Abstract: Methods and apparatuses are contemplated herein for enhancing the efficiency of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a substrate and 3D array of nonvolatile memory cells, the 3D array including a plurality of conductive layers, separated from each other by insulating layers, the plurality of conductive layers comprising a top layer, the top layer comprising n string select lines (SSLs) and one or more bottom layers, the top layer further comprises n?1 cuts, each cut electrically separating two SSLs, wherein each cut is cut to a depth of the top layer and not extending into the bottom layers and a plurality of vertical channels arranged orthogonal to the plurality of layers, each of the plurality of channels comprising a string of memory cells, each of plurality of strings coupled to a bit line, an SSL and one or more word lines.

Abstract: Methods and apparatuses are contemplated herein for enhancing the program performance of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a 3D array of nonvolatile memory cells including a plurality of layers, each layer comprising NAND strings of nonvolatile memory cells, the NAND strings coupled to a bit line, and a plurality SSLs and word lines, the SSLs and the word lines arranged orthogonally to the NAND strings, the word lines establishing the nonvolatile memory cells at cross-points between surfaces of the plurality of NAND strings and the word lines, each of the NAND strings further comprising a plurality of SSL transistors coupling the SSLs to the NAND strings, wherein at least a first SSL being configured to receive a first voltage and a second SSL configured to receive at second voltage, and wherein the second SSL being nearer to the word lines.

Abstract: Methods and apparatuses are contemplated herein for enhancing the efficiency of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a substrate and 3D array of nonvolatile memory cells, the 3D array including a plurality of conductive layers, separated from each other by insulating layers, the plurality of conductive layers comprising a top layer, the top layer comprising n string select lines (SSLs) and one or more bottom layers, the top layer further comprises n?1 cuts, each cut electrically separating two SSLs, wherein each cut is cut to a depth of the top layer and not extending into the bottom layers and a plurality of vertical channels arranged orthogonal to the plurality of layers, each of the plurality of channels comprising a string of memory cells, each of plurality of strings coupled to a bit line, an SSL and one or more word lines.

Abstract: The present invention provides methods and associated devices for controlling the voltage threshold distribution corresponding to performing a function on cells of non-volatile memory device. In one embodiment, a method is provided. The method may comprise providing the non-volatile memory device. The device comprises one or more strings, each string comprising a plurality of cells, the plurality of cells comprising a first cell and a second cell. The method further comprises performing a function of the non-volatile memory device by applying a first function voltage to the first cell and a second function voltage to the second cell. The first function voltage and the second function voltage are different.

Abstract: Embodiments of the present invention provide improved 3D non-volatile memory devices and associated methods. In one embodiment, a string of 3D non-volatile memory cells is provided. The string comprises a core extending along an axis of the string, the core having an elliptical cross section in a plane perpendicular to the axis; and a plurality of word lines, each word line disposed around a part of the core, the plurality of word lines spaced along the axis, and each word line corresponding to one of the memory cells. In various embodiments, at least one operating parameter is defined in order to improve the operation of the 3D non-volatile memory device.

Abstract: Provided are improved semiconductor memory devices and methods for manufacturing such semiconductor memory devices. A method may incorporate the formation of a p-n junction in a conductive layer. The method may allow for the production of semiconductor memory devices of reduced size.

Abstract: A three-dimensional memory, which includes memory cell stacked structures. The memory cell stacked structures are stacked by a plurality of memory cell array structures and insulation layers alternatively, and each memory cell array structure includes word lines, active layers, composite layers and sources/drains. The word lines, the active layers and the composite layers extend along a Y direction. The active layers are disposed between the adjacent word lines. The composite layers are disposed between the adjacent word lines and the adjacent active layers, and each composite layer includes a first dielectric layer, a charge storage layer and a second dielectric layer in sequence from the active layers. The sources/drains are disposed in the active layers at equal intervals. A memory cell includes two adjacent sources/drains, the active layer between the two adjacent sources/drains, the first dielectric layer, the charge storage layer and the second dielectric layer on the active layer, and the word lines.

Abstract: The present invention provides a manufacturing method of a non-volatile memory including forming a gate dielectric layer on a substrate; forming a floating gate on the gate dielectric layer; forming a first charge blocking layer on the floating gate; forming a nitride layer on the first charge blocking layer; forming a second charge blocking layer on the nitride layer; forming a control gate on the second charge blocking layer; and performing a treatment to the nitride layer to get a higher dielectric constant.

