second electrodes and the capacitor dielectric layer. A first interconnection structure is on the first insulating layer and connected to the first electrode. A second interconnection structure is on the first insulating layer and connected to the second electrode. A second insulating layer is on the first and second interconnection structures. A plurality of connection structures are configured to pass through the second insulating layer and be connected to the first and second interconnection structures. Each of the first and second interconnection structures has an aluminum layer.
    Type: Application
    Filed: October 8, 2019
    Publication date: October 29, 2020
    Inventors: Shaofeng Ding, Jeonghoon Ahn
  • Publication number: 20200235087
    Abstract: According to an example embodiment of the present inventive concept, a semiconductor device includes a substrate. A first insulating layer is disposed on the substrate. A thin-film resistor is disposed in the first insulating layer. A capacitor structure is disposed on the first insulating layer and includes a first electrode pattern, a first dielectric pattern, a second electrode pattern, a second dielectric pattern and a third electrode pattern sequentially stacked. A first via is connected to the first electrode pattern and the third electrode pattern. A part of the first via is disposed in the first insulating layer. A second via is connected to the second electrode pattern, and a third via is connected to the thin-film resistor.
    Type: Application
    Filed: September 12, 2019
    Publication date: July 23, 2020
    Inventor: Shaofeng Ding
  • Publication number: 20200150047
    Abstract: A new fluorescence detection method called pyrophosphorolysis activated fluorescence was developed to measure PAP amplification of nucleic acid. A fluorophore-quencher dual-attached blocked primer was used for PAP which has a fluorophore attached to a nucleotide in the internal region or at the 5? end and a quencher attached to a blocked nucleotide at the 3? end. Multiple fluorophore-quencher dual-labeled blocked primers were also used for multiplex PAP, which are attached with different fluorophores to distinguish multiple templates in a reaction.
    Type: Application
    Filed: October 19, 2019
    Publication date: May 14, 2020
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20200135843
    Abstract: A semiconductor device including a first electrode on a substrate, a second electrode on the first electrode, a first dielectric layer between the first electrode and the second electrode; a third electrode on the second electrode, a second dielectric layer between the second electrode and the third electrode, and a first contact plug penetrating the third electrode and contacting the first electrode, the first contact plug contacts a top surface of the third electrode and a side surface of the third electrode.
    Type: Application
    Filed: June 13, 2019
    Publication date: April 30, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng DING, Jinho Park, Yongseung Bang, Jeong Hoon Ahn
  • Patent number: 10619197
    Abstract: The invention provides a method for lyophilizing integrated composition of pyrophosphorolysis activated polymerization (PAP) in an aqueous solution. It also provides lyophilized integrated PAP composition. Except for nucleic acid template, the integrated composition contains all components. For manipulation, simply add nucleic acid template in an aqueous solution to start amplification. In addition to the easy manipulation, the lyophilized integrated composition can be stored for prolonged period at ambiguous temperature.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: April 14, 2020
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20200075712
    Abstract: Semiconductor devices including a capacitor in which electrostatic capacity is improved by a simplified process and/or methods for fabricating the same are provided. The semiconductor device including an insulating structure defining a first trench on a substrate, a first conductive layer in the insulating structure, a first portion of an upper surface of the first conductive layer exposed by the first trench, a capacitor structure including a first electrode pattern on the first conductive layer, a dielectric pattern on the first electrode pattern, and a second electrode pattern on the dielectric pattern, the first electrode pattern extending along sidewalls and a bottom surface of the first trench and an upper surface of the insulating structure, and a first wiring pattern on the capacitor structure may be provided.
    Type: Application
    Filed: April 9, 2019
    Publication date: March 5, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng Ding, Jeong Hoon Ahn
  • Patent number: 10535575
    Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: January 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng Ding, Kyoung-woo Lee, In-hwan Kim, Jong-woon Lee
  • Publication number: 20200006199
    Abstract: A semiconductor device including a substrate having a first surface and a second surface facing the first surface, the substrate having a via hole, the via hole extending from the first surface of the substrate toward the second surface of the substrate, a through via in the via hole, a semiconductor component on the first surface of the substrate, and an internal buffer structure spaced apart from the via hole and between the via hole and the semiconductor component, the internal buffer structure extending from the first surface of the substrate toward an inside of the substrate, a top end of the internal buffer structure being at a level higher than a top end of the through via may be provided.
