Abstract: A contamination-resistant thin film deposition method utilizing a reaction-type vacuum sputtering process in which an organic tetrafluoroethylene plastic and conductor substances are sputtered onto a substrate to deposit a thin film onto the substrate, with the thin film deriving its contamination-resistant capability from the anti-stick properties of the tetrafluoroethylene plastic and the anti-static properties of the conductor substances. The contamination-resistant thin film deposition method utilizes a configured tetrafluoroethylene plastic target structure that includes a negative substrate, a filiform electrode, an insulative support, a tetrafluoroethylene plastic sputtering substrate, a positive substrate, a tetrafluoroethylene plastic substrate rotating device, a magnetic field generator, and a gas input port.

Abstract: A material vacuum stirring and dispersing device includes a closed container for stirring solid and liquid under vacuum condition, making it possible to stir materials evenly, without forming material balls to enhance the quality of the mixture. The device further includes a material feeder positioned on the closed container for feeding solid or powder materials evenly into the closed container in which is placed the liquid, and a stirring member having a straight shaft extending out and in the closed container with a plurality of stirring leaves fixed on a lower end of the straight shaft in the container. The straight shaft is rotated by a rotating device placed outside of the closed container and is movable up and down as well so as to make the stirring leaves rotate and also move and down to stir completely the solid with the liquid in the closed container.

Abstract: A miniature recycle-type heat exchanger to produce recycle-type heat exchangers from high extensibility, high plasticity aluminum or copper billets (ingots) utilizing a pressure forming press to extrude lightweight, thin, and small form factor recycle-type heat exchangers. The production method includes annealing copper and aluminum billet (ingot) material, conveying the material to a vibrator for placement in an ordered arrangement, and then conveying and fixing the material onto molds in a pressure forming press for the extrusion tasks required to fabricate the heat exchanger bodies. In the final stage after shaping and determination of the fluid input direction, the bodies are placed in a vacuum sputtering machine to undergo a rough textured heat conductive microparticulate deposition process to complete the production of miniature recycle-type heat exchangers that are of very compact dimensions and lightweight, but have a large heat exchange capacity and, furthermore, a high heat transfer rate.