Patents by Inventor Sheng Cheng

Sheng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11607744
    Abstract: This disclosure relates to weldability of steel alloys that provide weld joints which retain hardness values in a heat affected zone adjacent to a fusion zone and which also have improved resistance to liquid metal embrittlement due to the presence of zinc coatings.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 21, 2023
    Assignee: United States Steel Corporation
    Inventors: Daniel James Branagan, Alla V. Sergueeva, Brian E. Meacham, Andrew E. Frerichs, Sheng Cheng, Scott T. Larish, Grant G. Justice, Andrew T. Ball, Craig S. Parsons, Logan J. Tew, Scott T. Anderson, Kurtis R. Clark, Taylor L. Giddens, Tad V. Machrowicz, Jonathan M. Cischke
  • Patent number: 11600709
    Abstract: A memory cell includes a substrate. A first STI and a second STI are embedded within the substrate. The first STI and the second STI extend along a first direction. An active region is disposed on the substrate and between the first STI and the second STI. A control gate is disposed on the substrate and extends along a second direction. The first direction is different from the second direction. A tunneling region is disposed in the active region overlapping the active region. A first trench is embedded within the tunneling region. Two second trenches are respectively embedded within the first STI and the second STI. The control gate fills in the first trench and the second trenches. An electron trapping stack is disposed between the tunneling region and the control gate.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: March 7, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Hao Pan, Chi-Cheng Huang, Kuo-Lung Li, Szu-Ping Wang, Po-Hsuan Chen, Chao-Sheng Cheng
  • Publication number: 20230062055
    Abstract: A method for recycling polyester fabrics with use of an ionic liquid catalyst is provided, which includes: providing a recycled polyester fabric; and using a chemical de-polymerization liquid to chemically de-polymerize the recycled polyester fabric and form a de-polymerization product that includes bis-2-hydroxylethyl terephthalate (BHET). The chemical de-polymerization liquid is used to chemically de-polymerize the recycled polyester fabric in an environment where a de-polymerization catalyst exists, and the de-polymerization catalyst is the ionic liquid catalyst in a solid state.
    Type: Application
    Filed: June 26, 2022
    Publication date: March 2, 2023
    Inventors: TE-CHAO LIAO, JUNG-JEN CHUANG, WEI-SHENG CHENG, ZHANG-JIAN HUANG, Yu-Ti Tseng
  • Publication number: 20230061606
    Abstract: This invention provides an earphone with a low light transmittance and a non-porous sensor cover. Covering the sensing cover on the proximity sensing device can reduce the interference of most of the ambient light and improve measurement accuracy.
    Type: Application
    Filed: October 15, 2021
    Publication date: March 2, 2023
    Inventors: Chih-Wei LIN, Sheng-Cheng LEE, Wen-Sheng LIN, Chen-Hua HSI
  • Publication number: 20230060362
    Abstract: A method for improving hue of recycled bis-2-hydroxylethyl terephthalate by using ionic liquids including providing a recycled polyester fabric; using a chemical de-polymerization liquid to chemically de-polymerize the recycled polyester fabric to form a de-polymerization product; mixing the de-polymerization product with water to form an aqueous phase liquid; dispersing an ionic liquid impurity adsorption material into the aqueous phase liquid to adsorb impurities originally present in the recycled polyester fabric.
    Type: Application
    Filed: June 24, 2022
    Publication date: March 2, 2023
    Inventors: TE-CHAO LIAO, JUNG-JEN CHUANG, WEI-SHENG CHENG, ZHANG-JIAN HUANG, Yu-Ti Tseng
  • Publication number: 20230054600
    Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Sin-Yuan MU, Chia-Sheng CHENG
  • Patent number: 11573886
    Abstract: A device for building a test file comprises a receiving module, for receiving a first request of a first user and for analyzing the first request, and for notifying an analysis result of the first request to the first user; a building module, coupled to the receiving module, for building the test file according to the first request of a task queue; and a transmitting module, coupled to the building module, for notifying a building result of the test file to the first user.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 7, 2023
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Che-Sheng Cheng, Yen-Chen Chuang, Kuo-Hsin Hsu
  • Publication number: 20230029995
    Abstract: The heart rate and blood oxygen monitoring device of the present invention utilizes two ambient light calibration DACs, which can quickly calibrate noise signals generated by ambient light. The heart rate and blood oxygen monitoring device can provide more accurate heart rate and blood oxygen values for optical measurement methods.
