Patents by Inventor Shawn Hall

Shawn Hall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasmon resonance system, instrument, and device for measuring molecular interactions
    Patent number: 11927530
    Abstract: A plasmon resonance (PR) system, instrument, and/or device and configurations thereof for measuring molecular interactions is disclosed. In some embodiments, the PR system, instrument, and/or device is a localized surface plasmon resonance (LSPR) system, instrument, and/or device. In other embodiments, the PR system, instrument, and/or device is a surface plasmon resonance (SPR) system, instrument. The PR system, instrument, and/or device may include, for example, force feedback for reliable flow cell sealing, optical feedback for reliable flow cell sealing, local thermal control of an LSPR chip (e.g., a ring Peltier, a continuous Peltier), dual displacement pumps for constant flow delivery to a microfluidic device, a dual channel LSPR sensor, and any combinations thereof.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 12, 2024
    Assignee: Nicoya Lifesciences Inc.
    Inventors: Ryan Denomme, Shawn Fitzpatrick, Jason Garr, Krishna Iyer, Gordon Hall, Champika Samarasekera
  • Device Account Upgrade-At-Claim
    Publication number: 20230368303
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Asurion, LLC
    Inventors: Jeff KULLA, Shawn Hall
  • Application of differential thermal contraction to obtain improved cryogenic interfacial contact
    Publication number: 20230182240
    Abstract: An apparatus comprising a first component comprised of a first material, wherein the first material has a first thermal contraction property. A second component comprised of a second material, wherein the second material has a second thermal contraction property, wherein the second component has an opening where a portion of the first component is inserted into at room temperature. Wherein the second thermal contraction property is larger than the first thermal contraction property and when at cryogenic temperatures, the first component and second component constrict, wherein the second component constricts more than the first component causing the second component to exert a constricting force on the portion of the first component inserted into the opening of the second component.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Shawn Hall, Robert Shelby, Charles Rettner
  • Burst resistant thin wall heat sink
    Patent number: 11131506
    Abstract: An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: September 28, 2021
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Device Account Upgrade-At-Claim
    Publication number: 20210224920
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Applicant: Asurion, LLC
    Inventors: Jeff KULLA, Shawn HALL
  • Water-assisted air cooling for a row of cabinet
    Patent number: 10986753
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: April 20, 2021
    Assignee: International Business Machines Corporation
    Inventor: Shawn A. Hall
  • Interdigitated power connector
    Patent number: 10833436
    Abstract: An electrical connector carries large amounts of electrical current between two circuit boards with low resistance and low self-inductance by means of an interdigitated anode and cathode, thereby providing low dynamic voltage loss. The connector also may include, near where power will be consumed, an interposer board with on-board capacitance to provide even lower dynamic voltage loss. The connector has application to delivering low-voltage, high-current power from a power supply on a first board to electronics on a second board: the low resistance provides low voltage drop for a load current that is constant, while the low inductance and the capacitors provide low voltage fluctuation for a load current that changes. These issues are of great importance, for example, in designing high-performance computers.
    Type: Grant
    Filed: December 24, 2017
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Andrew Ferencz, Shawn A. Hall, Todd E. Takken
  • High-density, fail-in-place switches for computer and data networks
    Patent number: 10749817
    Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: August 18, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • High-density, fail-in-place switches for computer and data networks
    Patent number: 10389654
    Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: August 20, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • INTERDIGITATED POWER CONNECTOR
    Publication number: 20190199019
    Abstract: An electrical connector carries large amounts of electrical current between two circuit boards with low resistance and low self-inductance by means of an interdigitated anode and cathode, thereby providing low dynamic voltage loss. The connector also may include, near where power will be consumed, an interposer board with on-board capacitance to provide even lower dynamic voltage loss. The connector has application to delivering low-voltage, high-current power from a power supply on a first board to electronics on a second board: the low resistance provides low voltage drop for a load current that is constant, while the low inductance and the capacitors provide low voltage fluctuation for a load current that changes. These issues are of great importance, for example, in designing high-performance computers.
