Abstract: An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

Abstract: A microphone apparatus is provided. Whether an electronic signal converted from an audio signal is in compliance with a preset sound characteristic and a preset voice recognition information is determined. When the electronic signal is in compliance with the preset sound characteristic and the preset voice recognition information, an actuation control signal is outputted, so as to trigger an operation of an external circuit external to the microphone apparatus.

Abstract: A microphone apparatus is provided. Whether an electronic signal converted from an audio signal is in compliance with a preset sound characteristic and a preset voice recognition information is determined. When the electronic signal is in compliance with the preset sound characteristic and the preset voice recognition information, an actuation control signal is outputted, so as to trigger an operation of an external circuit external to the microphone apparatus.