    Type: Application
    Filed: September 23, 2021
    Publication date: February 2, 2023
    Inventors: SHENG-CHENG LEE, WEN-SHENG LIN, CHIH-WEI LIN, CHEN-HUA HSI, YUEH-HUNG HOU
  • Patent number: 11560605
    Abstract: This disclosure is related to high yield strength steel where mechanical properties, such as elongation, ultimate tensile strength and yield strength in a sheet are maintained or enhanced via thermal treatment optionally provided during a galvanization coating operation.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: January 24, 2023
    Assignee: United States Steel Corporation
    Inventors: Daniel James Branagan, Andrew E. Frerichs, Brian E. Meacham, Grant G. Justice, Kurtis Clark, Logan J. Tew, Scott T. Anderson, Scott Larish, Sheng Cheng, Alla V Sergueeva
  • Publication number: 20230020275
    Abstract: The present invention provides a proximity sensing device with linear electrical offset calibration, which can record electrical offsets caused by different dark currents under different settings of the pulse count or the pulse time, and the proximity sensing device uses these electrical offsets to obtain the linear electrical offset ratio. Then calculate and infer the electrical offset generated in actual use through the linear electrical offset ratio to calibrate sensing signal.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 19, 2023
    Inventors: WEN-SHENG LIN, SHENG-CHENG LEE, CHIH-WEI LIN, CHEN-HUA HSI, YUEH-HUNG HOU
  • Publication number: 20230019052
    Abstract: Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 19, 2023
    Inventors: Cameron MCKNIGHT-MACNEIL, Abhinandan DIXIT, Ahmad MIZAN, An-Sheng CHENG
  • Publication number: 20230000120
    Abstract: The present invention relates to beverages, in particular to a paste for preparing a beverage. Further aspects of the invention are the use of a paste to prepare a beverage and a process for preparing a paste.
    Type: Application
    Filed: December 1, 2020
    Publication date: January 5, 2023
    Inventors: DEEPAK SAHAI, PU-SHENG CHENG, NATHAN OPET, YING ZHENG
  • Patent number: 11546930
    Abstract: A method and user equipment are provided. The method includes receiving a scheduling of an uplink (UL) signal on a target cell that collides with a UL signal on a source cell, determining a cancellation time for dropping the UL signal on the source cell, and dropping at least a portion of the UL signal on the source cell based on the determined cancellation time.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 3, 2023
    Inventors: Hamid Saber, Jung Hyun Bae, Yuan-Sheng Cheng
  • Patent number: 11538811
    Abstract: A method of manufacturing a dynamic random access memory is provided and includes: forming a hard mask layer on a substrate; forming an opening in the hard mask layer and the substrate; forming a dielectric layer on a sidewall of the opening; forming a first part of a buried word line in a lower part of the opening; forming a hard mask layer on a top surface of the hindering layer, where the hindering layer has overhangs covering top corners of the hard mask layer; depositing a first barrier layer on the substrate through hindrance of the overhangs, where the first barrier layer covers the hindering layer and a top surface of the first part and exposes the dielectric layer on the sidewall of the opening; and forming a first conductive layer in the opening, where a sidewall of the first conductive layer contacts the dielectric layer.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: December 27, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Yi-Sheng Cheng, Chien-Chang Cheng
  • Patent number: 11525864
    Abstract: In a DC impedance measurement routine for a battery the current load from a source is initially set to a low setting. The system waits for a set time in this state for the voltage readings to stabilize. Once the voltage is stable at the low current setting, the current setting is changed to a high value and the voltage is read quickly. Then the current load is set back to the low setting immediately after the reading is made. Several consecutive measurements are performed by repeating the steps above. A DC impedance measurement system that can be used to carry out the measurement routine. A multi-battery system can be monitored via a DC impedance measurement system and the routine being performed on each battery.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: December 13, 2022
    Assignee: PALCELLs Technology, Inc.
    Inventor: Win Sheng Cheng
  • Publication number: 20220386877
    Abstract: The present invention proposes a packaging structure that integrates distance sensing device and temperature sensing device, and it is applied to small wearable devices such as earphones or watches. The combination of distance and temperature sensing allows the wearable device to accurately determine whether it is on the user's body, and then start temperature monitoring. It can collect ear temperature information more effectively and energy-saving.
    Type: Application
    Filed: September 20, 2021
    Publication date: December 8, 2022
    Inventors: WEN-SHENG LIN, SHENG-CHENG LEE, CHIH-WEI LIN, CHEN-HUA HSI, YUEH-HUNG HOU
  • Publication number: 20220391307
    Abstract: A device for building a test file comprises a receiving module, for receiving a first request of a first user and for analyzing the first request, and for notifying an analysis result of the first request to the first user; a building module, coupled to the receiving module, for building the test file according to the first request of a task queue; and a transmitting module, coupled to the building module, for notifying a building result of the test file to the first user.
    Type: Application
    Filed: August 2, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Che-Sheng Cheng, Yen-Chen Chuang, Kuo-Hsin Hsu
  • Patent number: 11508060
    Abstract: A computer aided method for analyzing fibrosis is provided. First, a segmentation algorithm is performed on a medical image to obtain a segmentation image. Circular fibrosis is detected according to the segmentation image to determine a score. In some cases, it is also necessary to determine a number of fibrosis bridges and the condition of fiber expansion.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 22, 2022
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Pau-Choo Chung Chan, Nan-Haw Chow, Hung-Wen Tsai, Kuo-Sheng Cheng, Chun-Cheng Huang
  • Publication number: 20220345173
    Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.
    Type: Application
    Filed: April 27, 2021
    Publication date: October 27, 2022
    Applicant: KaiKuTek Inc.
    Inventors: Mike Chun-Hung WANG, Chun-Hsuan KUO, Mohammad Athar KHALIL, Wen-Sheng CHENG, Chen-Lun LIN, Chin-Wei KUO, Ming Wei KUNG, Khoi Duc LE
  • Patent number: D972714
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: December 13, 2022
    Assignee: HCMed Innovations Co., LTD.
    Inventors: Chia-Chien Chang, Yuan-Ming Hsu, Wen-Yu Tsai, Chieh-Sheng Cheng