Abstract: The present invention discloses an over-current protection device and the apparatus thereof. The over-current protection device includes a first electrode foil, a second electrode foil and a plurality of polymer current-sensing elements, wherein the plurality of polymer current-sensing elements are formed by stacking and electrical connection in series. The first and second electrode foils are disposed on the corresponding surface of the plurality of polymer current-sensing elements, and the difference in the transition temperature between adjacent polymer current-sensing elements is at least 5° C.

Abstract: The present invention discloses an over-current protection apparatus for high voltage, which connects the ceramic current-sensing element and polymer current-sensing element in series to form a novel over-current protection apparatus. By the characteristic of the polymer current-sensing element having higher switching off speed, the invention first responds to the over-current by raising its temperature, and then the heat is thermally conducted through the adhesive layer to the ceramic current-sensing element, resulting in a voltage drop produced by the over-current partially or predominantly received by the ceramic current-sensing element. Thus, the over-current protection device of the invention not only can endure high voltage (>600V), but also will not exhibit a negative temperature coefficient phenomenon.

Abstract: The present invention discloses an over-current protection device comprising at least one resistance component, outer conductive members and at least one insulation layer. The resistance component includes a current sensing element, a first conductive member and a second conductive member. The first conductive member is located on the surface of the current sensing element. The second conductive member is located on the other surface of the current sensing element. The resistance components that are adjacent use conductive buried holes to electrically connect their first conductive members and their second conductive member. The outer conductive member includes a first conductive end and a second conductive end.

Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.

Abstract: The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.

Abstract: The present invention discloses an over-current protection apparatus, which comprises a current-sensitive element and at least two electrodes. The current-sensitive element is composed of a positive temperature coefficient (PTC) conductive composition, which includes at least one polymer, a conductive filler and a non-conductive filler. The melting point of the polymer is greater then 110° C., and the vicat softening point of the polymer is smaller than 110° C. for improving the conductivity and thermal stabilization of the over-current protection apparatus.

Abstract: A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.

Abstract: The present invention discloses a PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.

Abstract: The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.

Abstract: The present invention discloses an over-current protection apparatus, which comprises a current-sensitive element and at least two electrodes. The current-sensitive element is composed of a positive temperature coefficient (PTC) conductive composition, which includes at least one polymer, a conductive filler and a non-conductive filler. The melting point of the polymer is greater then 110° C., and the vicat softening point of the polymer is smaller than 110° C. for improving the conductivity and thermal stabilization of the over-current protection apparatus.

Abstract: The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.