Patents by Inventor Sheng Bao

Sheng Bao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7968445
    Abstract: A flip chip style semiconductor package has a substrate with a plurality of active devices formed thereon. A contact pad is formed over the substrate. An under bump metallization (UBM) layer is in electrical contact with the contact pad. A passivation layer is formed over the substrate. In one case, the UBM layer is disposed above the passivation layer. Alternatively, the passivation layer is disposed above the UBM layer. A portion of the passivation layer is removed to create a passivation island. The passivation island is centered with respect to the contact pad with its top surface devoid of the UBM layer. A solder bump is formed over the passivation island in electrical contact with the UBM layer. The passivation island forms a void in the solder bump for stress relief. The UBM layer may include a redistribution layer such that the passivation island is offset from the contact pad.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: June 28, 2011
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Xu-Sheng Bao
  • Publication number: 20100105200
    Abstract: A flip chip style semiconductor package has a substrate with a plurality of active devices formed thereon. A contact pad is formed over the substrate. An under bump metallization (UBM) layer is in electrical contact with the contact pad. A passivation layer is formed over the substrate. In one case, the UBM layer is disposed above the passivation layer. Alternatively, the passivation layer is disposed above the UBM layer. A portion of the passivation layer is removed to create a passivation island. The passivation island is centered with respect to the contact pad with its top surface devoid of the UBM layer. A solder bump is formed over the passivation island in electrical contact with the UBM layer. The passivation island forms a void in the solder bump for stress relief. The UBM layer may include a redistribution layer such that the passivation island is offset from the contact pad.
    Type: Application
    Filed: January 4, 2010
    Publication date: April 29, 2010
    Applicant: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Xu-Sheng Bao
  • Patent number: 7667335
    Abstract: A flip chip style semiconductor package has a substrate with a plurality of active devices formed thereon. A contact pad is formed on the substrate. An under bump metallization (UBM) layer is in electrical contact with the contact pad. A passivation layer is formed over the substrate. In one case, the UBM layer is disposed above the passivation layer. Alternatively, the passivation layer is disposed above the UBM layer. A portion of the passivation layer is removed to create a passivation island. The passivation island is centered with respect to the contact pad with its top surface devoid of the UBM layer. A solder bump is formed over the passivation island in electrical contact with the UBM layer. The passivation island forms a void in the solder bump for stress relief. The UBM layer may include a redistribution layer such that the passivation island is offset from the contact pad.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 23, 2010
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Xu Sheng Bao
  • Publication number: 20090202567
    Abstract: The invention provides nine oligonucleotides with sequences of SEQ ID NO: 1-9 or their functional homologues or a composition comprising the same and a method for treating B cell neoplasm by using the oligonucleotides or their functional homologues or the composition comprising the oligonucleotides. The oligonucleotides induce the apoptosis of B cell neoplastic cells, up-regulate CD40 on B cell neoplastic cells and stimulate the production of IL-10 from B cell neoplastic cells.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 13, 2009
    Applicant: Changchun Biotechnology C., Ltd. a corporation
    Inventors: Li-ying Wang, Mu-sheng Bao, Young-li Yu
  • Publication number: 20090162279
    Abstract: The invention provides an oligonucleotide with a sequence of SEQ ID NO: 1 or its functional homolgue, a composition comprising the same and a method for treating B cell neoplasm by using the oligonucleotide or its functional homologue or the composition comprising the oligonucleotide. The oligonulceotide induces the apoptosis of B cell neoplastic cells, up-regulates CD40 on B cell neoplastic cells and stimulates the production of IL-10 from B cell neoplastic cells.
    Type: Application
    Filed: February 13, 2006
    Publication date: June 25, 2009
    Inventors: Li-ying Wang, Mu-sheng Bao, Yong-li Yu
  • Publication number: 20090079070
    Abstract: A flip chip style semiconductor package has a substrate with a plurality of active devices formed thereon. A contact pad is formed on the substrate. An under bump metallization (UBM) layer is in electrical contact with the contact pad. A passivation layer is formed over the substrate. In one case, the UBM layer is disposed above the passivation layer. Alternatively, the passivation layer is disposed above the UBM layer. A portion of the passivation layer is removed to create a passivation island. The passivation island is centered with respect to the contact pad with its top surface devoid of the UBM layer. A solder bump is formed over the passivation island in electrical contact with the UBM layer. The passivation island forms a void in the solder bump for stress relief. The UBM layer may include a redistribution layer such that the passivation island is offset from the contact pad.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 26, 2009
    Applicant: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Xu Sheng Bao