Patents by Inventor Shekhar Y. Borkar

Shekhar Y. Borkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10021743
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: July 10, 2018
    Assignee: Intel Corporation
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Patent number: 9992135
    Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 5, 2018
    Assignee: Intel Corporation
    Inventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
  • Patent number: 9837391
    Abstract: Described is an apparatus which comprises: a first die including: a processing core; a crossbar switch coupled to the processing core; and a first edge interface coupled to the crossbar switch; and a second die including: a first edge interface positioned at a periphery of the second die and coupled to the first edge interface of the first die, wherein the first edge interface of the first die and the first edge interface of the second die are positioned across each other; a clock synchronization circuit coupled to the second edge interface; and a memory interface coupled to the clock synchronization circuit.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 5, 2017
    Assignee: Intel Corporation
    Inventors: Surhud Khare, Dinesh Somasekhar, Shekhar Y. Borkar
  • Publication number: 20170170153
    Abstract: Described is an apparatus which comprises: a first die including: a processing core; a crossbar switch coupled to the processing core; and a first edge interface coupled to the crossbar switch; and a second die including: a first edge interface positioned at a periphery of the second die and coupled to the first edge interface of the first die, wherein the first edge interface of the first die and the first edge interface of the second die are positioned across each other; a clock synchronization circuit coupled to the second edge interface; and a memory interface coupled to the clock synchronization circuit.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 15, 2017
    Inventors: Surhud Khare, Dinesh Somasekhar, Shekhar Y. Borkar
  • Publication number: 20170171111
    Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 15, 2017
    Inventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
  • Patent number: 9673637
    Abstract: An ultra-capacitor based energy source may replace rechargeable and conventional batteries. It may have the form factor of a conventional battery and may emulate the discharge characteristics of the replaced battery.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: June 6, 2017
    Assignee: Intel Corporation
    Inventor: Shekhar Y. Borkar
  • Publication number: 20170086271
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Application
    Filed: November 30, 2016
    Publication date: March 23, 2017
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Patent number: 9516712
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: December 6, 2016
    Assignee: Intel Corporation
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Publication number: 20160170456
    Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
    Type: Application
    Filed: September 25, 2012
    Publication date: June 16, 2016
    Applicant: INTEL CORPORATION
    Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
  • Publication number: 20140089687
    Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
  • Publication number: 20140055054
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Application
    Filed: October 31, 2013
    Publication date: February 27, 2014
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Patent number: 8573807
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: November 5, 2013
    Assignee: Intel Corporation
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Publication number: 20130282992
    Abstract: A storage unit may have an associated processor and storage controller. The storage controller associated with the storage unit may store a mapping of objects (i.e., data) to blocks in the storage unit. This mapping may be received from another source, such as a file system, database, or software application, among other possibilities. The processor associated with the storage unit may execute operation s on the objects stored in the storage unit.
    Type: Application
    Filed: December 22, 2011
    Publication date: October 24, 2013
    Applicant: Intel Corporation
    Inventors: Michael P. Mesnier, Shekhar Y. Borkar, Mesut A. Ergin
  • Publication number: 20130271092
    Abstract: An ultra-capacitor may replace a rechargeable battery in consumer applications where the appliance usage is not prolonged. That is, if the usage is intermittent, the ultra-capacitor can quickly recharge between consecutive uses. Especially for those applications where an appliance spends most of the time on a charging cradle ultra-capacitor may efficiently replace batteries in appliances.
    Type: Application
    Filed: December 30, 2011
    Publication date: October 17, 2013
    Inventor: Shekhar Y. Borkar
  • Publication number: 20130271091
    Abstract: An ultra-capacitor based energy source may replace rechargeable and conventional batteries. It may have the form factor of a conventional battery and may emulate the discharge characteristics of the replaced battery.
    Type: Application
    Filed: December 28, 2011
    Publication date: October 17, 2013
    Inventor: Shekhar Y. Borkar
  • Patent number: 8288846
    Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: October 16, 2012
    Assignee: Intel Corporation
    Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
  • Publication number: 20120221884
    Abstract: Generally, this disclosure provides error management across hardware and software layers to enable hardware and software to deliver reliable operation in the face of errors and hardware variation due to aging, manufacturing tolerances, etc. In one embodiment, an error management module is provided that gathers information from the hardware and software layers, and detects and diagnoses errors. A hardware or software recovery technique may be selected to provide efficient operation, and, in some embodiments, the hardware device may be reconfigured to prevent future errors and to permit the hardware device to operate despite a permanent error.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 30, 2012
    Inventors: Nicholas P. Carter, Donald S. Gardner, Eric C. Hannah, Helia Naeimi, Shekhar Y. Borkar, Matthew Haycock
  • Publication number: 20100328946
    Abstract: In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Inventors: Shekhar Y. Borkar, Stephen G. Eichenlaub
  • Publication number: 20100219516
    Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
    Type: Application
    Filed: February 24, 2010
    Publication date: September 2, 2010
    Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
  • Publication number: 20100115301
    Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
    Type: Application
    Filed: January 8, 2010
    Publication date: May 6, 2010
    Inventors: Siva G. Narendra, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar