Patents by Inventor Shawn Hall

Shawn Hall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230368303
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Asurion, LLC
    Inventors: Jeff KULLA, Shawn Hall
  • Publication number: 20230182240
    Abstract: An apparatus comprising a first component comprised of a first material, wherein the first material has a first thermal contraction property. A second component comprised of a second material, wherein the second material has a second thermal contraction property, wherein the second component has an opening where a portion of the first component is inserted into at room temperature. Wherein the second thermal contraction property is larger than the first thermal contraction property and when at cryogenic temperatures, the first component and second component constrict, wherein the second component constricts more than the first component causing the second component to exert a constricting force on the portion of the first component inserted into the opening of the second component.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Shawn Hall, Robert Shelby, Charles Rettner
  • Publication number: 20210224920
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Applicant: Asurion, LLC
    Inventors: Jeff KULLA, Shawn HALL
  • Publication number: 20190005589
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: September 5, 2018
    Publication date: January 3, 2019
    Applicant: Asurion, LLC
    Inventors: Jeff Kulla, Shawn Hall
  • Patent number: 9723760
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: August 1, 2017
    Assignee: International Business Machines Corporation
    Inventor: Shawn Hall
  • Publication number: 20170135245
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Application
    Filed: February 11, 2013
    Publication date: May 11, 2017
    Applicant: International Business Machines Corporation
    Inventor: Shawn Hall
  • Publication number: 20160078553
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: November 20, 2015
    Publication date: March 17, 2016
    Applicant: ASURION, LLC
    Inventors: Jeff Kulla, Shawn Hall
  • Publication number: 20150252608
    Abstract: In one embodiment, a subterranean hydraulic security system comprises a safe, support legs, and a lifting means, such as a hydraulic scissor lift and a pump, a screw jack, or other equivalent means. The underground safe system may also comprise an oversized upper portion formed from concrete, wood, or other rigid material. In another embodiment, a subterranean hydraulic security system comprises a gate, securing posts, and a lifting means.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 10, 2015
    Inventors: Michael Shawn Hall, Jason Neil Hall
  • Publication number: 20150092352
    Abstract: An article of manufacture comprises a composite, layered, and compressible TIM differentially adhered to a heat-spreader surface and a heat-source surface, such as a circuit card, where at least one of the surfaces comprises an uneven surface, and the TIM is compressively bonded to the uneven surface. The adhesive strength of the TIM to the heat-spreader surface is unequal to the adhesive strength of the TIM to the heat-source surface, and is adjusted so that the heat-spreader surface and the heat-source surface can be separated without damaging the heat-source surface. A process comprises manufacturing the article of manufacture.
    Type: Application
    Filed: September 29, 2013
    Publication date: April 2, 2015
    Applicant: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Paul W. Croteus, Michael Gaynes, Shawn Hall, Shurong Tian
  • Publication number: 20140223946
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Application
    Filed: February 11, 2013
    Publication date: August 14, 2014
    Applicant: International Business Machines Corporation
    Inventor: Shawn Hall
  • Patent number: 8799244
    Abstract: Example apparatus, methods, and computers control establishing a shared parse scope between two computers that intend to be involved in a shared de-duplication action. One example method includes, upon determining that a first de-duplication logic and a second de-duplication logic are to participate in a shared de-duplication action for an object, controlling the first de-duplication logic to establish a shared parse scope with the second de-duplication logic. Establishing the shared parse scope may include negotiations between the computers, where the negotiations transfer dialect information. The dialect information may take the form of rules. The method may also include persisting the shared parse scope.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: August 5, 2014
    Inventors: Jeffrey Vincent Tofano, Shawn Hall
  • Publication number: 20140046856
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: October 14, 2013
    Publication date: February 13, 2014
    Applicant: Asurion, LLC.
    Inventors: Jeff Kulla, Shawn Hall
  • Publication number: 20130097131
    Abstract: Example apparatus, methods, and computers control establishing a shared parse scope between two computers that intend to be involved in a shared de-duplication action. One example method includes, upon determining that a first de-duplication logic and a second de-duplication logic are to participate in a shared de-duplication action for an object, controlling the first de-duplication logic to establish a shared parse scope with the second de-duplication logic. Establishing the shared parse scope may include negotiations between the computers, where the negotiations transfer dialect information. The dialect information may take the form of rules. The method may also include persisting the shared parse scope.
    Type: Application
    Filed: May 3, 2012
    Publication date: April 18, 2013
    Applicant: QUANTUM CORPORATION
    Inventors: Jeffrey Vincent TOFANO, Shawn Hall
  • Patent number: 7761687
    Abstract: A massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. The use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: July 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Matthias A. Blumrich, Dong Chen, George Chiu, Thomas M. Cipolla, Paul W. Coteus, Alan G. Gara, Mark E. Giampapa, Shawn Hall, Rudolf A. Haring, Philip Heidelberger, Gerard V. Kopcsay, Martin Ohmacht, Valentina Salapura, Krishnan Sugavanam, Todd Takken
  • Publication number: 20090006808
    Abstract: A novel massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. Novel use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 1, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthias A. Blumrich, Dong Chen, George Chiu, Thomas M. Cipolla, Paul W. Coteus, Alan G. Gara, Mark E. Giampapa, Shawn Hall, Rudolf A. Haring, Philip Heidelberger, Gerard V. Kopcsay, Martin Ohmacht, Valentina Salapura, Krishnan Sugavanam, Todd Takken
  • Publication number: 20080055851
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Application
    Filed: September 27, 2007
    Publication date: March 6, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shawn Hall, Shurong Tian, Paul Coteus, John Karidis, Evan Colgan, Robert Guernsey
  • Publication number: 20080055856
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Application
    Filed: September 27, 2007
    Publication date: March 6, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shawn Hall, Shurong Tian, Paul Coteus, John Karidis, Evan Colgan, Robert Guernsey
  • Publication number: 20080045052
    Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.
    Type: Application
    Filed: September 14, 2007
    Publication date: February 21, 2008
    Inventors: Paul Coteus, Kevin Gower, Shawn Hall, Gareth Hougham, Dale Pearson
  • Publication number: 20080001275
    Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.
    Type: Application
    Filed: September 14, 2007
    Publication date: January 3, 2008
    Inventors: Paul Coteus, Kevin Gower, Shawn Hall, Gareth Hougham, Dale Pearson
  • Publication number: 20070054512
    Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography.
    Type: Application
    Filed: January 5, 2006
    Publication date: March 8, 2007
    Applicant: International Business Machines Corporation
    Inventors: Gareth Hougham, Brian Beaman, John Corbin, Paul Coteus, Shawn Hall, Kathleen Hinge, Theron Lewis, Frank Libsch, Amanda Mikhail