Patents by Inventor Shawna Liff
Shawna Liff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10249515Abstract: Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.Type: GrantFiled: April 1, 2016Date of Patent: April 2, 2019Assignee: Intel CorporationInventors: Jimin Yao, Eric Li, Shawna Liff
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Patent number: 10090259Abstract: Electronic device shape configuration technology is disclosed. In an example, an electronic device substrate is provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. An electronic device die is also provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. In addition, an electronic device package is provided that can comprise a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface. The package can also include a die having a top surface and a bottom surface opposing the top surface. The die can be coupled to the top surface of the substrate. The top surface and/or the bottom surface of either the substrate, or the die, or both can have a non-rectangular shaped perimeter.Type: GrantFiled: December 26, 2015Date of Patent: October 2, 2018Assignee: Intel CorporationInventors: Pramod Malatkar, Sairam Agraharam, Shawna Liff
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Publication number: 20180263117Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.Type: ApplicationFiled: November 13, 2017Publication date: September 13, 2018Inventors: Sasha N. Oster, Robert L. Sankman, Charles Gealer, Omkar Karhade, John S. Guzek, Ravindranath V. Mahajan, James C. Matayabas, JR., Johanna M. Swan, Feras Eid, Shawna Liff, Timothy McIntosh, Telesphor Kamgaing, Adel A. Elsherbini, Kemal Aygun
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Patent number: 9942980Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.Type: GrantFiled: May 28, 2014Date of Patent: April 10, 2018Assignee: INTEL CORPORATIONInventors: Chuan Hu, Adel A. Elsherbini, Yoshihiro Tomita, Shawna Liff
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Publication number: 20180049309Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.Type: ApplicationFiled: October 25, 2017Publication date: February 15, 2018Inventors: Adel A. Elsherbini, Aleksandar Aleksov, Shawna Liff
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Patent number: 9832863Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.Type: GrantFiled: September 25, 2015Date of Patent: November 28, 2017Assignee: Intel CorporationInventors: Adel Elsherbini, Aleksandar Aleksov, Shawna Liff
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Patent number: 9820384Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.Type: GrantFiled: December 11, 2013Date of Patent: November 14, 2017Assignee: Intel CorporationInventors: Sasha Oster, Robert L. Sankman, Charles Gealer, Omkar Karhade, John S. Guzek, Ravi V. Mahajan, James C. Matayabas, Jr., Johanna Swan, Feras Eid, Shawna Liff, Timothy McIntosh, Telesphor Kamgaing, Adel Elsherbini, Kemal Aygun
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Publication number: 20170287735Abstract: Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.Type: ApplicationFiled: April 1, 2016Publication date: October 5, 2017Applicant: Intel CorporationInventors: Jimin Yao, Eric Li, Shawna Liff
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Publication number: 20170186705Abstract: Electronic device shape configuration technology is disclosed. In an example, an electronic device substrate is provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. An electronic device die is also provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. In addition, an electronic device package is provided that can comprise a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface. The package can also include a die having a top surface and a bottom surface opposing the top surface. The die can be coupled to the top surface of the substrate. The top surface and/or the bottom surface of either the substrate, or the die, or both can have a non-rectangular shaped perimeter.Type: ApplicationFiled: December 26, 2015Publication date: June 29, 2017Applicant: Intel CorporationInventors: Pramod Malatkar, Sairam Agraharam, Shawna Liff
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Patent number: 9635764Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.Type: GrantFiled: September 25, 2015Date of Patent: April 25, 2017Assignee: Intel CorporationInventors: Shipeng Qiu, Shawna Liff, Kayleen L Helms, Joshua D Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
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Publication number: 20170094799Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Inventors: Shipeng Qiu, Shawna Liff, Kayleen L. Helms, Joshua D. Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
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Publication number: 20170094774Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Inventors: Adel Elsherbini, Aleksandar Aleksov, Shawna Liff
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Publication number: 20170079135Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.Type: ApplicationFiled: May 28, 2014Publication date: March 16, 2017Inventors: Chuan HU, Adel A. ELSHERBINI, Yoshihiro TOMITA, Shawna LIFF
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Patent number: 9377594Abstract: An optical connector includes a two-dimensional array of lenses to couple optical signals between an optical integrated circuit and an optical fiber. The optical connector has a total-internal-reflection or mirror surface that redirects light between lenses at different surfaces of the optical connector. The lens arrays collimate light directed toward the reflection surface and focuses light received from the reflection surface. The two-dimensional array and prism allows for a low-profile, high-density optical connector based on free space optical light propagation.Type: GrantFiled: December 29, 2011Date of Patent: June 28, 2016Assignee: Intel CorporationInventors: Shawna Liff, Jia-Hung Tseng, Peter Chang
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Publication number: 20150163921Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.Type: ApplicationFiled: December 11, 2013Publication date: June 11, 2015Inventors: Sasha Oster, Robert L. Sankman, Charles Gealer, Omkar Karhade, John S. Guzek, Ravi V. Mahajan, James C. Matayabas, JR., Johanna Swan, Feras Eid, Shawna Liff, Timothy McIntosh, Telesphor Teles Kamgaing, Adel Elsherbini, Kemal Aygun
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Publication number: 20140153881Abstract: An optical connector includes a two-dimensional array of lenses to couple optical signals between an optical integrated circuit and an optical fiber. The optical connector has a total-internal-reflection or mirror surface that redirects light between lenses at different surfaces of the optical connector. The lens arrays collimate light directed toward the reflection surface and focuses light received from the reflection surface. The two-dimensional array and prism allows for a low-profile, high-density optical connector based on free space optical light propagation.Type: ApplicationFiled: December 29, 2011Publication date: June 5, 2014Inventors: Shawna Liff, Jia-Hung Tseng, Peter Chang
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Publication number: 20080009568Abstract: A method of dispersing particles in a medium. The method includes providing a first particle/solvent dispersion comprising the particles and a first solvent, adding a second solvent to the first particle/solvent dispersion to form a second particle/solvent dispersion, wherein the first solvent and the second solvent are miscible, and extracting substantially all of the first solvent from the second particle/solvent dispersion to form a third particle/solvent dispersion.Type: ApplicationFiled: October 18, 2005Publication date: January 10, 2008Inventors: Nitin Kumar, Shawna Liff, Gareth McKinley