Abstract: An electrical connector for transmitting electrical power includes at least one power pin with an ablative tip. The power pin has a body oriented in a direction of a longitudinal axis, and the ablative tip is at a terminal end along the longitudinal axis. The ablative tip includes a terminal edge and a support material positioned on a transverse side of the terminal edge that provides structural support to the terminal edge.

Abstract: According to some embodiments, a power supply component for a computer server may include a physical input receptacle adapted to receive with of an Alternating Current (“AC”) plug and a Direct Current (“DC”) plug. An AC-to-DC rectifier circuit coupled to the physical input receptacle may convert AC current into DC current when AC current is received via the physical input receptacle. The power supply component may also include a DC-to-DC voltage regulator to reduce voltages swings. The power supply component might be associated with, for example, a computer data center.

Abstract: Various techniques for managing power backup for computing devices are disclosed herein. In one embodiment, a method includes receiving data representing a backup capacity of one or more backup power units and data representing a backup power profile of one or more processing units sharing the one or more backup power units. A portion of the backup capacity may then be assigned to each of the one or more processing units based at least in part on both the received data representing the backup capacity of the one or more backup power units and the received data representing the profile of the one or more processing units.

Abstract: Certain computer systems having centralized power sources are described herein. In one embodiment, a computer system can include a processing unit and an enclosure containing the processing unit. The processing unit includes a motherboard having a processor and a clock circuitry operatively coupled to the processor. The processing unit can also include a power supply that includes a first rail configured to supply power at a first voltage to the processor on the motherboard and a second rail configured to supply power at a second voltage to the clock circuitry on the motherboard. The motherboard does not include a coin-type battery electrically coupled to the clock circuitry.

Abstract: Various techniques for managing power backup for computing devices are disclosed herein. In one embodiment, a method includes receiving data representing a backup capacity of one or more backup power units and data representing a backup power profile of one or more processing units sharing the one or more backup power units. A portion of the backup capacity may then be assigned to each of the one or more processing units based at least in part on both the received data representing the backup capacity of the one or more backup power units and the received data representing the profile of the one or more processing units.

Abstract: Various techniques for managing power backup for computing devices are disclosed herein. In one embodiment, a method includes receiving data representing a backup capacity of one or more backup power units and data representing a backup power profile of one or more processing units sharing the one or more backup power units. A portion of the backup capacity may then be assigned to each of the one or more processing units based at least in part on both the received data representing the backup capacity of the one or more backup power units and the received data representing the profile of the one or more processing units.

Abstract: Various techniques for modular power distribution in computing facilities are described herein. In one embodiment, a power distribution unit includes a first subsystem for receiving power from a power source. A configuration of the first subsystem corresponds to one or more characteristics of the power source. The power distribution unit also includes a second subsystem electrically coupled to one or more of processing units in a component enclosure. A configuration of the second subsystem is independent from the one or more characteristics of the power source. A set of connectors electrically couple the first subsystem to the second subsystem allowing the power from the power source to flow from the first subsystem, via the second subsystem, and to the processing units in the component enclosure.

Abstract: Various techniques for managing power backup for computing devices are disclosed herein. In one embodiment, a method includes receiving data representing a backup capacity of one or more backup power units and data representing a backup power profile of one or more processing units sharing the one or more backup power units. A portion of the backup capacity may then be assigned to each of the one or more processing units based at least in part on both the received data representing the backup capacity of the one or more backup power units and the received data representing the profile of the one or more processing units.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: The inventive system uses modular N+1 bulk power supplies to power a computer system. Thus, the individual BPSs may be replaced while the system is on-line. Each BPS is split into two halves, with each halve being run by a separate power grid. This means that if one of the power grids goes down, the other grid fills the power. Thus, there are no switching times or latencies, the inventive power supply system keeps running. When both power grids are present, each power supply halve in a BPS load shares 50/50. The two input AC power grids are each controlled separately via two power distribution control assemblies (PDCA). Each assembly can be separately configured for 3 phase wye, 3-phase delta or single phase inputs.

Abstract: A power throttling method and system for a memory controller in a computer system comprising a power supply module including a plurality of bulk power supplies (“BPSs”) are described. In one embodiment, each of the at BPSs provides to a power output monitor a status signal indicative of a status thereof. Responsive to receipt of the status signals, the power output monitor determines whether a bulk power supply capacity is below system power requirements. Responsive to a positive determination, the power output monitor drives a throttle control signal to the memory controller to a level indicative of an over-threshold state.

Abstract: Embodiments of a distributed front-end rectifier system in an electronics system and related methods are disclosed. One system embodiment comprises a first alternating current-to direct current (AC/DC) front end rectifier, a second AC/DC front end rectifier, and an AC power bus directly connected to the first AC/DC front end rectifier and the second AC/DC front end rectifier.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Abstract: A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.

Abstract: A system comprises a converter to produce an output voltage from at least a first input voltage and a second input voltage, and a selector to select a first circuit path in the converter to produce the output voltage from the first input voltage, and to select a second circuit path in the converter to produce the output voltage from the second input voltage.

Abstract: A system comprising a first board for electrical communication with a second board, at least one electrical communication connector positioned on one side of said first board, and slots constructed in said first board, said slots adapted for allowing at least one electrical communication connector positioned on said second board to mate through said slots with said first board electrical communication connector.

Abstract: A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.