Patents by Inventor Sheng An Tsai

Sheng An Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135184
    Abstract: Aspects of the disclosure provide an evolutionary neural architecture search (ENAS) method. For example, the ENAS method can include steps (a) performing one or more evolutionary operations on an initial population of neural architectures to generate offspring neural architectures, (b) evaluating performance of each of the offspring neural architectures to obtain at least one evaluation value of the offspring neural architecture with respect to a performance metric, (c) adjusting the evaluation values of the offspring neural architectures based on at least one constraint on the evaluation values, (d) selecting at least one of the offspring neural architectures as a new population of neural architectures, and (e) outputting the new population of neural architectures as a last population of neural architectures when a stopping criterion is achieved, or (f) iterating steps (a) to (d) with the new population of neural architectures being taken as the initial population of neural architectures.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yun-Chan TSAI, Min-Fong HORNG, Chia-Hsiang LIU, Cheng-Sheng CHAN, ShengJe HUNG
  • Publication number: 20240130762
    Abstract: An artificial bone plate unit and an assembleable artificial bone plate are provided. The artificial bone plate unit includes a plate body, multiple connecting pins, connecting holes, drug cavities, and drug-releasing openings. The plate body has two main surfaces and a peripheral surface connected between the two main surfaces. The connecting pins and the connecting holes are formed on the plate body and arranged along the peripheral surface on the plate body. The connecting holes correspond in shape to the connecting pins. The drug cavities are formed in the artificial bone plate unit and are connected to the drug-releasing openings. The artificial bone plate units are connected using the connecting pins and the connecting holes to form the assembleable artificial bone plate. The assembleable artificial bone plate can be bent into the shape of a defect area of the skull, which saves material and time.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Tung-Kuo TSAI, Keng-Liang OU, Yung-Kang SHEN, Yin-Chung HUANG, Kuo-Sheng HUNG, Yu-Sin OU
  • Publication number: 20240138030
    Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: Hou-Sheng HUANG, Chien-Lung SHEN, Shu-Chu TSAI, Hung-Yu LIN
  • Publication number: 20240129716
    Abstract: Examples pertaining to beam capability reporting in a relay-type wireless device are described. An apparatus may serve as a relay between a user equipment (UE) and a wireless node of a wireless network. An apparatus may also report its beam capability information for a wireless link between the apparatus and the UE to the wireless node. The beam capability information may indicate one or more non-overlapped or partially-overlapped beams.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 18, 2024
    Inventors: Lung-Sheng Tsai, Chun-Hao Fang
  • Publication number: 20240129291
    Abstract: The invention discloses a method to set up a cross-domain DDS-secure network and then use it to transmit various kinds of data. To set up the cross-domain DDS-secure network, we first register IoT and monitor devices on the administration website. Second, we group devices based on our needs and then ask the website to generate configurations and certificates for each device. Finally, we download those files and deploy them to each device. In an extremely case, we can accomplish all operations only through a mobile device. During the system operating, all devices establish the DDS-secure connections to each other, and data will transmit on the network securely.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: Tsung-Che Tsai, Wei-Sheng Chen, Hsi-Ching Lin
  • Publication number: 20240129167
    Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chung-Hsien Tsai, Che-Yu Chiang, Yu-Ting Liu, Tsung-Lin Lee, Chia-Sheng Peng, Ting-Ming Yang
  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Publication number: 20240121814
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE determines a priority order among a first set of time-frequency resources for a first uplink channel to a base station and one or more second sets of time-frequency resources for one or more second uplink channels to one or more repeaters. The UE allocates transmission power across the first set of time-frequency resources and the one or more second sets of time-frequency resources based on the determined priority order and a maximum transmission power limit. The UE transmits signals to the base station and the one or more repeaters based on the transmission power allocation.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 11, 2024
    Inventors: Kuan-Yuan Chen, Lung-Sheng Tsai
  • Publication number: 20240119283
    Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jui-Yang Hsu, Cheng-Sheng Chan, Jen-Chieh Tsai, Huai-Ting Li, Bo-Yu Kuo, Yen-Hao Chen, Kai-Ling Huang, Ping-Yuan Tseng, Tao Tu, Sheng-Je Hung
  • Patent number: 11955379
    Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
  • Patent number: 11955423
    Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
  • Publication number: 20240114533
    Abstract: A method for sidelink communication is provided. The method is applied to a first UE in a sidelink communication to transmit signals to a second UE which is a peer receiving (peer-Rx) UE of the first UE. The method includes the following steps: maintaining a counter to record how many periodic reservations remain to be used for sidelink signal transmission, wherein the periodic reservations are associated with a reservation period and each periodic reservation is associated with at least one sidelink resource; determining whether a resource re-selection condition is met before the counter counts to 0, wherein the resource re-selection condition is associated with status of receiving responses corresponding to a subset of the sidelink resources; and reselectting at least one new sidelink resource for next periodic reservations when the resource re-selection condition is met.
