Patents by Inventor Shen Chen

Shen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151428
    Abstract: An air purifier includes a body and a control module. The body is provided with a case, a case door arranged on the case and a door lock; the case is provided with at least one filter, at least one ultraviolet lamp and at least one controller capable of being operated; the door lock includes a magnetic reed switch and a lock matched with the magnetic reed switch; the lock is provided with a lock tongue and a magnet forming a magnetic attraction relationship with the magnetic reed switch; and the lock is provided with a first state, in which the magnet is released from the magnetic attraction relationship when the lock tongue is rotated to a specific angle, and a second state when the magnetic attraction relationship of the magnet is not destroyed.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 9, 2024
    Inventor: Shen-Chen LIU
  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11978280
    Abstract: A method is provided for evaluating an effect of classifying a fuzzy attribute of an object, the fuzzy attribute referring to an attribute, a boundary between two similar ones of a plurality of categories of which is blurred, wherein the method includes: generating a similarity-based ranked confusion matrix, which comprises: based on similarities of K categories of the fuzzy attribute of the object, ranking the K categories, where K is an integer greater than or equal to 2, generating a K×K all-zero initialization matrix, wherein an abscissa and an ordinate of the initialization matrix respectively represent predicted values and true values of the similarity-based ranked categories of the fuzzy attribute, and based on the true values and the predicted values of the category of the fuzzy attribute for the multiple object samples, updating values of corresponding elements in the initialization matrix; and displaying the similarity-based ranked confusion matrix.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: May 7, 2024
    Assignee: Lemon Inc.
    Inventors: Jingna Sun, Peibin Chen, Weihong Zeng, Xu Wang, Jing Liu, Chunpong Lai, Shen Sang
  • Publication number: 20240147286
    Abstract: Apparatus and methods are provided for UE-assisted tethering report. In one novel aspect, UE-assisted tethering report is generated with UE-assisted procedure based on latency measurement configuration. In one embodiment, the UE-assisted tethering report includes one or more elements comprising one bit to inform the activation of tethering mode, latency of packet transmission, and other side-information related to tethering path. In one embodiment, the UE-assisted procedure is inserting a measurement timestamp or recording timing of a predefined transport block (TB) of the packet. In another novel aspect, the UE performs a jitter measurement for an extended reality (XR) traffic, sends a UE-assisted information report for an end-to-end path of the XR traffic based on the jitter measurements, wherein the UE-assisted information includes one or more elements comprising jitter information and burst arrival time.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 2, 2024
    Inventors: JING-WEI CHEN, Tao Chen, Yih-Shen Chen, Ming-Yuan Cheng
  • Patent number: 11972956
    Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen
  • Patent number: 11964674
    Abstract: The present technology relates to an intelligent road infrastructure system and, more particularly, to systems and methods for a heterogeneous connected automated vehicle highway (CAVH) network in which the road network has various RSU and TCU/TCC coverages and functionalities. The heterogeneous CAVH network facilitates control and operations for vehicles of various automation level and other road users by implementing various levels of coordinated control among CAVH system entities and providing individual road users with detailed customized information and time-sensitive control instructions, and operations and maintenance services.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: April 23, 2024
    Assignee: CAVH LLC
    Inventors: Bin Ran, Yang Cheng, Tianyi Chen, Yang Zhou, Zhen Zhang, Xiaotian Li, Shen Li, Shuoxuan Dong, Kunsong Shi
  • Patent number: 11961545
    Abstract: Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh, Cheng-Yuan Tsai
  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Patent number: 11950771
    Abstract: The present invention provides a supporting hook structure, comprising a sleeve, a fixing rod, a first limit unit, a hook and a fixing device. The fixing rod is connected to the side surface of the sleeve. The hook body is connected to one end of the sleeve. The first limit unit is arranged on the side surface of the sleeve and adjacent to the hook body. The first limit unit makes the hook body rotates with the axis direction of the sleeve as a rotation axis. The fixing device is connected to the other end of the sleeve to fix the rotating position of the hook body. Through the above, the hook part enters the proximal thigh from a surgical entrance and the hook part rotates to make the hook part abut against the proximal femur to complete the positioning and fixation of the femur hook structure to the femur.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 9, 2024
