Patents by Inventor Shen-Yau Huang

Shen-Yau Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging method for wafers
    Publication number: 20040098949
    Abstract: A new and improved method for packaging substrates for shipping or transport. The method of the invention comprises a primary packaging structure in which the substrates are placed in a suitable substrate container; a secondary packaging structure in which the substrate container of the primary packaging structure is vacuum-sealed in an anti-static bag; a tertiary packaging structure in which the secondary packaging structure is fitted with a resilient cushion; and a quaternary or final packaging structure in which the tertiary packaging structure is sealed in a shipping carton.
    Type: Application
    Filed: November 21, 2002
    Publication date: May 27, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Shen-Yau Huang, Ming-Chen Tai, Ming-Tsong Wang, Tai-Yau Shen