    Type: Application
    Filed: January 14, 2022
    Publication date: April 4, 2024
    Inventors: Lung-Sheng TSAI, Tao CHEN
  • Publication number: 20240107546
    Abstract: A wireless device receives a first PDCCH from a base station. The first PDCCH indicates a resource allocation of a first PDSCH transmitted on a first time-frequency resource. The wireless device decodes data carried in the first PDSCH according to the first PDCCH. The wireless device obtains a resource allocation of a second PDSCH based on a mapping rule. The mapping rule maps resources of the first PDSCH to resources of the second PDSCH. The wireless device generates encoded bits for the second PDSCH. The encoded bits are based on the decoded data carried in the first PDSCH and the resource allocation of the second PDSCH. The wireless device generates reference signals associated with the second PDSCH. The wireless device transmits the encoded bits to a user equipment (UE). The encoded bits are transmitted on the resources of the second PDSCH on the second time-frequency resource.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 28, 2024
    Inventor: Lung-Sheng Tsai
  • Publication number: 20240103342
    Abstract: A variable aperture module includes a blade assembly, a positioning element, a driving part and pressing structures. The blade assembly includes movable blades disposed around an optical axis to form a light passable hole with an adjustable size. Each movable blade has a positioning hole and a movement hole adjacent thereto. The positioning element includes positioning structures disposed respectively corresponding to the positioning holes. The driving part includes a rotation element disposed corresponding to the movement holes and is rotatable with respect to the positioning element. The pressing structures are disposed respectively corresponding to the movable blades. Each pressing structure is at least disposed into at least one of the positioning hole and the movement hole of the corresponding movable blade. Each pressing structure at least presses against at least one of the corresponding one positioning structure and the rotation element.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 28, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Chia-Cheng TSAI, Hsiu-Yi HSIAO, Ming-Ta CHOU, Te-Sheng TSENG
  • Patent number: 11939431
    Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Patent number: 11942795
    Abstract: A multi-antenna system for harvesting energy and transmitting data includes an energy storing unit, antenna transmission units, and a load unit. Each antenna transmission unit includes an antenna module, a splitting module, an energy generation module, and a data processing module. The splitting module splits a wireless signal received by the antenna module into a first splitting signal and a second splitting signal and transmits the first splitting signal to an energy generation module to convert the first splitting signal into electrical energy stored in an energy storing unit and provided to the data processing module. The energy storing unit provides the electrical energy for the load unit. The data processing module receives one of the second splitting signals, converts it into a control signal, and transmits the control signal to the load unit. The load unit operates according to the control signal.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: Netronix, Inc.
    Inventors: Fang Ming Tsai, You Wei Zhang, Jun Sheng Lin
  • Patent number: 11942467
    Abstract: A semiconductor structure includes a first metal-dielectric-metal layer, a first dielectric layer, a first conductive layer, a second conductive layer, and a second dielectric layer. The first metal-dielectric-metal layer includes a plurality of first fingers, a plurality of second fingers, and a first dielectric material. The first fingers are electrically connected to a first voltage. The second fingers are electrically connected to a second voltage different from the first voltage, and the first fingers and the second fingers are arranged in parallel and staggeredly. The first dielectric material is between the first fingers and the second fingers. The first dielectric layer is over the first metal-dielectric-metal layer. The first conductive layer is over the first dielectric layer. The second conductive layer is over the first conductive layer. The second dielectric layer is between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: I-Sheng Chen, Yi-Jing Li, Chia-Ming Hsu, Wan-Lin Tsai, Clement Hsingjen Wann
  • Patent number: 11940737
    Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
  • Patent number: 11939432
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Publication number: 20240096787
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Ming-Da CHENG, Wei-Hung LIN, Hui-Min HUANG, Chang-Jung HSUEH, Po-Hao TSAI, Yung-Sheng LIN