Abstract: A reticle pod includes an outer pod, an inner pod cover and an inner base plate. A reticle is supported on the base and is contained within the environment created by the inner pod cover and the inner pod base. The inner pod cover can include a plurality of reticle retainers configured to contact a side wall of the reticle and limit movement of the reticle in a horizontal direction.

Abstract: A substrate container including a plate, a shell, a connector, and a seal, where the connector is threaded and secured via a nut, and the seal contacts each of the shell, plate, and connector. The plate has a recess accommodating an end of the connector and the nut. Field-serviceable, removable purge modules including check valves may be used with the substrate container, and may be secured to the substrate container in the recess in the plate. Filters may be secured to the connector or included in the purge modules. These filters may have diameters larger than an internal diameter of the connector.

Abstract: A reticle pod includes an outer pod, an inner pod cover and an inner base plate. A reticle is supported on the base and is contained within the environment created by the inner pod cover and the inner pod base. The inner pod cover can include a plurality of reticle retainers configured to contact a side wall of the reticle and limit movement of the reticle in a horizontal direction.

Abstract: A pod for transporting reticles includes an inner cover and an inner base plate. The inner base plate cooperates with the cover to establish a space for mounting a reticle. The inner base plate includes a hole having a perimeter and first and second flanges extending inward from the perimeter. A window assembly is mounted in the hole. The window assembly includes a transparent plate, a seal and a retainer. The seal contacts the outer or side planar surface of the transparent plate and the perimeter of the hole to seal an interface between the window assembly and the hole. The retainer contacts the second flange to retain the seal and transparent plate within the hole.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A wafer container with a door, the door has at least one latching mechanism, wherein the latching mechanism has a spring member that holds the latching mechanism at one or more desired positions that preferably correspond to latch-open and latch-closed conditions. In a preferred embodiment, the spring member has an over-center condition that urges the latching mechanism towards the favored positions, thereby resisting unintended actuation of the latching mechanism. Moreover, in preferred embodiments, the latching mechanism has soft stops at the latch open or latch closed condition that minimizes abrupt snapping into position of the latching mechanism. Preferred embodiments utilize a rotatable member configured as a cammed member with an elongate rigid plastic member having at least one node, forming a plastic spring. The spring is pivotally mounted on the rotatable member and pivotally mounted to the door structure.

Abstract: A wafer container for supporting semi-conductor wafer disks and for interfacing with processing equipment and methods for constructing the same. Wafer supports are positioned within an enclosure portion, the wafer supports having a plurality of vertically stacked shelves for defining slots. The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin. In preferred embodiments resilient plastic spring members extend between the closed top and the wafer supports to substantially constrain lateral or forward-back movement of the wafer supports with respect to the closed top and to permit some vertical movement of the wafer support with respect to the closed top. The spring members may be configured as a leaf spring integral with an extending from the top margin of each wafer support.

Abstract: A fuel cell system has an improved connector assembly to provide for the quick connection of a fuel cartridge and the fuel cell. Two leak resistant connector members with an easy to engage coupling mechanism that stably grips the two connector members to provide for flow between the members. The first connector member is adapted to engage the second connector member to form a unitary structure, which can establish fluid communication between the connector members. Generally, both the first connector member and the second connector member comprise a fluid flow path that can be each sealed/unsealed by a poppet valve or other suitable valve members. In some embodiments, the connector members can be engaged/disengaged by rotating an element of the coupling mechanism. The connector assemblies can be particularly useful for the connection of a fuel cell with a fuel cartridge.

Abstract: A wafer container, and methods of constructing a wafer container. The wafer container has an enclosure portion with at least a top, a bottom, a pair of opposing sides, a back, an open front, and a door to close the open front. The door includes a door chassis with at least a first latching mechanism. The latching mechanism has a rotatable cam member and at least one latching arm. The latching arm has a bifurcate cam follower portion that engages with the periphery of the cam member.

Abstract: In a preferred embodiment of the invention, a wafer retaining arrangement is incorporated into a transport module suitable for 300 mm wafers. The wafer retaining arrangement attaches to an interior of a door of the transport module and includes a framework, and a first and a second plurality of wafer engaging members that secure semiconductor wafers within the transport module and that extend laterally from respective first and second sidewall portions and are preferably parallel to one another. Each of the wafer engaging members includes an arm portion and a wafer engagement head spaced laterally from the respective sidewall portion, wherein the wafer engagement heads of the first plurality of wafer engaging members are in close proximity to the wafer engagement heads of the second plurality of wafer engaging members.

Abstract: A wafer container having a door with at least one latching mechanism, wherein the latching mechanism has a spring member that holds the latching mechanism at one or more favored positions that preferably correspond to latch-open and latch-closed conditions. In a preferred embodiment, the spring member has an over-center condition that urges the latching mechanism towards the favored positions, thereby resisting unintended actuation of the latching mechanism. Moreover, in preferred embodiments, the latching mechanism has soft stops at the latch open or latch closed condition that minimizes abrupt snapping into position of the latching mechanism. Preferred embodiments utilize a rotatable member configured as a cammed member with an elongate rigid plastic member having at least one node, forming a plastic spring. The spring is pivotally mounted on the rotatable member and pivotally mounted to the door structure.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A wafer container comprises a housing with a door frame, defining an opening for insertion and removal of wafers, and a door for insertion into the door frame. The door includes a wafer enclosure sealing arrangement for hermetically sealing the door with the door frame of the housing. The wafer enclosure sealing arrangement includes a first groove disposed about a perimeter of the interior surface of the door and a second groove disposed adjacent to the first groove and spaced laterally from the perimeter of the door. The sealing arrangement includes a support member disposed between the first and second grooves. The sealing arrangement also includes an elastomeric seal member having a first portion that is frictionally inserted into the second groove and extends around the door and a second portion that cantilevers downward into the second groove when the door and housing are joined.

Abstract: A wafer container for supporting semi-conductor wafer disks and for interfacing with processing equipment and methods for constructing the same. Wafer supports are positioned within an enclosure portion, the wafer supports having a plurality of vertically stacked shelves for defining slots. The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin. In preferred embodiments resilient plastic spring members extend between the closed top and the wafer supports to substantially constrain lateral or forward-back movement of the wafer supports with respect to the closed top and to permit some vertical movement of the wafer support with respect to the closed top. The spring members may be configured as a leaf spring integral with an extending from the top margin of each wafer support.

Abstract: A process for manufacturing a wafer carrier including injection molding a wafer support structure. The wafer support structure has a plurality of wafer support shelves extending therefrom. The process further includes molding a wafer contact portion on each of the wafer support shelves. The wafer contact portions bond with the wafer support shelves without mechanical fasteners between the wafer contact portions and the wafer support shelves. The process also includes overmolding a shell over the wafer support structure to form the wafer carrier. The shell bonds with the wafer support structure without mechanical fasteners between the shell and the wafer support structure. The wafer contact portions define a plurality of slots for holding a plurality of wafers.

Abstract: A wafer container and improved door. The wafer container door has a latch mechanism cover adapted to retain and guide the latch mechanism components. The latch mechanism cover is form fitted to the latch mechanism components and may have apertures, creating a cover with an open architecture. The open architecture is of benefit for making the area under the mechanism cover more easily cleanable.

Abstract: A door for a wafer carrier having a latching mechanism with a rotatable actuating member. The rotatable actuating member is actuated from outside the wafer carrier using a key inserted into a key slot in the rotatable actuating member. The key slot is formed in an hourglass shape and comprised of abrasion resistant material to reduce generation of particulate contaminants.