Abstract: Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.

Abstract: A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.

Abstract: An example airborne conductive contaminant handling system is described. The airborne conductive contaminant handling system may include a handling circuit that is configured to selectively pass an electric current through a conductive contaminant. The airborne conductive contaminant handling system may also include an attracting circuit that is configured to attract an airborne conductive contaminant towards the handling circuit, where it can be subjected to the electric current.

Abstract: In one embodiment, a thermal dissipation system comprises a plurality of thermal members having surfaces adapted for transferring heat from heat generating elements, a heat sink, and a plurality of heat pipes, each of the heat pipes coupled between a respective one of the plurality of thermal members and the heat sink, wherein the plurality of heat pipes possess a sufficient amount of flexibility to enable each of the plurality of thermal members to be disposed over a range of positions relative to the heat sink.

Abstract: A system comprising a first board for electrical communication with a second board, at least one electrical communication connector positioned on one side of said first board, and slots constructed in said first board, said slots adapted for allowing at least one electrical communication connector positioned on said second board to mate through said slots with said first board electrical communication connector.

Abstract: A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for the failed fan sink. Optionally, the remaining fan sinks may be controlled to speed up upon detection of a failure, increasing their cooling capacity to compensate for the failed fan sink. Also optionally, a thermal coupling device such as heat pipes may be used as part of the thermal coupling between the fan sinks to increase the cooling efficiency of the remaining fan sinks to the device or devices closest to the failed fan sink. Also optionally, the thermal coupling device may be configured to allow some flexibility in the cooling device assembly allowing for the cooling of non-coplanar electronic devices.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

Abstract: A fused power cable assembly and method of integrating a protective device with a power source connector retaining bracket. A bracket assembly having a bulkhead retaining element, a protective device element, and a retaining element operable to couple the protective device to the bracket allows for mounting of protective device(s) to the bracket instead of the bulkhead, thereby saving space. A power cabling assembly having a bracket assembly, a power connector, and a fastening element operable to couple the power connector to the bulkhead and the bulkhead to the bracket assembly, allowing assembly of the power cabling assembly prior to installation into target equipment.

Abstract: A multiple-input redundant power system accepts both AC and DC power inputs. Redundancy is further provided by the use of converters for the AC input, and converters for the DC input. An output distribution element provides for simple combining of converter outputs, and for more complex load sharing and load control arrangements. Advantages accruing from the AC/DC input approach are savings in facility infrastructure, since existing power sources can be utilized, and high availability and reliability in accordance with certain embodiments. The approach has many applications in computing and telecommunications.

Abstract: Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.

Abstract: In another embodiment, the present invention is directed to a power distribution system for electronic equipment, comprising a voltage bus; a plurality of power supplies coupled in parallel to the voltage bus; a plurality of diodes wherein each of the diodes is disposed between a power supply and the voltage bus to isolate the voltage bus from a low power supply voltage; a plurality of sense lines, wherein each of the sense lines is coupled to one of the plurality of power supplies; and a plurality of resistive elements, wherein each of the resistive elements is coupled to the voltage bus and to a respective sense line of the plurality of sense lines, wherein the plurality of resistive elements maintain, when a minimal load is applied to the voltage bus, the sense lines at a voltage sufficiently lower than a voltage of the voltage bus to cause the plurality of power supplies to prevent the plurality of diodes from being reversed-biased.

Abstract: The present invention determines temperature and current from resistance measurements of a single magnetoresistive sensor. A dual-purpose sensor includes the magnetoresistive sensor having a single pair of terminals. The sensor is multiplexed under separate current conditions to produce both a temperature measurement and a current measurement in a vicinity of the sensor. A sensor system includes the dual-purpose sensor, a resistance sensing subsystem and a controller that controls the current conditions. A method of measuring temperature and current includes measuring a first resistance of the dual-purpose sensor while a first current is flowing in a conductor adjacent to the sensor, and measuring a second resistance of the sensor while a second current is flowing in the conductor. The first current has a known value while the second current has an unknown value. The temperature and current are determined respectively from the first and second resistance measurements.

Abstract: An example airborne conductive contaminant handling system is described. The airborne conductive contaminant handling system may include a handling circuit that is configured to selectively pass an electric current through a conductive contaminant. The airborne conductive contaminant handling system may also include an attracting circuit that is configured to attract an airborne conductive contaminant towards the handling circuit, where it can be subjected to the electric current. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the application. It is submitted with the understanding that it will not be employed to interpret or limit the scope or meaning of the claims.

Abstract: An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.