Abstract: The present invention provides a manufacturing method of a non-volatile memory including forming a gate dielectric layer on a substrate; forming a floating gate on the gate dielectric layer; forming a first charge blocking layer on the floating gate; forming a nitride layer on the first charge blocking layer; forming a second charge blocking layer on the nitride layer; forming a control gate on the second charge blocking layer; and performing a treatment to the nitride layer to get a higher dielectric constant.

Abstract: A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a gate dielectric layer, a floating gate, a control gate, an inter-gate dielectric structure and two doped regions. The gate dielectric layer is disposed on a substrate. The floating gate is disposed on the gate dielectric layer. The control gate is disposed on the floating gate. The inter-gate dielectric structure is disposed between the control gate and the floating gate. The inter-gate dielectric structure includes a first oxide layer, a second oxide layer and a charged nitride layer. The first oxide layer is disposed on the floating gate. The second oxide layer is disposed on the first oxide layer. The charged nitride layer is disposed between the first oxide layer and the second oxide layer. The doped regions are disposed in the substrate at two sides of the floating gate, respectively.

Abstract: A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a gate dielectric layer, a floating gate, a control gate, an inter-gate dielectric structure and two doped regions. The gate dielectric layer is disposed on a substrate. The floating gate is disposed on the gate dielectric layer. The control gate is disposed on the floating gate. The inter-gate dielectric structure is disposed between the control gate and the floating gate. The inter-gate dielectric structure includes a first oxide layer, a second oxide layer and a charged nitride layer. The first oxide layer is disposed on the floating gate. The second oxide layer is disposed on the first oxide layer. The charged nitride layer is disposed between the first oxide layer and the second oxide layer. The doped regions are disposed in the substrate at two sides of the floating gate, respectively.

Abstract: A non-volatile memory structure including a substrate, stacked patterns and stress patterns is provided. The stacked patterns are disposed on the substrate. Each of the stacked patterns includes a charge storage structure and a gate from bottom to top. Here, the charge storage structure at least includes a charge storage layer. The stress patterns are disposed on the substrate between the two adjacent stacked patterns, respectively.

Abstract: A NAND memory device includes strings of NAND memory cells, where each memory cell includes a charge trapping structure formed over a lightly-doped substrate region. A selected one of the NAND memory cells can be programmed by application of a relatively low program voltage in combination with a previously-applied set-up voltage, which is applied to the substrate for initiating inversion. The inversion in the substrate causes electrons to become hot in the channel regions, including the channel of the selected memory cell. As a result, the relatively lower program voltage can be used at the control gate of the selected memory cell for sufficiently energizing hot electrons to tunnel into the charge trapping structure of the selected memory cell.

Abstract: A method for simulating operation of a charge trapping memory cell which computes the amount of charge trapped by determining first tunneling current through the tunneling layer, determining second tunneling current out of the charge trapping layer to the gate, determining third tunneling current escaping from traps in the charge trapping layer and tunneling out to the gate, and integrating said tunneling currents over a time interval. A change in threshold voltage can be computed for a transistor including the charge trapping structure. The parameter set can include only physical parameters, including layer thickness, band offsets and dielectric constants.

Abstract: A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

Abstract: A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

Abstract: A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

Abstract: A method for simulating operation of a charge trapping memory cell which computes the amount of charge trapped by determining first tunneling current through the tunneling layer, determining second tunneling current out of the charge trapping layer to the gate, determining third tunneling current escaping from traps in the charge trapping layer and tunneling out to the gate, and integrating said tunneling currents over a time interval. A change in threshold voltage can be computed for a transistor including the charge trapping structure. The parameter set can include only physical parameters, including layer thickness, band offsets and dielectric constants.

Abstract: A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

Abstract: A non-volatile memory structure including a substrate, stacked patterns and stress patterns is provided. The stacked patterns are disposed on the substrate. Each of the stacked patterns includes a charge storage structure and a gate from bottom to top. Here, the charge storage structure at least includes a charge storage layer. The stress patterns are disposed on the substrate between the two adjacent stacked patterns, respectively.