    Assignee: UNITED ORTHOPEDIC CORPORATION
    Inventors: Yan-Shen Lin, Jiann-Jong Liau, Yu-Liang Liu, Teh-Yang Lin, Wen-Chuan Chen
  • Patent number: 11955002
    Abstract: This invention provides a system-oriented and fully-controlled connected automated vehicle highway system for various levels of connected and automated vehicles and highways. The system comprises one or more of: 1) a hierarchical traffic control network of Traffic Control Centers (TCC's), local traffic controller units (TCUs), 2) A RSU (Road Side Unit) network (with integrated functionalities of vehicle sensors, I2V communication to deliver control instructions), 3) OBU (On-Board Unit with sensor and V2I communication units) network embedded in connected and automated vehicles, and 4) wireless communication and security system with local and global connectivity. This system provides a safer, more reliable and more cost-effective solution by redistributing vehicle driving tasks to the hierarchical traffic control network and RSU network.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 9, 2024
    Assignee: CAVH LLC
    Inventors: Bin Ran, Yang Cheng, Tianyi Chen, Shen Li, Jing Jin, Xiaoxuan Chen, Fan Ding, Zhen Zhang
  • Patent number: 11955455
    Abstract: A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20240105661
    Abstract: The present disclosure provides a circuit board with an embedded chip, which includes a dielectric layer, a first circuit layer, a chip, a conductive connector, and an insulating protection layer. The first circuit layer includes at least one first trace in the dielectric layer. The chip is in the dielectric layer and adjacent to the first trace, where the chip includes a plurality of chip pads at an upper surface of the chip. The conductive connector is on the upper surface of the chip and on the first circuit layer, where a lower surface of the conductive connector contacts at least one chip pad of the chip pads and an upper surface of the first trace. The insulating protection layer is on the chip, the first circuit layer, and the conductive connector, where the insulating protection layer contacts the upper surface of the chip.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Shen CHEN, I-Ta TSAI
  • Patent number: 11939603
    Abstract: A modified cutinase is disclosed. The cutinase has the modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of asparagine at position 181 with alanine, or substitutions of asparagine at position 181 with alanine and phenylalanine at position 235 with leucine. The modified enzyme has improved PET-hydrolytic activity, and thus, the high-activity PET hydrolase is obtained, and the industrial application value of the PET hydrolase is enhanced.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: March 26, 2024
    Assignee: HUBEI UNIVERSITY
    Inventors: Chun-Chi Chen, Jian-Wen Huang, Jian Min, Xian Li, Beilei Shi, Panpan Shen, Yu Yang, Yumei Hu, Longhai Dai, Lilan Zhang, Yunyun Yang, Rey-Ting Guo
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11935402
    Abstract: This invention provides a system-oriented and fully-controlled connected automated vehicle highway system for various levels of connected and automated vehicles and highways. The system comprises one or more of: 1) a hierarchical traffic control network of Traffic Control Centers (TCC's), local traffic controller units (TCUs), 2) A RSU (Road Side Unit) network (with integrated functionalities of vehicle sensors, I2V communication to deliver control instructions), 3) OBU (On-Board Unit with sensor and V2I communication units) network embedded in connected and automated vehicles, and 4) wireless communication and security system with local and global connectivity. This system provides a safer, more reliable and more cost-effective solution by redistributing vehicle driving tasks to the hierarchical traffic control network and RSU network.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: March 19, 2024
    Assignee: CAVH LLC
    Inventors: Bin Ran, Yang Cheng, Tianyi Chen, Shen Li, Jing Jin, Xiaoxuan Chen, Fan Ding, Zhen Zhang
  • Publication number: 20240087917
    Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Ji CHEN, Chih-Shen YANG, Cheng-Yi HUANG
  • Patent number: D1018537
    Type: Grant
    Filed: November 7, 2023
    Date of Patent: March 19, 2024
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen
  • Patent number: D1026897
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: May 14, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ming-Chen Chen, Tong-Shen Hsiung, Chia-Hao Hung
  • Patent number: D1026910
    Type: Grant
    Filed: November 7, 2023
    Date of Patent: May 14, 2024
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen