Abstract: An imaging device for in vivo medical applications that enables minimally invasive surgical procedures. The imaging device includes an elongated frame having a base, a module housing, and a helical member interposed between the base and module housing. The imaging device further includes an actuation unit positioned within the frame that engages the module housing causing the frame to bend at the helical member. The module housing includes an imaging module and may include other modules including tools used for laparoscopic surgery.

Abstract: A system for performing non-invasive networked medical procedures including a number of in vivo medical devices, a communication path between at least two of the devices, an ex vivo control unit to control the behavior of the devices, and a wireless communication path between the control unit and at least one of the devices. An associated method for performing non-invasive networked medical procedures is also provided.

Abstract: A die assembly for creating a ring electrode including a cylindrically-shaped die base, two die walls and a die top sized to fit inside a cylindrical die housing. The die base and die top having a series of concentric elevations used as impressions to form on two ends of the ring electrode. A method of fabricating an LTCC ring electrode using the die assembly is also provided.

Abstract: A rectenna is a combination of an antenna and a rectifier (diode). Because of limitations in nanotechnology fabrication, it has not been possible to develop rectennas that can operate in the visible frequency range. Current work has gone to producing rectennas that operate in the far infrared (thermal emission) frequency range. To harvest solar energy with rectennas to produce electric power and since rectennas cannot operate at such high frequencies, the present invention provides rectenna configurations to overcome this problem.

Abstract: The present invention provides a method for the controlled synthesis of nanostructures on the edges of electrodes and an apparatus capable of optical and electrochemical sensing. In accordance with the present invention, a method of fabricating nanowires is provided. In one embodiment, the method includes providing a substrate, creating a dielectric thereon, depositing a metal catalyst on the dielectric, patterning the metal catalyst, selectively etching dielectric, creating an electric field originating in metal catalyst, and applying a heat treatment. In another embodiment, the method includes providing a substrate, depositing a dielectric thereon, printing a metal catalyst on the dielectric and plastic substrate, printing silicide along the edges of metal catalyst, creating an electric field originating in metal catalyst; and applying chemical vapor deposition.

Abstract: The present invention provides a novel technique for the fabrication of MEMS igniters and detonators. According to a particular embodiment of the present invention, the device is built based on two-plates. Plate one contains the resistive heating element and plate two contains the explosive cavity. With the present invention, micro igniters and detonators are batch fabricated utilizing a glue-less assembly technique and self-aligning capability.

Abstract: A novel, resistance-based porous silicon sensor with Pd nano structures as the hydrogen sensing layer is presented. The sensor operates at room temperature. The hydrogen sensor of the present includes a p-Type Si substrate that is subjected to porous Si etching to form a nanoporous substrate. The substrate is then coated with a thin layer of Pd and annealed at 900 degrees C. This results in some Pd getting oxidized on porous Si and a thin PdO layer forms on the surface of the substrate. The sensor in accordance with the present invention exhibits an inverse relationship between increased hydrogen concentration versus resistance.

Abstract: The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.

Abstract: A MEMS-based silicon pressure sensor for the ocean environment is presented. The invention is a multiple diaphragm piezoresistive pressure sensor for measuring the pressure of a liquid, comprising an inner deformable diaphragm formed on a silicon substrate, the inner deformable diaphragm having a first thickness an outer deformable diaphragm formed on the silicon substrate, the outer deformable diaphragm having a second thickness which is greater than the first thickness, positioned below the inner deformable diaphragm to support the inner deformable diaphragm, a first piezoresistive bridge embedded in the inner deformable diaphragm, a second piezoresistive bridge embedded in the outer deformable diaphragm and possibly a third piezoresistive bridge embedded in the silicon substrate to compensate for temperature variations.

Abstract: A cylindrical ion trap (CIT) mass spectrometer constructed using a non-conductive substrate (LTCC) as the basis for the ring electrode. Photolithography and electroless plating were used to create well-defined conductive areas on the LTCC ring electrode. The inventive method allows for the precise control of establishing conductive areas on a non-conductive substrate through the steps of punching, lamination, firing, metallization and photolithography on the metallized layer.

Abstract: The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

Abstract: A MEMS-based silicon CTD sensor for ocean environment is presented. The sensor components are a capacitive conductivity sensor, a gold doped silicon temperature sensor, and a multiple diapghram piezoresistive pressure sensor. The sensor elements have further been packaged to protect them from harsh marine environment. The sensor components showed good linear response, resolution and mechanical integrity to the harsh ocean environment.

Abstract: The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

Abstract: The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.

Abstract: A novel, resistance-based porous silicon sensor with Pd nano structures as the hydrogen sensing layer is presented. The sensor operates at room temperature. The hydrogen sensor of the present includes a p-Type Si substrate that is subjected to porous Si etching to form a nanoporous substrate. The substrate is then coated with a thin layer of Pd and annealed at 900 degrees C. This results in some Pd getting oxidized on porous Si and a thin PdO layer forms on the surface of the substrate. The sensor in accordance with the present invention exhibits an inverse relationship between increased hydrogen concentration versus resistance.

Abstract: The present invention includes a novel method to fabricate corner cube retroreflectors, CCRs, where a majority of the wafer area acts as CCRs as compared to a maximum of 33% in previous MEMS CCRs. The present invention also allows for the fabrication of moveable cantilevers which operate at one-third the voltage as compared to a conventional planar cantilever.

Abstract: A MEMS-based silicon CTD sensor for ocean environment is presented. The sensor components are a capacitive conductivity sensor, a gold doped silicon temperature sensor, and a multiple diapghram piezoresistive pressure sensor. The sensor elements have further been packaged to protect them from harsh marine menvironment. The sensor components showed good linear response, resolution and mechanical integrity to the harsh ocean environment.

Abstract: The present invention allows for regeneration of any chemical and biological sensor systems without totally destroying the primary antibodies in the system. The present invention provides regeneration of the sensor by debinding of the antigen/antibody complex utilizing a controlled electrical impulse. The technique is generic and can be used with most immunoassay-based detectors.

Abstract: A carbon nanotube sensor and a method of producing the carbon nanotube sensor are disclosed. The sensor detects small particles and molecules. The sensor includes a gate, a source and a drain positioned on the gate, and a carbon nanotube grown from a catalytic material and extending from one of the source and the drain. The method includes the step of functionalizing an end of the carbon nanotube with a receptor. As such, the carbon nanotube is receptive to the small particles and molecules. The carbon nanotube is driven at a resonance, and the resonance of the carbon nanotube is measured when the end of the carbon nanotube is free of the small particles and the molecules. The method includes monitoring for a change in the resonance to detect the association of the small particles and molecules with the end of the carbon nanotube.

Abstract: The present invention provides a method for the synthesis of nanowires in a silicon nanoporous template by electrodeposition and a novel technique for the integration of nanowires to transduction surfaces. In accordance with the present invention, a method for the fabrication of nanowire interconnects is provided. The method includes the steps of fabricating substantially vertical nanowires in a selectively passivated nanoporous silicon template, backetching the silicon template to expose the nanowires, eutectically bonding the exposed nanowires to a receiving silicon wafer, and etching the silicon template to produce substantially freestanding nanowire interconnects in contact with the receiving silicon wafer.