Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

Abstract: A tracking device is described. The tracking device receives, from a management server, configuration parameters including a first data transmission rate and a second data transmission rate. The tracking device automatically enters into an active mode of the tracking device. When operating in an active mode, the tracking device, is operative to transmit, in response to determining based on first motion sensor measurements that the asset is stationary, first location data at the first data transmission rate. In response to determining, based on second motion sensor measurements and motion definition parameters, that the asset is mobile, the tracking device is operative to transmit, second location data of the asset at the second data transmission rate.

Abstract: A method for manufacturing an integral shoe embryo is provided. In the method, a reinforcement piece is woven by a flat knitting machine during a weave process, and the reinforcement piece is made unperceivable through a subsequent side overturning step when viewing from an exterior of a shoe. Thus, with the reinforcement piece, structural strength of the shoe embryo is reinforced while better comfort is provided to the foot by a shoe manufactured from the shoe embryo.

Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.

Abstract: A shoe embryo tailored from a tubular fabric is provided. The shoe embryo includes a sole portion, a toe cap portion located at one end of the sole portion, a heel portion located at the other end of the sole portion, and an ankle portion located above the sole portion and near the heel portion. The ankle portion includes an ankle opening overlock line formed by trimming the tubular fabric and overlocking. The heel portion includes a heel overlock line formed by trimming the tubular fabric and overlocking, and a sole overlock line formed by folding below the heel overlock line and overlocking. The toe cap portion includes a toe cap overlock line formed by trimming the tubular fabric and overlocking.

Abstract: An input connection device for an electronic device is provided. The electronic device includes a mother circuit board and a cabinet having a first wall. The input connection device comprises an insulation housing, a conductive connection unit, a circuit board, a switch, a first power wire and a second power wire. The insulation housing is disposed on the first wall and comprises a main body comprising a hollow channel. The conductive connection unit is disposed in the hollow channel and is engaged with the insulation housing. The circuit board is connected with the conductive connection unit directly. The switch has an input part and an output part. The first power wire is connected with the circuit board and the input part of the switch. The second power wire is connected with the output part of the switch and the mother circuit board.

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

Abstract: A tracking device is described. The tracking device receives, from a management server, configuration parameters including a first data transmission rate and a second data transmission rate. The tracking device automatically enters into an active mode of the tracking device. When operating in an active mode, the tracking device, is operative to transmit, in response to determining based on first motion sensor measurements that the asset is stationary, first location data at the first data transmission rate. In response to determining, based on second motion sensor measurements and motion definition parameters, that the asset is mobile, the tracking device is operative to transmit, second location data of the asset at the second data transmission rate.

Abstract: A motion detection device is provided. The motion detection device includes a first image recording unit, a first storage unit, a motion detection unit, a depth calculation unit, and a determination unit. The first image recording unit is configured to record a first video. The first storage unit is configured to store the first video. The motion detection unit is configured to detect a moving object in the first video. The depth calculation unit is configured to calculate a depth of the moving object. The determination unit is configured to determine whether or not the moving object is a concerned event according to the depth of the moving object.

Abstract: A system for sending a cassette pod is provided. The system includes a processing machine having a load port for receiving the cassette pod. The system further includes a manipulating apparatus positioned above the processing machine. The manipulating apparatus includes an intermediate module having a stage and a driving mechanism connected to the stage to change the position of the stage. The manipulating apparatus further includes a conveyor module having a gripper assembly for grasping the cassette pod.

Abstract: A double-sided fabric stacked with a continuous cord material and forming a thickness in a knitted sack is knitted from a face yarn by a flat knitting machine including a front needle bed, a back needle bed and a loop presser bed. The front needle bed includes a plurality of front knitting needles. The back needle bed includes a plurality of back knitting needles. The loop presser bed is disposed above the front or back needle bed, and includes right-directed and left-directed knitting pressing pieces. The double-sided fabric further includes at least one knitted sack including loops knitted from the face yarn by the front and back knitting needles. The knitted sack includes therein at least one continuous cord material, which is pressed into the knitted sack by the right-directed and left-directed knitting pressing pieces to become folded and stacked to form a thickness.

Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

Abstract: A model-based machine learning system for calculating optimum molding conditions includes a data storage device providing a set of training data; an injection molding process emulator producing a set of emulated sensing data according to molding conditions as inputted; an injection molding process state observation unit, determining an injection molding process state from molding conditions, sensing data and a quality state, wherein the quality state at least includes an acceptance state; and an injection molding process optimization unit including an injection molding condition optimizer, wherein a molding condition optimization model constructed in the injection molding condition optimizer is trained according to the injection molding process state as determined, and the molding condition optimization model after training is introduced into an injection molding production line.

Abstract: A system for sending a cassette pod is provided. The system includes a processing machine having a load port for receiving the cassette pod. The system further includes a manipulating apparatus positioned above the processing machine. The manipulating apparatus includes an intermediate module having a stage and a driving mechanism connected to the stage to change the position of the stage. The manipulating apparatus further includes a conveyor module having a gripper assembly for grasping the cassette pod.

Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.