    Type: Application
    Filed: January 4, 2019
    Publication date: January 2, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng DING, So Ra Park, Jeong Hoon Ahn
  • Patent number: 10513727
    Abstract: Through a novel primer design, multiplex pyrophosphorolysis activated polymerization uses multiple pairs of blocked primers to amplify multiple almost-sequence-identical templates located in one locus in a single reaction, greatly increasing the productivity of nucleic acid amplification.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 24, 2019
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20190271035
    Abstract: Multiplex pyrophosphorolysis activated polymerization uses multiple pairs of blocked primers to amplify multiple potential templates in a single reaction, including those almost-sequence-identical templates located in one locus. To identify and differentiate the multiple amplified products, individual molecules are sequenced in parallel. Thus multiplex PAP amplification is combined with parallel sequencing for ultrahigh-sensitive, ultrahigh-selective and ultrahigh-throughput detection of early cancer.
    Type: Application
    Filed: May 9, 2019
    Publication date: September 5, 2019
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20190131194
    Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.
    Type: Application
    Filed: June 4, 2018
    Publication date: May 2, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng DING, Kyoung-woo LEE, In-hwan KIM, Jong-woon LEE
  • Publication number: 20180265919
    Abstract: Through a novel primer design, multiplex pyrophosphorolysis activated polymerization uses multiple pairs of blocked primers to amplify multiple almost-sequence-identical templates located in one locus in a single reaction, greatly increasing the productivity of nucleic acid amplification.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 20, 2018
    Inventors: Shaofeng Ding, Qiang Liu
  • Patent number: 9926543
    Abstract: A new method of RNA-PAP was developed that can directly amplify RNA template without additional treatment. RNA-PAP brings in a new mechanism for amplification of RNA template in which RNA-dependent DNA pyrophosphorolysis and RNA-dependent DNA polymerization are serially coupled using 3? blocked primers. Due to this serial coupling, RNA-PAP has high selectivity against mismatches on the RNA template, providing highly specific amplification of RNA template. In addition, mutant polymerases were genetically engineered for higher efficiency of RNA-dependent DNA pyrophosphorolysis and RNA-dependent DNA polymerization.
    Type: Grant
    Filed: July 5, 2015
    Date of Patent: March 27, 2018
    Inventors: Shaofeng Ding, Qiang Liu
  • Publication number: 20180073067
    Abstract: The invention provides a method for lyophilizing integrated composition of pyrophosphorolysis activated polymerization (PAP) in an aqueous solution. It also provides lyophilized integrated PAP composition. Except for nucleic acid template, the integrated composition contains all components. For manipulation, simply add nucleic acid template in an aqueous solution to start amplification. In addition to the easy manipulation, the lyophilized integrated composition can be stored for prolonged period at ambiguous temperature.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 15, 2018
    Inventors: Shaofeng Ding, Qiang Liu
  • Patent number: 9856524
    Abstract: The invention provides a method for lyophilizing integrated composition of pyrophosphorolysis activated polymerization (PAP) in an aqueous solution. It also provides lyophilized integrated PAP composition. Except for nucleic acid template, the integrated composition contains all components. For manipulation, simply add nucleic acid template in an aqueous solution to start amplification. In addition to the easy manipulation, the lyophilized integrated composition can be stored for prolonged period at ambiguous temperature.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: January 2, 2018
    Inventors: Shaofeng Ding, Qiang Liu
  • Patent number: 9831139
    Abstract: A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the test element. A first wire is connected to the test element, and the first wire and the test element are part of a first layer disposed on a semiconductor substrate. A second wire is connected to the first wire, and is part of a second layer disposed on the semiconductor substrate, and the second layer is different from the first layer.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: November 28, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shaofeng Ding, Junjung Kim, Jeong HOON Ahn
  • Publication number: 20170207137
    Abstract: A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the test element. A first wire is connected to the test element, and the first wire and the test element are part of a first layer disposed on a semiconductor substrate. A second wire is connected to the first wire, and is part of a second layer disposed on the semiconductor substrate, and the second layer is different from the first layer.
    Type: Application
    Filed: January 18, 2016
    Publication date: July 20, 2017
    Inventors: Shaofeng DING, Junjung KIM, Jeong Hoon AHN
  • Publication number: 20160160273
    Abstract: The invention provides a method for lyophilizing integrated composition of pyrophosphorolysis activated polymerization (PAP) in an aqueous solution. It also provides lyophilized integrated PAP composition. Except for nucleic acid template, the integrated composition contains all components. For manipulation, simply add nucleic acid template in an aqueous solution to start amplification. In addition to the easy manipulation, the lyophilized integrated composition can be stored for prolonged period at ambiguous temperature.
    Type: Application
    Filed: December 4, 2014
    Publication date: June 9, 2016
    Inventors: Shaofeng Ding, Qiang Liu