    Type: Application
    Filed: December 24, 2017
    Publication date: June 27, 2019
    Inventors: Paul W. Coteus, Andrew Ferencz, Shawn A. Hall, Todd E. Takken
  • BURST RESISTANT THIN WALL HEAT SINK
    Publication number: 20190154340
    Abstract: An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
    Type: Application
    Filed: January 25, 2019
    Publication date: May 23, 2019
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Burst resistant thin wall heat sink
    Patent number: 10222125
    Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Flexible cold plate with enhanced flexibility
    Patent number: 10215504
    Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: February 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS
    Publication number: 20190020597
    Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
    Type: Application
    Filed: September 19, 2018
    Publication date: January 17, 2019
    Inventors: Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Device Account Upgrade-At-Claim
    Publication number: 20190005589
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: September 5, 2018
    Publication date: January 3, 2019
    Applicant: Asurion, LLC
    Inventors: Jeff Kulla, Shawn Hall
  • Implementing inverted master-slave 3D semiconductor stack
    Patent number: 10068886
    Abstract: A method and apparatus are provided for implementing an enhanced three dimensional (3D) semiconductor stack. A chip carrier has an aperture of a first length and first width. A first chip has at least one of a second length greater than the first length or a second width greater than the first width; a second chip attached to the first chip, the second chip having at least one of a third length less than the first length or a third width less than the first width; the first chip attached to the chip carrier by connections in an overlap region defined by at least one of the first and second lengths or the first and second widths; the second chip extending into the aperture; and a heat spreader attached to the chip carrier and in thermal contact with the first chip for dissipating heat from both the first chip and second chip.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 4, 2018
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Todd E. Takken
  • Multi-petascale highly efficient parallel supercomputer
    Patent number: 9971713
    Abstract: A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaflop-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC). The ASIC nodes are interconnected by a five dimensional torus network that optimally maximize the throughput of packet communications between nodes and minimize latency. The network implements collective network and a global asynchronous network that provides global barrier and notification functions. Integrated in the node design include a list-based prefetcher. The memory system implements transaction memory, thread level speculation, and multiversioning cache that improves soft error rate at the same time and supports DMA functionality allowing for parallel processing message-passing.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: May 15, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sameh Asaad, Ralph E. Bellofatto, Michael A. Blocksome, Matthias A. Blumrich, Peter Boyle, Jose R. Brunheroto, Dong Chen, Chen-Yong Cher, George L. Chiu, Norman Christ, Paul W. Coteus, Kristan D. Davis, Gabor J. Dozsa, Alexandre E. Eichenberger, Noel A. Eisley, Matthew R. Ellavsky, Kahn C. Evans, Bruce M. Fleischer, Thomas W. Fox, Alan Gara, Mark E. Giampapa, Thomas M. Gooding, Michael K. Gschwind, John A. Gunnels, Shawn A. Hall, Rudolf A. Haring, Philip Heidelberger, Todd A. Inglett, Brant L. Knudson, Gerard V. Kopcsay, Sameer Kumar, Amith R. Mamidala, James A. Marcella, Mark G. Megerian, Douglas R. Miller, Samuel J. Miller, Adam J. Muff, Michael B. Mundy, John K. O'Brien, Kathryn M. O'Brien, Martin Ohmacht, Jeffrey J. Parker, Ruth J. Poole, Joseph D. Ratterman, Valentina Salapura, David L. Satterfield, Robert M. Senger, Burkhard Steinmacher-Burow, William M. Stockdell, Craig B. Stunkel, Krishnan Sugavanam, Yutaka Sugawara, Todd E. Takken, Barry M. Trager, James L. Van Oosten, Charles D. Wait, Robert E. Walkup, Alfred T. Watson, Robert W. Wisniewski, Peng Wu
  • Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense
    Patent number: 9831783
    Abstract: An apparatus includes a first circuit board including first components including a load, and a second circuit board including second components including switching power devices and an output inductor. Ground and output voltage contacts between the circuit boards are made through soldered or connectorized interfaces. Certain components on the first circuit board and certain components, including the output inductor, on the second circuit board act as a DC-DC voltage converter for the load. An output capacitance for the conversion is on the first circuit board with no board-to-board interface between the output capacitance and the load. The inductance of the board-to-board interface functions as part of the output inductor's inductance and not as a parasitic inductance. Sense components for sensing current through the output inductor are located on the first circuit board. Parasitic inductance of the board-to-board interface has less effect on a sense signal provided to a controller.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: November 28, 2017
    Assignee: International Business Machines Corporation
    Inventors: Paul W Coteus, Andrew Ferencz, Shawn A Hall, Todd E Takken, Shurong Tian, Xin Zhang
  • WATER-ASSISTED AIR COOLING FOR A ROW OF CABINET
    Publication number: 20170311488
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 26, 2017
    Inventor: Shawn A. Hall
  • Water-assisted air cooling for a row of cabinets
    Patent number: 9723760
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: August 1, 2017
    Assignee: International Business Machines Corporation
    Inventor: Shawn Hall