Abstract: This invention provides a system-oriented and fully-controlled connected automated vehicle highway system for various levels of connected and automated vehicles and highways. The system comprises one or more of: 1) a hierarchical traffic control network of Traffic Control Centers (TCC's), local traffic controller units (TCUs), 2) A RSU (Road Side Unit) network (with integrated functionalities of vehicle sensors, I2V communication to deliver control instructions), 3) OBU (On-Board Unit with sensor and V2I communication units) network embedded in connected and automated vehicles, and 4) wireless communication and security system with local and global connectivity. This system provides a safer, more reliable and more cost-effective solution by redistributing vehicle driving tasks to the hierarchical traffic control network and RSU network.

Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.

Abstract: An image processing method includes acquiring a set of image samples for training an attribute recognition model, wherein the set of image samples includes a first subset of image samples with category labels and a second subset of image samples without category labels; training a sample prediction model using the first subset of image samples, and predicting categories of the image samples in the second subset of image samples using the trained sample prediction model; determining a category distribution of the set of image samples based on the category labels of the first subset of image samples and the predicted categories of the second subset of image samples; and acquiring a new image sample if the determined category distribution does not conform to the expected category distribution, and adding the acquired new image sample to the set of image samples.

Abstract: An RRAM structure includes a dielectric layer. A bottom electrode, a resistive switching layer and a top electrode are disposed from bottom to top on the dielectric layer. A spacer is disposed at sidewalls of the bottom electrode, the resistive switching layer and the top electrode. The spacer includes an L-shaped spacer and a sail-shaped spacer. The L-shaped spacer contacts the sidewall of the bottom electrode, the sidewall of the resistive switching layer and the sidewall of the top electrode. The sail-shaped spacer is disposed on the L-shaped spacer. A metal line is disposed on the top electrode and contacts the top electrode and the spacer.

Abstract: The present disclosure provides a control method applied to a first electronic device and a second electronic device in a physical environment. The first electronic device and the second electronic device are configured to communicate with each other through a first wireless connection established between the first electronic device and the second electronic device. The control method includes: by at least one of the first electronic device and the second electronic device, determining whether to update a map of the physical environment; and in response to a determination to update the map of the physical environment, establishing a second wireless connection different from the first wireless connection between the first electronic device and the second electronic device, wherein the second wireless connection is configured to transmit a map updated data, and the map updated data is configured to update the map of the physical environment.

Abstract: A memory device includes a field effect transistor and a variable-capacitance capacitor. A gate structure includes a gate dielectric and an intermediate electrode. The variable-capacitance capacitor includes a lower capacitor plate comprising the intermediate electrode, an upper capacitor plate comprising a control gate electrode, and a variable-capacitance node dielectric and including an electrical-field-programmable metal oxide material. The electrical-field-programmable metal oxide material provides a variable effective dielectric constant, and a data bit may be stored as a dielectric state of the variable-capacitance node dielectric in the memory device. The variable-capacitance node dielectric provides reversible electrical field-dependent resistivity modulation, or reversible electrical field-dependent movement of metal atoms therein.

Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.

Abstract: This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.

Abstract: Apparatus and methods are provided for RRM measurement in the NR network. In one novel aspect, the RRM measurement is configured with one measurement gap for SS block and CSI-RS. In one embodiment, an extended MGL (eMGL) is configured such that the SS block and CSI-RS is measurement within one measurement gap. In another embodiment, the shorter MGL (sMGL) that is shorter than the standard MGL is configured. In another novel aspect, the CSI-RS is allocated adjacent to the SS blocks such that one measurement gap is configured for both the SS block and CSI-RS measurement. In another novel aspect, the CSI-RS measurement is conditionally configured. In yet another novel aspect, the UE decodes the time index of the SS block conditionally.

Abstract: A method for communicating with at least one field device via an interface device, wherein each field device is connected to a channel of the interface device, where the method includes receiving a first command associated with a first field device, from an industrial device, communicating with the first field device over a first communication channel for executing the received first command, receiving at least one command associated with the at least one field device, from the industrial device, the at least one commands including at least one command associated with a second field device from the at least one field device, and caching the at least one command in a memory module prior to the execution of the first command.

Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.

Abstract: A system for a semiconductor fabrication facility (FAB) includes an orientation tool and a transporting tool configured to transport at least one customized part. The orientation tool includes a port configured to receive the workpiece, a sensor configured to detect an orientation of the workpiece received in the port and a rotation mechanism configured to turn the workpiece received in the port.

Abstract: A voltage balance circuit includes a battery module connected to an external power source, a voltage dividing module, a detection module and a control module. The battery module includes a plurality of batteries connected in series. The voltage dividing module includes a plurality of bleeder resistors. Each bleeder resistor is connected with one battery in parallel. The detection module includes a plurality of thermistors, fixation resistances and micro-controllers. Each thermistor is arranged beside one bleeder resistor. Each thermistor is connected with one fixation resistance in series. Each micro-controller is connected with one thermistor and the one fixation resistance. The control module includes a plurality of switches and an analog front end component. Each switch is connected with the one bleeder resistor in series. Each switch is connected to the analog front end component, and the analog front end component is connected to the one micro-controller.

Abstract: A package assembly includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and attached to the package substrate. The package lid includes an outer lid including an outer lid material and including an outer lid plate portion. The package lid further includes an inner lid including an inner lid material different than the outer lid material and including an inner lid plate portion attached to a bottom surface of the outer lid plate portion.

Abstract: In an example in accordance with the present disclosure, a compute device is described. The compute device includes a host controller to 1) receive identification data of peripheral devices coupled to a computing dock and 2) compare the identification data with values stored in a database. A stored value indicates a combination of peripheral devices previously coupled to the computing dock. The compute device also includes a device connection controller to, responsive to the identification data matching a stored value, retrieve operational data for the peripheral devices from the database. The device connection controller is also to connect the compute device with the peripheral devices based on operational data retrieved from the database.

Abstract: An extruding system includes a melting unit configured to convey a polymeric material, a mixing unit configured to mix the polymeric material with a blowing agent to form a mixture, an injection unit configured to inject the mixture, a first flow control element disposed between the melting unit and the mixing unit, and a second flow control element disposed between the mixing unit and the injection unit. A method of extruding includes conveying a polymeric material from a melting unit to a mixing unit, conveying a blowing agent into the mixing unit, mixing the polymeric material with the blowing agent to form a mixture, conveying the mixture from the mixing unit to an injection unit, and discharging the mixture from the injection unit, wherein flow of the polymeric material is controlled by a first flow control element, and flow of the mixture is controlled by a second flow control element.

Abstract: An islanding detection system and method for multiple inverters operating in parallel, wherein the multiple inverters at least comprises a first inverter and a second inverter connected in parallel. The islanding detection system comprises a current detection circuit arranged on a grid side or an AC side of the second inverter; and a controller connected to the current detection circuit and the first inverter. The controller determines whether to perform distributed islanding detection or centralized islanding detection on the first inverter and the second inverter according to a grid voltage signal and a current detection signal of the current detection circuit. By recognizing the islanding detection mode of the second inverter, matching it with typical islanding detection modes preset in a library, and determining to perform a distributed or centralized islanding detection according to matching results, the application improves the success ratio of islanding detection.