Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

Abstract: A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

Abstract: A semiconductor structure including a first semiconductor die, a second semiconductor die, a passivation layer, an anti-arcing pattern, and conductive terminals is provided. The second semiconductor die is stacked over the first semiconductor die. The passivation layer covers the second semiconductor die and includes first openings for revealing pads of the second semiconductor die. The anti-arcing pattern is disposed over the passivation layer. The conductive terminals are disposed over and electrically connected to the pads of the second semiconductor die.

Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

Abstract: An operating method of a wafer cassette handling apparatus includes at least the following steps. A stage that carries a wafer cassette is moved into a main body of a wafer cassette handling apparatus to open a cassette door of the wafer cassette. The stage that carries the wafer cassette is moved out of the main body after the cassette door is opened. A wafer is extracted from the wafer cassette and transferred to a processing system. Another operating method and a wafer cassette handling apparatus are also provided.

Abstract: A controller device may connect to one or more expansion modules for capability expansion. The controller device may be configured to automatically detect and identify connected expansions modules. The controller device may be configured to further automatically detect an order in which the expansion modules are connected. A graphical user interface may be provided including a visualization of the system configuration including the order of the expansion modules.

Abstract: Machine vision devices may be configured to automatically connect to a remote management server (e.g., a “cloud”-based management server), and may offload and/or communicate images and analyses to the remote management server via wired or wireless communications. The machine vision devices may further communicate with the management server, user computing devices, and/or human machine interface devices, e.g., to provide remote access to the machine vision device, provide real-time information from the machine vision device, receive configurations/updates, provide interactive graphical user interfaces, and/or the like.

Abstract: A hinge mechanism includes a base gudgeon and a pivot pintle. The base gudgeon has a main body and first and second tubular portions formed on the main body and respectively having coaxial first and second pivot holes. The second tubular portion has a first torque regulating formation formed on an inner surrounding wall thereof. The pivot pintle has a first pintle section rotatably inserted into and pressed-fit to the first pivot hole to produce primary frictional torque during pivoting of the pivot pintle, a second pintle section rotatably inserted into and pressed-fit to the second pivot hole to produce secondary frictional torque, and a second torque regulating formation configured to be matingly engaged with the first torque regulating formation in a part of angular positions of the pivot pintle so as to reduce the secondary frictional torque.

Abstract: An input connection device for an electronic device is provided. The electronic device includes a mother circuit board and a cabinet having a first wall. The input connection device comprises an insulation housing, a conductive connection unit, a circuit board, a switch, a first power wire and a second power wire. The insulation housing is disposed on the first wall and comprises a main body comprising a hollow channel. The conductive connection unit is disposed in the hollow channel and is engaged with the insulation housing. The circuit board is connected with the conductive connection unit directly. The switch has an input part and an output part. The first power wire is connected with the circuit board and the input part of the switch. The second power wire is connected with the output part of the switch and the mother circuit board.

Abstract: A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

Abstract: A tracking device is described. The tracking device receives, from a management server, pressure measurement thresholds. The tracking device monitors pressure measurements of the asset. Based on the pressure measurements, the tracking device enters an active mode of operation. When operating in the active mode of operation, the tracking device transmits sensor measurements of the asset to the management server. The tracking device determines new pressure measurements of the asset. Based on the new pressure measurements, the tracking device enters a passive mode of operation. When operating in the passive mode of operation, no data is transmitted or received from/to the tracking device to/from the management server.

Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Abstract: A tracking device is described. The tracking device receives, from a management server, configuration parameters including a first data transmission rate and a second data transmission rate. The tracking device automatically enters into an active mode of the tracking device. When operating in an active mode, the tracking device, is operative to transmit, in response to determining based on first motion sensor measurements that the asset is stationary, first location data at the first data transmission rate. In response to determining, based on second motion sensor measurements and motion definition parameters, that the asset is mobile, the tracking device is operative to transmit, second location data of the asset at the second data transmission rate.

Abstract: A system for sending a cassette pod is provided. The system includes a processing machine having a load port for receiving the cassette pod. The system further includes a manipulating apparatus positioned above the processing machine. The manipulating apparatus includes an intermediate module having a stage and a driving mechanism connected to the stage to change the position of the stage. The manipulating apparatus further includes a conveyor module having a gripper assembly for grasping the cassette pod.

Abstract: A method for manufacturing an integral shoe blank is provided. In the method, a reinforcement piece is woven by a flat knitting machine during a weave process, and the reinforcement piece is made unperceivable through a subsequent side overturning step when viewing from an exterior of a shoe. Thus, with the reinforcement piece, structural strength of the shoe blank is reinforced while better comfort is provided to the foot by a shoe manufactured from the shoe blank.

Abstract: A semiconductor structure including a first semiconductor die, a second semiconductor die, a passivation layer, an anti-arcing pattern, and conductive terminals is provided. The second semiconductor die is stacked over the first semiconductor die. The passivation layer covers the second semiconductor die and includes first openings for revealing pads of the second semiconductor die. The anti-arcing pattern is disposed over the passivation layer. The conductive terminals are disposed over and electrically connected to the pads of the second semiconductor die.